• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.1605-1608
• /
• 2006

The contrast ratio, brightness, and uniformity of S-IPS panel, whose alignment process was employed by ion-beam-alignment (IBA) technology, were improved significantly compared with the convention rubbing's panel, because the light leakage has been reduced in dark state effectively. The IBA technology could generate a panel whose pretilt angle was stable and low after post-treatment process.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.1
• /
• pp.53-59
• /
• 2001

Surfaces of PTFE and PVDF were modified by ion-assisted reaction (IAR) in which 1 keV $Ar^{+}$ ions were irradiated on the surface of the polymer with varying ion dose in an oxygen gas environment, and Cu, Pt, Al and Ag thin films were deposited on the modified polymers. Wettability of the modified polymers was largely improved by the formation of hydrophilic groups due to chemical reaction between polymer surface and the oxygen gas during IAR. The change in wettability in the modified polymers was also related to the change in surface morphology and roughness. Adhesion between metal films and polymers modified by IAR was significantly improved, so that no detachment was possible in the $Scotch^{TM}$ tape test. The increase of adhesion strength between the metal film and the modified PVDF was mainly attributed to the formation of hydrophilic groups, which interacted with the metal film. In the case of the modified PTFE, the enhanced adhesion to metal film could be explained by the change in surface morphology together with the formation of hydrophilic groups. The electrical properties of the metal films on the modified polymers were also investigated.

• Journal of the Korean Vacuum Society
• /
• v.15 no.1
• /
• pp.97-102
• /
• 2006

Anodic alumina with self-organized and ordered nano hole arrays can be a good candidate of an irradiation mask to modify the properties of nano-scale region. In order to try using porous anodic alumina as a mask for ion-beam patterning, ion beam transmittance of anodic alumina was tested. 4 Um thick self-standing AAO templates anodized from Al bulk foil with two different aspect ratio, 200:1 and 100:1, were aligned about incident ion beam with finely controllable goniometer. At the best alignment, the transmittance of the AAO with aspect ratio of 200:1 and 100:1 were $10^{-8}\;and\;10^{-4}$, respectively. However transmittance of the thin film AAO with low aspect ratio, 5:1, were remarkably improved to 0.67. The ion beam transmittance of self-standing porous alumina with a thickness larger than $4{\mu}m$ is extremely low owing to high aspect ratio of nano hole and charging effect, even at a precise beam alignment to the direction of nano hole. $SiO_2$ nano dot array was formed by ion irradiation into thin film AAO on $SiO_2$ film. This was confirmed by scanning electron microscopy that the $SiO_2$ nano dot array is similar to AAO hole array.

• Design & Manufacturing
• /
• v.14 no.2
• /
• pp.56-61
• /
• 2020

Recently, research for machining next-generation micro semiconductor processes and micro patterns has been actively conducted. In particular, it is applied to various industrial fields depending on the machining method in the case of FIB (Focused ion beam) milling. In this study, intends to deal with FIB milling machining technology for ultra-precision diamond tool fabrication technology. Ultra-precision diamond tools require nano-scale precision, and FIB milling is a useful method for nano-scale precision machining. However, FIB milling has a problem of Gaussian characteristics that are differently formed according to the beam current due to the input of an ion beam source, and there are process conditions to be considered, such as a side clearance angle problem of a diamond tool that is differently formed according to the tilting angle. A series of process steps for fabrication a ultra-precision diamond tool were studied and analyzed for each process. It was confirmed that the effect on the fabrication process was large depending on the spot size of the beam and the current of the beam as a result of the experimental analysis.

• Journal of the Korean Ceramic Society
• /
• v.35 no.8
• /
• pp.795-800
• /
• 1998

• Applied Microscopy
• /
• v.47 no.2
• /
• pp.77-83
• /
• 2017

Drastic development of ubiquitous devices requires more advanced batteries with high specific capacitance and high rate capability. Large-area microstructure characterization across the stacks of cathode, electrolyte and anode might reveal the origin of the instability or degradation of batteries upon cycling charge. In this study, sample preparation methods to observe the cross-section view of the electrodes for battery in SEM and several imaging tips are reviewed. For an accurate evaluation of the microstructure, ion milling which flats the surface uniformly is recommended. Pros and cons of cross-section polishing (CP) with Ar ion and focused ion beam (FIB) with Ga ion were compared. Additionally, a modified but new cross-section milling technique utilizing precision ion polishing system (PIPS) which can be an alternative method of CP is developed. This simple approach will make the researchers have more chances to prepare decent large-area cross-section electrode for batteries.

