• Title/Summary/Keyword: Internal laser scribing

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Analysis of Cutting Characteristic of the Sapphire Wafer Using a Internal Laser Scribing Process for LED Chip (LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 가공 특성 분석)

  • Song, Ki-Hyeok;Cho, Yong-Kyu;Kim, Byung-Chan;Kang, Dong-Seong;Cho, Myeong-Woo;Kim, Jong-Su;Ryu, Byung-So
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.9
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    • pp.5748-5755
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    • 2015
  • Scribing is cutting process to determine production amount and characteristic of LED chip. So it is an important process for fabrication of LED chip. Mechanical process and conventional scribing process with laser source has several problems such as thermal deformation, decreasing of material strength and limitation of cutting region. To solve these problems, internal laser scribing process that generates void in wafer and derives self-crack has been researched. However, studies of sapphire wafer cutting by internal laser scribing process for fabrication of LED chip are still insufficient. In this paper, cutting parameters were determined to apply internal laser scribing process for sapphire wafer for fabrication of LED chip. Then, foundation of cutting condition was established to set up internal laser scribing system through investigation of cutting characteristics by several experiments.

Development of Internal Laser Scribing System for Cutting of Sapphire Wafer in LED Chip Fabrication Processes (LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 시스템 개발)

  • Kim, Jong-Su;Ryu, Byung-So;Kim, Ki-Beom;Song, Ki-Hyeok;Kim, Byung-Chan;Cho, Myeong-Woo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.6
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    • pp.104-110
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    • 2015
  • LED has added value as a lighting source in the illuminating industry because of its high efficiency and low power consumption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.

A Study on the Improvement of the Dye-sensitized Solar Cell by the Fiber Laser Transparent Conductive Electrode Scribing Technology (파이버 레이저 투명 전극 식각을 통한 염료감응형 태양전지 효율 상승 연구)

  • Son, Min-Kyu;Seo, Hyun-Woong;Shin, In-Young;Kim, Jin-Kyoung;Choi, Jin-Ho;Choi, Seok-Won;Kim, Hee-Je
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.12
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    • pp.2218-2224
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    • 2010
  • Dye-sensitized solar cell (DSC) is a promising alternative solar cell to the conventional silicon solar cell due to several advantages. Development of large scale module is necessary to commercialize the DSC in the near future. A scribing technology of the transparent conductive oxide (TCO) is one of the important technologies on the fabrication of DSC module. A quality of the scribed line on the TCO has a decisive effect on the efficiency of DSC module. Among several scribing technologies, the fiber laser is a suitable for scribing the TCO more precisely and accurately because of their own characteristics. In this study, we try to improve the quality of the TCO scribed line by using the fiber laser. Consequently, the operating parameter of fiber laser is optimized to get the TCO scribed line with good quality. And the fiber laser scribing technology of the TCO is applied to the fabrication of the DSC with optimal operating parameter, operating current 3900mA. As a result, the current density and fill factor are improved and the total efficiency is increased because the internal resistances of DSC such as TCO sheet resistance and the resistance concerned to the electron movement in the $TiO_2$ are reduced. This is analyzed by the electrochemistry impedance spectroscopy (EIS) and the equivalent circuit model of the DSC.

A Study on the Improvement of Efficiency by Scribing Transparent Conducting Oxide of Dye-sensitized Solar Cell (염료감응형 태양전지의 투명 전극 식각을 통한 효율 향상 연구)

  • Seo, Hyun-Woong;Son, Min-Kyu;Lee, Kyoung-Jun;Kim, Jeong-Hoon;Kim, Hee-Je
    • 한국신재생에너지학회:학술대회논문집
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    • 2008.05a
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    • pp.416-418
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    • 2008
  • Dye-sensitized solar cell using transparent conducting oxide as electrode has large resistance such as surface resistance, charge transportation impedance in counter electrode and electrolyte, impedance between each interface. Among that resistances, surface resistance of transparent conducting oxide is relatively large. So the change of transparency has a large effect on internal resistance of dye-sensitized solar cell. Consequently, that change cause to increase or decrease the conversion efficiency. We tried to reduce the surface resistance by laser-scribing. The active area is seperated from total transparent conducting oxide by Nd:YAG laser-scribing. As a result, we achieved the improvement of efficiency about 7% and 11% in case of $0.25cm^2$ and $1.00cm^2$ dye-sensitized solar cells.

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