• Title/Summary/Keyword: Ion beam voltage

Search Result 155, Processing Time 0.04 seconds

Application Technologies of Pulsed Power with the High Voltage and Current (고전압.대전류 pulsed power의 이용기술)

  • Lee, Hyeong-Ho;Kim, Young-Bae
    • Proceedings of the KIEE Conference
    • /
    • 1997.07e
    • /
    • pp.1678-1680
    • /
    • 1997
  • The pulsed power with the high voltage and current can be used to the fields of high speed pulses of energy in different forms such as electric current and voltage, electron beam, ion beam, x-rays, gamma rays, heat, magnetics fields, sound and shock waves. This paper is directed mainly at electrical engineers working on production and practical application of high speed pulsed power with high voltage and current.

  • PDF

Development of Inductively Coupled Plasma Gas Ion Source for Focused Ion Beam (유도결합형 플라즈마 소스를 이용한 집속 이온빔용 가스 이온원 개발)

  • Lee, Seung-Hun;Kim, Do-Geun;Kang, Jae-Wook;Kim, Tae-Gon;Min, Byung-Kwon;Kim, Jong-Kuk
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.28 no.1
    • /
    • pp.19-23
    • /
    • 2011
  • Recently, focused ion beam (FIB) applications have been investigated for the modification of VLSI circuit, the MEMS processing, and the localized ion doping, A multi aperture FIB system has been introduced as the demands of FIB applications for high speed and large area processing increase. A liquid metal ion source has problems, a large angular divergence and a metal contamination into a substrate. In this study, a gas ion source was introduced to replace a liquid metal ion source. The gas ion source generated inductively coupled plasma (ICP) in a quartz tube (diameter: 45 mm). Ar gas fed into the quartz was ionized by a 2 turned radio frequency antenna. The Ar ions were extracted by 2 extraction grids. The maximum extraction voltage was 10 kV. A numerical simulation was used to optimize the design of extraction grids and to predict an ion trajectory. As a result, the maximum ion current density was 38 $mA/cm^2$ and the spread of ion energy was 1.6 % for the extraction voltage.

Characteristics of electric field in the liquid metal ion source with a suppressor

  • Min, Boo-Ki;Cho, Byeong-Seong;Oh, Hyun-Joo;Kang, Seung-Oun;Choi, Eun-Ha
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2010.08a
    • /
    • pp.283-283
    • /
    • 2010
  • The liquid metal ion sources(LMIS) in FIB system have many advantages of high current density, high brightness and low ion energy spread. Most FIB systems use LMIS because the ion beam spot size of LMIS is smaller than other ion sources. LMIS is basically emitted by an extractor but the new electrode called the suppressor is able to control the emission current. We investigated characteristics LMIS with a suppressor, the function of the suppressor in LMIS, the change of the electric field by the suppressor and the advantages of using the suppressor. The characteristics of the threshold voltage and current-voltage (I-V) were observed under the varying extracting voltage with floated suppressor voltage, and under the varying suppressor voltages with fixed extractor voltage. We also simulated LMIS with the suppressor through CST(Computer Simulation Technology). The emission current increases as the suppressor voltage decreases because the suppressor voltage which restrains the electric field goes down, The threshold voltage increases as the suppressor voltage increases. We can explain characteristics and functions of LMIS with a suppressor using the electric field.

  • PDF

Characterization of X-ray Emitted in the Ion Implantation Process of Semiconductor Operations (반도체 제조 이온주입 공정의 이온 임플란타 장치에서 엑스레이 발생 특성)

  • Dong-Uk Park;Kyung Ehi Zoh;Soyeon Kim;Seunghee Lee;Eun Kyo Jeong
    • Journal of Korean Society of Occupational and Environmental Hygiene
    • /
    • v.33 no.4
    • /
    • pp.439-446
    • /
    • 2023
  • Objectives: The aims of this study are to investigate how X-rays are emitted to surrounding parts during the ion implantation process, to analyze these emissions in relation to the properties of the ion implanter equipment, and to estimate the resulting exposure dose. Eight ion implanters equipped with high-voltage electrical systems were selected for this study. Methods: We monitored X-ray emissions at three locations outside of the ion implanters: the accelerator equipped with a high-voltage energy generator, the impurity ion source, and the beam line. We used a Personal Portable Dose Rate and Survey Meter to monitor real-time X-ray levels. The SX-2R probe, an X-ray Features probe designed for use with the RadiagemTM meter, was also utilized to monitor lower ranges of X-ray emissions. The counts per second (CPS) measured by the meter were estimated and then converted to a radiation dose (𝜇Sv/hr) based on a validated calibration graph between CPS and μGy/hr. Results: X-rays from seven ion implanters were consistently detected in high-voltage accelerator gaps, regardless of their proximity. X-rays specifically emanated from three ion implanters situated in the ion box gap and were also found in the beam lines of two ion implanters. The intensity of these X-rays did not show a clear pattern relative to the devices' age and electric properties, and notably, it decreased as the distance from the device increased. Conclusions: In conclusion, every gap, in which three components of the ion implanter devices were divided, was found to be insufficiently shielded against X-ray emissions, even though the exposure levels were not estimated to be higher than the threshold.

