• 제목/요약/키워드: Ion Flux

검색결과 252건 처리시간 0.026초

축산분뇨에서 발생하는 암모니아 플럭스에 대한 환경인자의 영향에 관한 연구 (Ammonia Flux from Cow Manure in Relation to the Environmental Factors in Livestock Facilities)

  • 사재환
    • 한국대기환경학회지
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    • 제26권4호
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    • pp.432-442
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    • 2010
  • Ammonia is a very important constituent of the atmospheric environment because it is the most dominant gaseous alkaline species present in the atmosphere. Ammonia is known to affect ecosystems at relatively low concentration. Ammonia flux from livestock facilities can be regulated by a number of environmental factors (pH, ammonium ion, temperature, wind speed, etc). The increases in wind speed above manure from 0.0 m/s to 1.0 7m/s resulted in 2.5 times increases in ammonia flux. Wind speed and ammonia flux showed 0.982. A linear relationship with a correlation coefficient (r=0.982). When manure temperature increased from $3^{\circ}C$ to $36^{\circ}C$, the manure pH decreased approximately 0.30 to 0.46. As wind speed above the manure increased from 0.0 m/s to 1.07 m/s, ammonia flux increased approximately 2.5 times. The increasing manure temperature from $3^{\circ}C$ to $10^{\circ}C$, raised ammonia flux from 2.0 to 3.6 times (2.6 times in average similarly). The increases of manure temperature from $3^{\circ}C$ to $25^{\circ}C$ increased ammonia flux from 5.7 to 12.9 times (8.5 times in average). In this study, the correlation coefficient between ammonia flux and manure temperature was found from 0.972 to 0.989. Results of our research showed that ammonium ion concentration, pH of manure and wind speed were important factors in controlling the ammonia flux from manure livestock facilities.

산소 및 아르곤 이온 보조빔을 이용하여 증착한 저온 Indim Tin Oside(ITO) 박막의 특성 연구

  • 김형종;김정식;배정운;염근영;이내응;오경희
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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    • pp.100-100
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    • 1999
  • 가시광선 영역에서 높은 광학적 투과성과 함께 우수한 전기 전도성을 갖는 ITO 박막은 디스플레이 소자나 투명전극재료 등 다양한 분야에서 응용성이 더욱 증대되고 있다. 증착기판으로서 유리를 사용할 때 생기는 활용범위 제한을 극복하고자 최근 유기물 위에 증착이 가능한 저온 증착방법에 대한 연구가 활발히 이루어지고 있다. 그 가운데 이온빔과 같은 energetic한 beam을 이용한 박막의 제조는 기판을 플라즈마 발생지역으로부터 분리시켜 이온빔의 flux 및 에너지, 입사각 등의 자유로운 조절을 통해 상온에서도 우수한 성질의 박막 형성 가능성이 제시되어 왔다. 본 연구에서는 ion beam assisted evaporation방법을 이용하여 ITO 박막을 성장시켰으며, ion-surface interaction 효과가 박막 성장주에 미치는 영향을 이해하기 위하여 먼저 반응성 산소 이온빔에 비 반응성 아르곤 이온빔을 다양하게 변화시켜가며 증착하였으며, 이와 더불어 산소 분위기에서 아르곤 이온빔에 의한 ITO 박막의 특성 변화를 각각 관찰하였다. 증착전 후의 열처리 없이 상온에서 비저항이 ~10-4$\Omega$cm 이하로 낮고 80% 이상의 투과율을 갖는 ITO 박막을 성장시켰다. 실험에서 이용된 e-beam evaporation 물질은 In2O3-SnO2(1-wt%)였으며, 이온빔 source는 산소에 의한 filament의 산화를 막기 위해 filament cathodes type이 아닌 rf(radio-frequency)를 사용하였다. 중요 증착변수인 이온빔의 flux 변화는 산소와 Ar의 flow rate를 MFC로 조절하고 rf power를 변화시켜 얻었으며, 이온빔 에너지는 가속 grid의 가속전압 변화와 ion gun과 기판사이의 거리 조절을 통해 최적화하였다. 이온빔의 에너지와 flux는 Faraday cup으로 측정하였으며, 성박된 박막의 특성은 UV-spectrometer, 4-point probe, Hall measurement. $\alpha$-step, XRD, XPS 등을 이용하여 광학적, 전기적, 구조적 특성을 분석하였다.

