• 한국광학회:학술대회논문집
• /
• 한국광학회 2006년도 동계학술발표회 논문집
• /
• pp.165-166
• /
• 2006

• 전자공학회논문지D
• /
• 제35D권7호
• /
• pp.102-108
• /
• 1998

A new 1*4 optical waveguide power divider is proposed and fabricated. It consists of a 1*4 multi-branch structure with a beam separator and two beam expanders that can control the splitting ratios between the output ports. The proposed optical waveguide power divider is designed by employing the two dimensional finite difference beam propagation method and is fabricated by a reactive ion etching method. The splitting ratio of fabricatd device is 25.0 : 25.7 : 25.3 : 24.0 for TE mode and 25.7 : 25.2 : 24.1 : 25.0 for TM mode. Comapred with the conventional Y-branch structure, the proposed structure shortens the length of a 1*N divider by the factor 3. Thus it reduces the total propagation loss and the total radiation loss at the branch points. furthermore, the splitting ratios between the output ports may be controlled in this structure for some special applications.

• 한국광학회지
• /
• 제15권4호
• /
• pp.309-312
• /
• 2004

레이저 홀로그래피 방법과 반응성 이온식각 방법(RIE: reactive ion etching)을 사용하여 2차원 광자결정을 제작하였다. 육변형(hexagonal) 및 사변형(square) 광자결정 격자는 첫 번째 레이저 노광 후 시편을 각각 60도 및 90도 회전하고 다시 두 번째 노광을 통하여 제작할 수 있었다. 또한 사변형 광자결정 격자의 나노컬럼(nanocolumn)의 크기와 주기는 레이저 입사각에 따라 각각 125∼145 nm, 220∼290 nm로 미세한 조정이 가능하였다. 마지막으로 CH$_4$/H$_2$ 가스를 이용한 반응성 이온식각 방법을 통하여 aspect ratio가 1.5 이상인 InP/InGaAsP nanocolumn을 제작 할 수 있었다.

• 한국표면공학회지
• /
• 제29권5호
• /
• pp.415-423
• /
• 1996

Thin film technologies for fabricating SQUIDs involve etching and deposition procedures with the proper substrate materials and $YBa_2Cu_3O_{7-d}$ (YBCO) as the high $T_c$ superconductor. YBCO were prepared on various substrates of MgO, $SrTiO_3$, and $LaAlO_3$ by using off-axis magnetron sputtering methods and annealing in-situ. The parameters of film fabrication processes had been optimized to yield good quality films in terms of the critical temperature $T_c$ and the critical current density $J_c$. The optimized processes yielded $T_C$>90K along with $J_c$>$10_6A$$extrm{cm}^2$ at 77K and>$2\times10_7A/Cm^2$ at 5K. We fabricated step-edge type dc-SQUIDs and directly coupled magnetometers, producing step edges on MgO(100) substrates by etching with Ar-ion beam, depositing YBCO material on them, then patterning them by using ion-milling technique. Circuitizing washer-shape SQUIDs to possess a pair of step-edge junctions of 2-5$\mu$ line width with a high angle>$50^{\circ}C$ , we examined their I-V characteristics thoroughly and Shapiro steps clearly as we irradiate microwaves of 8-20 GHz frequency.

• 공업화학
• /
• 제16권6호
• /
• pp.853-856
• /
• 2005

자성 메모리반도체의 핵심 소자인 magnetic tunnel junction (MTJ) stack에 대한 고밀도 유도결합 플라즈마 반응성 식각이 연구되었다. MTJ stack은 electron(e)-beam lithography 공정을 사용하여 나노미터 크기의 패턴 형성이 되었으며 식각을 위한 하드 마스크(hard mask)로서 TiN 박막이 이용되었다. TiN 박막은 Ar, $Cl_2/Ar$, 그리고 $SF_6/Ar$들의 가스를 사용하여 식각공정이 연구되었다. E-beam lithography로 패턴된 TiN/MTJ stack은 첫 번째 단계로 TiN 하드 마스크가 식각되고 두 번째로 MTJ stack이 식각되어 완성되었다. MTJ stack은 Ar, $Cl_2/Ar$, $BCl_3/Ar$을 이용하여 식각되었으며 각각의 가스농도와 가스 압력을 변화시켜 MTJ stack의 식각특성이 조사되었다.