• Korean Journal of Materials Research
• /
• v.9 no.5
• /
• pp.446-451
• /
• 1999

Surface of Polymethylmethacrylate (PMMA) was modified by ion assisted reaction in which ion beam of Ar or$ O_2$is irradiated on polymer in reaction gas environment. Ion beam energy was changed from 600 to 1000eV, and ion doses were varied from $5\times10^{14} ions/cm^2 to 1\times10^{17} ions/cm^2$. Contact angle and surface energy of modified PMMA were measured by contact angle micrometer using distilled water and formamide. In the case of $Ar^+$ ion irradiation only, the contact angle reduced from $68^{\circ} to $35^{\circ}$ and the surface energy was changed from 46 dyne/cm to 60 dyne/cm. The contact angle significantly decreased to $14^{\circ}$and the surface energy increased to 72 dyne/cm when the surface of PMMA was modified by oxygen ion irradiation in oxygen gas environment. Improvement of wettability results from the formation of new hydrophilic group which is identified as C-O chain by XPS analysis. Recovery of wettability in dry air and maintenance of it in water condition were explained in view of the formation of hydrophilic group.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2004.04a
• /
• pp.504-507
• /
• 2004

Previous studies on the liquid Gallium ion sources used an electro-chemically etched tungsten wire with a coil-type heater. Such a structure requires excessive power consumption in the course of heating the liquid metal. In this work, a new structure is proposed that replaces the coil-type heater. It uses a Gallium reservoir made of six pre-etched 250 $\mu\textrm{m}$ tungsten wires that surround the needle electrode. Gallium loading at the reservoir is observed to be much more stable, resulting in an improved beam stability.

• Proceedings of the IEEK Conference
• /
• 2000.11b
• /
• pp.17-20
• /
• 2000

We have enhanced the yield of 0.25 ${\mu}{\textrm}{m}$ T-gate $Al_{0.25}$G $a_{0.75}$As/I $n_{0.2}$G $a_{0.8}$As P-HEMT using three-layer E-beam lithography process and selective etching process. The three-layer resist structure (PMMA/copolymer/ PMMA=2000 $\AA$/3000 $\AA$/2000 $\AA$) and three developers (Benzene：IPA=1：1,Methanol：IPA =1：1,MIBK：IPA=1：3) were used for fabrication of a wide-head T-gate by the conventional double E-beam exposure technology. Also 1 wt% citric acid： $H_2O$$_2$：N $H_{4}$OH(200m1：4ml：2.2ml) solution were used for uniform gate recess. The etching selectivity of GaAs over $Al_{0.25}$G $a_{0.75}$As is measured to be 80. So these P-HEMT processes can be used in X-band MMIC LNA fabrication.ion.ion.ion.

• Vacuum Magazine
• /
• v.2 no.2
• /
• pp.17-23
• /
• 2015

Medium Energy Ion Scattering (MEIS) has been successfully used for ultrathin film analysis such as gate oxides and multilayers due to its single atomic depth resolution in compostional and structural depth profiling. Recently, we developed a time-of-flight (TOF) MEIS for the first time, which can analyze a $10{\mu}m$ small spot. Small spot analysis would be useful for test pattern analysis in semiconductor industry and various thin film technology. The ion beam damage problem is minimized due to its improved collection efficiency by orders of magnitude and the ion beam neutralization problem is removed completely for quantitative analysis. Newly developed TOF-MEIS has been applied for gate oxides, ultra shallow junctions, nanoparticles, FINFET structures to provide compositional and structural profiles. Further development for submicron spot analysis and applications for functional nano thin films and nanostructured materials are expected for various nanotechnology and biotehnology.