• 제목/요약/키워드: Internal Laser Scribing

검색결과 4건 처리시간 0.017초

LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 가공 특성 분석 (Analysis of Cutting Characteristic of the Sapphire Wafer Using a Internal Laser Scribing Process for LED Chip)

  • 송기혁;조용규;김병찬;강동성;조명우;김종수;유병소
    • 한국산학기술학회논문지
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    • 제16권9호
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    • pp.5748-5755
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    • 2015
  • 스크라이빙 공정은 LED 칩 생성을 위한 절단 공정으로 칩의 특성 및 생산량을 결정하는 중요한 공정이다. 기존의 기계적 방식 및 레이저 방식의 스크라이빙 공정은 칩의 열 변형 및 강도 저하, 절단 영역의 제한 등의 문제점이 있다. 이러한 문제를 해결하기 위해 웨이퍼 내부에 공극을 생성하여 자가 균열을 유도하는 내부 레이저 스크라이빙 공정이 연구되고 있으나 LED 칩 제작을 위한 사파이어 웨이퍼의 절단에 대한 연구는 미비한 실정이다. 본 논문은 LED 칩 제작에 사용되는 사파이어 웨이퍼의 내부 레이저 스크라이빙 공정을 적용하기 위해 주요 가공 변수를 정립하고 가공 실험을 통하여 절단 특성을 분석함으로써 내부 레이저 스크라이빙 시스템 구축을 위한 기초 가공 조건을 확립하였다.

LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 시스템 개발 (Development of Internal Laser Scribing System for Cutting of Sapphire Wafer in LED Chip Fabrication Processes)

  • 김종수;유병소;김기범;송기혁;김병찬;조명우
    • 한국기계가공학회지
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    • 제14권6호
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    • pp.104-110
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    • 2015
  • LED has added value as a lighting source in the illuminating industry because of its high efficiency and low power consumption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.

파이버 레이저 투명 전극 식각을 통한 염료감응형 태양전지 효율 상승 연구 (A Study on the Improvement of the Dye-sensitized Solar Cell by the Fiber Laser Transparent Conductive Electrode Scribing Technology)

  • 손민규;서현웅;신인영;김진경;최진호;최석원;김희제
    • 전기학회논문지
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    • 제59권12호
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    • pp.2218-2224
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    • 2010
  • Dye-sensitized solar cell (DSC) is a promising alternative solar cell to the conventional silicon solar cell due to several advantages. Development of large scale module is necessary to commercialize the DSC in the near future. A scribing technology of the transparent conductive oxide (TCO) is one of the important technologies on the fabrication of DSC module. A quality of the scribed line on the TCO has a decisive effect on the efficiency of DSC module. Among several scribing technologies, the fiber laser is a suitable for scribing the TCO more precisely and accurately because of their own characteristics. In this study, we try to improve the quality of the TCO scribed line by using the fiber laser. Consequently, the operating parameter of fiber laser is optimized to get the TCO scribed line with good quality. And the fiber laser scribing technology of the TCO is applied to the fabrication of the DSC with optimal operating parameter, operating current 3900mA. As a result, the current density and fill factor are improved and the total efficiency is increased because the internal resistances of DSC such as TCO sheet resistance and the resistance concerned to the electron movement in the $TiO_2$ are reduced. This is analyzed by the electrochemistry impedance spectroscopy (EIS) and the equivalent circuit model of the DSC.

염료감응형 태양전지의 투명 전극 식각을 통한 효율 향상 연구 (A Study on the Improvement of Efficiency by Scribing Transparent Conducting Oxide of Dye-sensitized Solar Cell)

  • 서현웅;손민규;이경준;김정훈;김희제
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2008년도 춘계학술대회 논문집
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    • pp.416-418
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    • 2008
  • Dye-sensitized solar cell using transparent conducting oxide as electrode has large resistance such as surface resistance, charge transportation impedance in counter electrode and electrolyte, impedance between each interface. Among that resistances, surface resistance of transparent conducting oxide is relatively large. So the change of transparency has a large effect on internal resistance of dye-sensitized solar cell. Consequently, that change cause to increase or decrease the conversion efficiency. We tried to reduce the surface resistance by laser-scribing. The active area is seperated from total transparent conducting oxide by Nd:YAG laser-scribing. As a result, we achieved the improvement of efficiency about 7% and 11% in case of $0.25cm^2$ and $1.00cm^2$ dye-sensitized solar cells.

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