• 한국진공학회지
• /
• 제7권s1호
• /
• pp.156-158
• /
• 1998

This paper describes the preparation of boron-doped polycrystalline diamond thin film whose electrical resitivity is lower than $10^{-1}\Omega$cm. The 1$\times$1$\textrm{mm}^2$ microelectrodes, its conducting line with 0.2mm wide and 0.5$\times$0.5$\textrm{mm}^2$ pads was patterned by reactive ion beam etching. A glucose microsensor based on diamond film microelectrode and pyramidal containment produced on silicon by anisotropic etching was developed. Its advantages are high sensitivity and high stability.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 추계학술대회 논문집
• /
• pp.318-321
• /
• 2005

FIB (Focused ion Beam) milling on a 500-nm-thick silicon nitride membrane was studied in order to fabricate a high-resolution shadow mask, or called a nanostencil. The silicon nitride membrane was fabricated by MEMS processes of LPCVD, photolithography, ICP etching and bulk silicon etching. The apertures made by FIB milling and normal photolithography were compared. The square metal pattern deposited through FIB milled shadow mask showed 6 times smaller comer radius than the case of photolithography. The results show high resolution patterning could be achieved by local deposition through FIB milled shadow-mask.

• 센서학회지
• /
• 제30권5호
• /
• pp.273-278
• /
• 2021

Here, we studied the change in the mechanical stiffness of a diaphragm according to the corrugation pattern. The diaphragm consists of a silicon oxide and nitride double layer; a corrugation pattern was formed by dry etching, and the diaphragm was released by wet etching. The fabrication of the thin film was verified using focused ion beam and scanning electron microscopy images. The mechanical stiffness of the diaphragm was obtained by measuring the surface vibration using a laser Doppler vibrometer while applying external sound pressure. Flat squares, diaphragms with square corrugations, and circular corrugation patterns were measured and compared. The stiffness of the diaphragm with a corrugation structure was found to be smaller than that without a corrugation structure; in particular, circular corrugation showed a better effect because of the high symmetry. Furthermore, the effect of corrugation was theoretically predicted. The proposed corrugated diaphragm showed comparable flexibility with the state-of-the-art MEMS microphone diaphragm.

• 한국광학회:학술대회논문집
• /
• 한국광학회 2009년도 동계학술발표회 논문집
• /
• pp.133-134
• /
• 2009

Cold temperature development (CTD) of electron beam (EB) patterned resists and subsequent dry etching were investigated for fabrication of nano-patterned Niobium (Nb). Bulky Nb fims on GaAs substrates were deposited with EB evaporation. Line patterns on Nb cathode were fabricated by EB patterning and reactive ion etching (RIE). Size deviations of nano-sized line patterns from CAD designed patterns are dependent on the EB total exposure, but it can be improved by CTD of EB-exposed resist. Line patterns of 10 to 300 nm widths of EB-exposed resist patterns were drawn under various exposure conditions of $0.2{\mu}s$/dot (total 240,000 dot) with a constant current (50 pA). Compared with room temperature development (RTD), the CTD improves pattern resolution due to the suppression of backscattering effect. RIE with $CF_4$ was performed for formation of several nano-sized line patterns on Nb. Each EB-resist patterned samples with RTDs and CTDs were etched with two different $CF_4$ gas pressures of 5 Pa. Nb etching rate increases while GaAs (or ZEP) etching rate decreases as the chamber pressure increases. This different dependent of the etching rate on the $CF_4$ pressure between Nb and GaAs (or ZEP) has a significant meaning because selective etching of nano-sized Nb line patterns is possible without etching of the underlying active layer.

• 센서학회지
• /
• 제22권1호
• /
• pp.89-94
• /
• 2013

In this paper, we developed a beam of MEMS probe card using a BeCu sheet. Silicon wafer thickness of $400{\mu}m$ was fabricated by using deep reactive ion etching (RIE) process. After forming through silicon via (TSV), the silicon wafer was bonded with BeCu sheet by soldering process. We made BeCu beam stress-free owing to removing internal stress by using joule heating. BeCu beam was fused by using joule heating caused by high current. The fabricated BeCu beam measured length of 1.75 mm and width of 0.44 mm, and thickness of $15{\mu}m$. We measured fusing current as a function of the cutting planes. Maximum current was 5.98 A at cutting plane of $150{\mu}m^2$. The proposed low-cost and simple fabrication process is applicable for producing MEMS probe beam.