• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.11
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• pp.679-685
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• 2014

For the measurements of surface shape milled using FIB (focused ion beam), the silicon bulk, $Si_3N_4/Si$, and Al/Si samples are used and observed the shapes milled from different sputtering rates, incident angles of $Ga^+$ ions bombardment, beam current, and target material. These conditions also can be influenced the sputtering rate, raster image, and milled shape. The fundamental ion-solid interactions of FIB milling are discussed and explained using TRIM programs (SRIM, TC, and T-dyn). The damaged layers caused by bombarding of $Ga^+$ ions were observed on the surface of target materials. The simulated results were shown a little bit deviation with the experimental data due to relatively small sputtering rate on the sample surface. The simulation results showed about 10.6% tolerance from the measured data at 200 pA. On the other hand, the improved analytical model of damaged layer was matched well with experimental XTEM (cross-sectional transmission electron microscopy) data.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.147-151
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• 1999

YBCO step-edge Josephson junction were fabricated on sapphire substrates. The steps were formed on R-plane sapphire substrates by using Ar ion milling with PR masks. The step angle was controlled in the wide range from 25$^{\circ}$ to 50$^{\circ}$ by adjusting both the Ar ion incident angle and the photoresist mask rotation angle relative to the incident Ar ion beam. CeO$_2$ buffer layer and in-situ YBa$_2Cu_3O_{7-{\delta}}$ (YBCO) thin films was deposited on the stepped R-plane sapphire substrates by pulsed laser deposition method. The YBCO film thickness was varied to obtain the ratio of film thickness to step height in the range from 0.5 to 1. The step edge junction exhibited RSJ-like behaviors with I$_cR_n$ product of 100 ${\sim}$ 300 ${\mu}$V, critical current density of 10$^3$ ${\sim}$ 10$^5$ A/ cm$^2$ at 77 K.

• Progress in Superconductivity
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• v.10 no.2
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• pp.74-78
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• 2009

Inter-grain nanobridges of the $MgB_2$ superconductor have been fabricated by focused-ion-beam(FIB) and their electrical transport properties were studied. The $MgB_2$ film was prepatterned into microbridges by a standard argon ion milling technique and then FIB-patterned into 100 nm$\times$100 nm bridges. Current-voltage characteristics showed a strong flux-flow type behavior at all temperatures with a trait of Josephson coupling near $T_c$. At low temperatures, the curves showed a two-step resistance-doubled transition with occasional hysteresis. The resistance-doubling transition is believed to be due to a two-channel flux-flow effect. The temperature-dependent critical current data showed $I_c(T){\propto}(1-T/T_c)^2$ near $T_c$, same as a normal barrier junction, and $I_c(T){\propto}(1-T/T_c)^{1.2}$ at low temperatures, similar to that of a film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.340-341
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• 2005

Lithium titanium oxide as anode material for energy storage prepared by novel synthesis method. $Li_4Ti_5O_{12}$ based spinel-framework structures are of great interest material for lithium-ion batteries. We describe here $Li_4Ti_5O_{12}$ a zero-strain insertion material was prepared by novel sol-gel method and by high energy ball milling (HEBM) of precursor to from nanocrystalline phases. According to the X-ray diffraction and scanning electron microscopy analysis, uniformly distributed $Li_4Ti_5O_{12}$ particles with grain sizes of 100nm were synthesized. Lithium cells, consisting of $Li_4Ti_5O_{12}$ anode and lithium cathode showed the 173 mAh/g in the range of 1.0 $\sim$ 3.0 V. Furthermore, the crystalline structure of $Li_4Ti_5O_{12}$ didn't transfer during the lithium intercalation and deintercalation process.