Fabrication of interface-controlled Josephson Junctions by Ion beam damage

  • 김상협;김준호;성건용
    • Progress in Superconductivity
    • /
    • v.3 no.2
    • /
    • pp.168-171
    • /
    • 2002
  • We have demonstrated ramp-edge Josephson junctions using high temperature superconductors without depositing artificial barriers. We fabricated a surface barrier formed naturally during an ion beam etching process and the annealing under the oxygen atmosphere. The experimental results imply that the barrier natures such as the resistivity are varied by the annealing conditions and the ion milling conditions including the beam voltages. Thus, the ann eating and etching conditions should be optimized to obtain excellent junction properties. In optimizing the fabricating factors, the interface-controlled junctions showed resistively shunted junctions like current-voltage characteristics and an excellent uniformity. These junctions exhibited a spread ($1\sigma$) of $I_{c}$ is 10% fur chips containing 7 junctions at 50K.K.

  • PDF

Design of Self-ion assisted beam source (SIAB) based on electron focusing with concentric symmetrical electric field and Cu thin film growth by SIAB (동심원형 대칭 전기장 집속 방식을 응용한 자가 이온 보조 소스 제작 및 Cu 박막 증착)

  • 송재훈;김기환;이충만;최성창;송종한;정형진;최원국
    • Journal of the Korean Vacuum Society
    • /
    • v.8 no.2
    • /
    • pp.121-126
    • /
    • 1999
  • Cu thin film was deposited by a self-ion assisted beam source (SIAB) and the assessment of the Cu films was given. Some characteristics of the source and the experimental procedure are described at various conditions such as total power, ionization efficiency, and ion current vs. deposition rate. The dependence of crystalline structure, impurity concentration, and resistivity of the Cu films deposited by SIAB on acceleration voltage are discussed.

  • PDF

Room Temperature Luminescence from ion Beam or Atmospheric Pressure Plasma Treated SrTiO3

  • Song, Jin-Ho;Seok, Jae-Gwon;Yeo, Chang-Su;Lee, Gwan-Ho;Song, Jong-Han;Sin, Sang-Won;Choe, Jin-Mun;Jo, Man-Ho
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.530-531
    • /
    • 2013
  • 3 MeV protonirradiated SrTiO3 (STO) single crystal exhibits a blue and green mixed luminescence. However, the same proton irradiated STO deposited with very thin Pt layer does not show any luminescence. This Pt layer involved in preventing the damage caused by arcingthat comes from tens of kV surface voltage build-up due to secondary electron induced charge up at the surface of insulator during ion beam irradiation. It implies that luminescence of ion irradiated STO originated from the modified STO surface layer caused by arcing rather than direct ion beam irradiation effect. Atmospheric pressure plasma, a simple and cost-effective method, treated STO also exhibits the same kind of blue and green mixed luminescence as the ion beam treated STO, because this plasma also creates a surface damage layer by arcing.

  • PDF

Fundamental characteristics of non-mass separated ion beam deposition with RE sputter-type ion source (고주파 스퍼터타입 이온소스를 이용한 비질량분리형 이온빔증착법에 관한 특성연구)

  • ;Minoru Isshiki
    • Journal of the Korean Vacuum Society
    • /
    • v.12 no.2
    • /
    • pp.136-143
    • /
    • 2003
  • In this paper, high purity RF sputter-type ion source for non-mass separated ion beam deposition was evaluated. The fundamental characteristics of the ion source which is composed of an RF Cu coil and a high purity Cu target (99.9999 %) was studied, and the practical application of Cu thin films for ULSI metallization was discussed. The relationship between the DC target current and the DC target voltage at various RF power and Ar gas pressures was measured, and then preparation conditions for Cu thin films was described. As a result, it was found that the deposition conditions of the target voltage, the target current and the Ar pressure were optimized at -300 V, 240 W and 9 Pa, respectively. The resistivity of Cu films deposited at a bias voltage of -50 V showed a minimum value of 1.8 $\pm$ 0.1 $mu\Omega$cm, which is close to that of Cu bulk (1.67 $mu\Omega$cm).

A HIGH VOLTAGE DC POWER SUPPLY SUITABLE FOR AN ION SOURCE

  • Nho, Eui-Cheol;Kim, In-Dong
    • Proceedings of the KIPE Conference
    • /
    • 1998.10a
    • /
    • pp.436-441
    • /
    • 1998
  • This paper proposes an novel dc power supply using modified multilevel ac/dc converter. The output voltage of the power supply can be disconnected from and reapplied to the load rapidly. Therefore the power supply is suitable for a load having frequent short circuit such as ion source. The proposed scheme improves the performance, efficiency, and reliability and reduces the cost of the conventional power supply system for an ion beam acceleration.

  • PDF

The Ohmic Contact of n-GaAs Using by Liquid Metal Ion Source (액체금속이온원을 이용한 n형 GaAs의 오옴성 접촉)

  • 강태원;이정주;김송강;홍치유;임재영;강승언
    • Journal of the Korean Institute of Telematics and Electronics
    • /
    • v.26 no.12
    • /
    • pp.1995-2000
    • /
    • 1989
  • The ion beam system of 20keV C-W (Cockroft Walton) type composed of the AuGe alloy LMIS(Liquid Metal Ion Source) has been designed and constructed. For the fabrication of the ohmic contact to the n-GaAs, the ion beam extracted from the AuGe alloy source was implanted into the n-GaAs, and it was measured by contact resistivity. The stable AuGe ion beam(2.5\ulcorner/cm\ulcorner was obtained at the extraction voltage of 14.5kV. The measurements of the contact resistivity were done by the TLM (Transmission Line Model) method and the specific contact resistivity was found to be 2.4x10**-5 \ulcornercm\ulcornerfor the implanted sample by the 1.9x10**20/cm**3 and the annealed sample at 30\ulcorner for 2 min.

  • PDF