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플라스마 이온증착 기술을 이용한 스테인리스강의 질화처리에 관한 연구 (Research of Nitriding Process on Austenite Stainless Steel with Plasma Immersion Ion Beam)

  • 김재돌;박일수;옥철호
    • Journal of Advanced Marine Engineering and Technology
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    • 제32권2호
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    • pp.262-267
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    • 2008
  • Plasma immersion ion beam (PIIB) nitriding process is an environmentally benign and cost-effective process, and offers the potential of producing high dose of nitrogen ions in a way of simple, fast and economic technique for the high plasma flux treatment of large surface area with nitrogen ion source gas. In this report PIIB nitriding technique was used for nitriding on austenite stainless steel of AISI304 with plasma treatment at $250{\sim}500^{\circ}C$ for 4 hours, and with the working gas pressure of $2.67{\times}10^{-1}$ Pa in vacuum condition. This PIIB process might prove the advantage of the low energy high flux of ion bombardment and enhance the tribological or mechanical properties of austenite stainless steel by nitriding, Furthermore, PIIB showed a useful surface modification technique for the nitriding an irregularly shaped three dimensional workpiece of austenite stainless steel and for the improvement of surface properties of AISI 304, such as hardness and strength

Sn-3.0Ag-0.5Cu 솔더링에서 플럭스 잔사가 전기화학적 마이그레이션에 미치는 영향 (Flux residue effect on the electrochemical migration of Sn-3.0Ag-0.5Cu)

  • 방정환;이창우
    • Journal of Welding and Joining
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    • 제29권5호
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    • pp.95-98
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    • 2011
  • Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

Recent progress in the theoretical understanding of relativistic electron scattering and precipitation by electromagnetic ion cyclotron waves in the Earth's inner magnetosphere

  • Lee, Dae-Young
    • Journal of Astronomy and Space Sciences
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    • 제36권2호
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    • pp.45-60
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    • 2019
  • The Earth's outer radiation belt has long received considerable attention mainly because the MeV electron flux in the belt varies often dramatically and at various time scales. It is now widely accepted that the wave-particle interaction is one of the major mechanisms responsible for such flux variations. The wave-particle interaction can accelerate electrons to MeV energies, explaining the observed flux increase events, and can also scatter the electrons' motion into the loss cone, resulting in atmospheric precipitation and thus contributing to flux dropouts. In this paper, we provide a review of the current state of research on relativistic electron scattering and precipitation due to the interaction with electromagnetic ion cyclotron (EMIC) waves in the inner magnetosphere. The review is intended to cover progress made over the last ~15 years in the theory and simulations of various issues, including quasilinear resonance diffusion, nonlinear interactions, nonresonant interactions, effects of finite normal angle on pitch angle scattering, effects due to rising tone emission, and ways to scatter near-equatorial pitch angle electrons. The review concludes with suggestions of a few promising topics for future research.

플라즈마 증착 형상 모의 실험기의 앞덮개 효과를 고려한 근사 해석적 모델에 관한 연구 (A Study on the Approximation analytical Model of PECVD Topography simulator considering the effect of the presheath)

  • 이강환;손명식;황호정
    • 전자공학회논문지D
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    • 제36D권1호
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    • pp.90-99
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    • 1999
  • 본 논문에서는 반응로 안에서 쌍극성 확산장의 거리 확장에 따르는 앞덮개(Presheath)영역에서의 효과를 고려하고, 앞덮개 영역 내에서 이온과 중성자간의 충돌을 고려한 입사각 분포에 따른 에너지 플럭스를 계산하였다. 이론의 각분포 현상과 에너지 플럭스 분포를 이온의 온도와 함께 앞덮개 효과를 고려된 새로운 근사 해석적 모델을 제시한다. 실제 식각 공정에 대한 실험결과 충돌이 없는 덮개에서도 이온의 입사각이 산란되는 현상이 나타난다. 이 현상은 이온의 앞덮개지역을 통과하면서 쌍극성 확산장(ambipolar diffusion field)에 의해 운동에너지를 얻게 되는데, 이때 얻어진 운동에너지가 가스 분자 충돌에 의해 변화는 효과 때문이라고 볼 수 있다. 제안된 근사적 해석모델을 이용하여 트렌치에서의 중착 형상을 모의실험 하였다.