• Progress in Superconductivity and Cryogenics
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• v.8 no.1
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• pp.9-14
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• 2006

Sample preparation plays a critical role in microstructure analysis using TEM. Although TEM specimen has been usually prepared by jet-polishing or Ar-ion beam milling technique. these methods could not be applied to YBCO CC which is composed of IBAD or RABiTS substrates, several buffet layers, and YBCO superconducting layer because of big difference in mechanical strengths between the metallic phase and oxide phases. To obtain useful cross-sectional information such as interface between the phases or second phases in YBCO CC, it is prerequisite to secure the large area of thin section in the cross-sectional direction. The superconducting layer or the buffer layers are relatively weak and fragile compared to the metallic substrate such as Ni-5wt%W RABiTS of Hastelloy-based IBAD, and preferential removal of weak ceramic phases during polishing steps makes specimen preparation almost impossible. Tripod polisher and small jig were home-made and employed to sample preparation. The polishing angle was maintained <$1^{\circ}$ throughout the polishing steps using 2 micrometers attached to the tripod plate. TEM specimens with large and thin area could be secured and used for RABiTS/IBAD substrate analyses. In some cases, additional Ar-beam ion milling with low beam current and impinging angle was used for less than 30 sec. to remove debris or polishing media attacked to the specimens.

• Clean Technology
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• v.24 no.4
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• pp.332-338
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• 2018

Currently graphite is used as an anode active material for lithium ion battery. However, since the maximum theoretical capacity of graphite is limited to $372mA\;h\;g^{-1}$, a new anode active material is required for the development of next generation high capacity and high energy density lithium ion battery. The maximum theoretical capacity of Si is $4200mA\;h\;g^{-1}$, which is about 10 times higher than the maximum theoretical capacity of graphite. However, since the volume expansion rate is almost 400%, the irreversible capacity increases as the cycle progresses and the discharge capacity relative to the charge is remarkably reduced. In order to solve these problems, it is possible to control the particle size of the Si anode active material to reduce the mechanical stress and the volume change of the reaction phase, thereby improving the cycle characteristics. Therefore, in order to minimize the decrease of the charge / discharge capacity according to the volume expansion rate of the Si particles, the improvement of the cycle characteristics was carried out by pulverizing Si by a dry method with excellent processing time and cost. In this paper, Si is controlled to nano size using vibrating mill and the physicochemical and electrochemical characteristics of the material are measured according to experimental variables.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.234-234
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• 2012

Saddle field ion source는 구조가 간단하고 영구자석을 사용하지 않아 소형화에 유리하고 구조가 간단한 DC 파워서플라이를 이용하기 때문에 장치 가격이 저렴하여 다양한 분야에서 응용되고 있으며 특히 이온빔 밀링 분야에 많이 사용된다. 초기 saddle field ion source 는 대칭형의 구형이었으나 지속적인 연구 개발로 와이어형, 원판형, 원통형 등 다양한 형태의 saddle field ion source가 개발되었다. 본 연구에서는 비교적 제작이 용이하고, 구조적으로 외부간섭에 대하여 덜 민감한 원통형 saddle field ion source를 제작하였다. 초기 saddle field ion source는 이온원 내부에 saddle field를 형성하기 위하여 대칭 구조를 가지 형태로 제작되었으나, 비대칭 구조에서도 saddle field가 형성될 수 있고 비대칭 구조를 채택할 경우 한쪽으로 더 많은 이온빔을 인출할 수 있기 때문에 실제 응용면에서는 비대칭 구조가 더 유리하다. 따라서 본 연구에서는 원통형 비대칭 saddle field ion source를 제작하였으며, 제작된 이온소스는 높이가 62 mm 지름이 55 mm의 소형 이온소스였다. 제작된 원통형 saddle field ion source는 진공도와 가속전압에 따라 방전 모드 변화하였다. Saddle field ion source는 전극과 extractor의 구조에 따라 조금씩 다르지만 대체로 5x10-5 Torr ~ 5x10-4 Torr 영역에서 안정적으로 작동하였다. 이온소스 내부의 압력이 높을 경우 수십 mA 의 방전 전류가 흐르는 고전류 방전 모드로 작동하였으며 압력이 낮을 경우에는 동일한 전압에서 수 mA 의 방전 전류만 흐르는 저전류 방전 모드로 작동하였다. 압력이 더 높아질 경우 아크 방전이 발생하여 이온소스의 작동이 불안정하여 연속적인 작동이 어려웠다. 고전류 방전 모드에서는 이온빔 전류가 Child-Langmuir 방정식에 따라 Vi3/2에 비례하여 증가하는 경향을 보여주었으며 저전류 방전 모드에서는 Vi에 선형적으로 증가하였다. 가속 전압이 동일한 경우 고전류 방전 모드가 저전류 방전 모드에 비하여 더 많은 이온빔 인출이 가능하지만, 고전류 방전 모드의 경우 이온의 방출 각도가 매우 넓은 반면 저전류 방전 모드에서는 이온빔의 퍼짐이 현저히 줄어듦을 관찰할 수 있었다. 원통형 saddle field ion source는 내부 구조가 간단하기 때문에 내부 전극의 구조 변화에 따라 방전 특성 및 이온빔 인출 특성이 심하게 변동하였다. Saddle field ion source에서는 Anode에 인가되는 방전 전압이 가속 전압과 같은 역할을 하는데 가속 전압은 2~10 kV 사이에서 인가가 가능하였다. 일반적으로 동일한 방전 모드에서 진공도가 높아질수록 방전 전류의 양과 인출되는 이온의 양이 증가하는 것이 관찰되었다. 제작된 이온소스는 최적 조건에서 5 mm 인출구를 통하여 0.7 mA의 이온빔 인출이 가능하였으며, 9 mm 인출구를 사용한 경우 1 mA까지 이온빔 인출이 가능하였다.

• Applied Chemistry for Engineering
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• v.29 no.1
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• pp.43-48
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• 2018

In this study, we performed various extraction condition experiments such as types and concentrations of extractants, amounts of extraction sources, pretreatment processes, to optimize the calcium ion extraction for precipitated calcium carbonate (PCC) production. CaO was used as a calcium extraction source, The extraction amount of calcium ions and the particle size of CaO were determined by ICP and SEM results. As a result, 100% calcium ion was extracted when 2 M hydrochloric acid was used as an extractant, and the optimum amount of the extraction source was 6 g. On the other hand, it was confirmed that the reaction time, reaction temperature, particle milling and heat treatment process had no significant effect on the calcium ion extraction amount.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.408-408
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• 2012

It is well known that magnetic random access memory (MRAM) is nonvolatile memory devices using ferromagnetic materials. MRAM has the merits such as fast access time, unlimited read/write endurance and nonvolatility. Although DRAM has many advantages containing high storage density, fast access time and low power consumption, it becomes volatile when the power is turned off. Owing to the attractive advantages of MRAM, MRAM is being spotlighted as an alternative device in the future. MRAM consists of magnetic tunnel junction (MTJ) stack and complementary metal- oxide semiconductor (CMOS). MTJ stacks are composed of various magnetic materials. FePt thin films are used as a pinned layer of MTJ stack. Up to date, an inductively coupled plasma reactive ion etching (ICPRIE) method of MTJ stacks showed better results in terms of etch rate and etch profile than any other methods such as ion milling, chemical assisted ion etching (CAIE), reactive ion etching (RIE). In order to improve etch profiles without redepositon, a better etching process of MTJ stack needs to be developed by using different etch gases and etch parameters. In this research, influences of $O_2$ gas on the etching characteristics of FePt thin films were investigated. FePt thin films were etched using ICPRIE in $CH_4/O_2/Ar$ gas mix. The etch rate and the etch selectivity were investigated in various $O_2$ concentrations. The etch profiles were studied in varying etch parameters such as coil rf power, dc-bias voltage, and gas pressure. TiN was employed as a hard mask. For observation etch profiles, field emission scanning electron microscopy (FESEM) was used.

• Bulletin of the Korean Chemical Society
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• v.32 no.5
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• pp.1491-1494
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• 2011

Lithium vanadium phosphate, $Li_3V_2(PO_4)_3$ was prepared by a simple solid state route. It was found that making a fine powder of $Li_3V_2(PO_4)_3$ by the mechanical milling is very effective for increasing the insertion/extraction of lithium from $Li_3V_2(PO_4)_3$ structure. In charge/discharge test, the ball-milled $Li_3V_2(PO_4)_3$ sample exhibited a higher initial discharge capacity of 174 mAh/g in the voltage range of 3.0-4.8 V, compared with pure $Li_3V_2(PO_4)_3$ sample (152 mAh/g). Furthermore, the ball-milled $Li_3V_2(PO_4)_3$ presented not only higher cycle retention rate after 50 cycles, but also better rate capability compared with pure sample in the whole region (0.1-7 C).