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저에너지 고출력 이온빔을 이용한 polyvinylidene fluoride 표면의 초친수성화 (Superhydrophilic Surface Modification of Polyvinylidene Fluoride by Low Energy and High Flux ion Beam Irradiation)

  • 박종용;정연식;최원국
    • 한국재료학회지
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    • 제15권6호
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    • pp.382-387
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    • 2005
  • Polyvinylidene fluoride (PVDF) surface was irradiated and became superhydrophilic by low energy (180 eV) and high flux $(\~10^{15}/cm{\cdot}s)$ ion beam. As an ion source, a closed electron Hall drift thruster of $\phi=70mm$ outer channel size without grid was adopted. Ar, $O_2$ and $N_2O$ were used for source gases. When $N_2O^+$ and $O_2^+$ reactive gas ion beam were irradiated with the ion fluence of $5\times10^{15}/cm^2$, the wetting angle for deionized water was drastically dropped from $61^{\circ}\;to\;4^{\circ}\;and\;2^{\circ}$, respectively. Surface energy was also increased up to from 44 mN/m to 81 mN/m. Change of chemical component in PVDF surface was analyzed by x-ray photoelectron spectroscopy. Such a great increase of the surface energy was intimately related with the increase of hydrophilic group component in reactive ion irradiated PVDF surfaces. By using an atomic force microscopy, the root-mean-square of surface roughness of ion irradiated PVDF was not much altered compared to that of pristine PVDF.

전단흐름 하에 이온교환막 위에서 발생하는 전기수력학적 와류 (Electroconvective vortex on an Ion Exchange Membrane under Shear Flow)

  • 곽노균
    • 한국가시화정보학회지
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    • 제16권1호
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    • pp.61-69
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    • 2018
  • Ion exchange membrane can transfer only cation or anion in electrically conductive fluids. Recent studies have revealed that such selective ion transport can initiate electroconvective instability, resulting vortical fluid motions on the membrane. This so-called electroconvective vortex (a.k.a. electroconvection (EC)) has been in the spotlight for enhancing an ion flux in electrochemical systems. However, EC under shear flow has not been investigated yet, although most related systems operate under pressure-driven flows. In this study, we present the direct visualization platform of EC under shear flow. On the transparent silicone rubber, microscale channels were fabricated between ion exchange membranes, while allowing microscopic visualization of fluid flow and ion concentration changes on the membranes. By using this platform, not only we visualize the existence of EC under shear flow, its unique characteristics are also identified: i) unidirectional vortex pattern, ii) its advection along the shear flow, and iii) shear-sheltering of EC vortices.

Newly Designed Ion Beam Etcher with High Etch Rate

  • Cheong, Hee-Woon
    • Journal of Magnetics
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    • 제20권4호
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    • pp.366-370
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    • 2015
  • New ion beam etcher (IBE) using a magnetized inductively coupled plasma (M-ICP) has been developed. The magnetic flux density distributions inside the upper chamber, where the plasma is generated by inductive coupling, were successfully optimized by arranging a pair of circular coils very carefully. More importantly, the proposed M-ICP IBE exhibits higher etch rate than ICP.

Dual-frequency Capacitively Coupled Plasma-enhanced Chemical Vapor Deposition System for Solar Cell Manufacturing

  • 권형철;원임희;신현국;;이재구
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.310-311
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    • 2011
  • Dual-frequency (DF) capacitively coupled plasmas (CCP) are used to separately control the mean ion energy and flux at the electrodes [1]. This separate control in capacitively coupled radio frequency discharges is one of the most important issues for various applications of plasma processing. For instance, in the Plasma Enhanced Chemical Vapor Deposition processes such as used for solar cell manufacturing, this separate control is most relevant. It principally allows to increase the ion flux for high deposition rates, while the mean ion energy is kept constant at low values to prevent highly energetic ion bombardment of the substrate to avoid unwanted damage of the surface structure. DF CCP can be analyzed in a fashion similar to single-frequency (SF) driven with effective parameters [2]. It means that DF CCP can be converted into SF CCP with effective parameters such as effective frequency and effective current density. In this study, comparison of DF CCP and its converted effective SF CCP is carried out through particle-in-cell/Monte Carlo (PIC-MCC) simulations. The PIC-MCC simulation shows that DF CCP and its converted effective SF CCP have almost the same plasma characteristics. In DF CCP, the negative resistance arises from the competition of the effective current and the effective frequency [2]. As the high-frequency current increases, the square of the effective frequency increases more than the effective current does. As a result, the effective voltage decreases with the effective current and it leads to an increase of the ion flux and a decrease of the mean ion energy. Because of that, the negative resistance regime can be called the preferable regime for solar cell manufacturing. In this preferable regime, comparison of DF (13.56+100 or 200 MHz) CCP and SF (60 MHz) CCP with the same effective current density is carried out. At the lower effective current density (or at the lower plasma density), the mean ion energy of SF CCP is lower than that of DF CCP. At the higher effective current density (or at the higher plasma density), however, the mean ion energy is lower than that of SF CCP. In this case, using DF CCP is better than SF CCP for solar cell manufacturing processes.

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