• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.28-33
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• 2012

Ball-milled Ni-Al powder compacts have been synthesized by the heat of molten cast iron and have been coated on cast iron. The effects of the ball-milling time on the microstructure of the intermetallic coatings have been investigated. The experimental results showed that the ball-milled Ni-Al powder compacts were completely reacted and were successfully coated on the cast iron without re-melting the substrate. Densification of the coating layers was enhanced by increasing the ball-milling time. This might be attributed to the fact that the heat released during the intermetallic reaction was dispersed over a prolonged reaction time by the ball-milling of the elemental powders.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.18 no.4
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• pp.421-437
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• 2020

This study provides an assessment on a proposed method for separation of cesium, strontium, and barium using electrochemical reduction at a liquid bismuth cathode in LiCl-KCl eutectic salt, investigated via cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS), and scanning electron microscopy with energy dispersive X-ray spectrometry (SEM-EDS). CV studies were performed at temperatures of 723-823 K and concentrations of the target species up to 4.0wt%. Redox reactions occurring during potential sweeps were observed. Concentration of BaCl2 in the salt did not seem to influence the diffusivity in the studied concentration range up to 4.0wt%. The presence of strontium in the system affected the redox reaction of lithium; however, there were no distinguishable redox peaks that could be measured. Impedance spectra obtained from EIS methods were used to calculate the exchange current densities of the electroactive active redox couple at the bismuth cathode. Results show the rate-controlling step in deposition to be the mass transport of Cs+ ions from the bulk salt to the cathode surface layer. Results from SEM-EDS suggest that Cs-Bi and Sr-Bi intermetallics from LiCl-KCl salt are not thermodynamically favorable.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.6
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• pp.309-314
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• 2021

Due to the superior corrosion resistance and mechanical properties of TiAl alloy at high temperature, it has been utilized as a turbine wheel of a turbocharger. The dissimilar metallic bonding is usually applied to combine the TiAl turbine wheel with the SCM440 structural steel which is used as a driving shaft. In this study, the TiAl and SCM440 joint were fabricated by using a friction welding technique. During bonding process, to suppress the martensitic transformation and the formation of cracks, which might reduce a strength of the joints, Cu was used as an insert metal to relieve stress. As a result, the intermetallic compounds (IMCs) layer was observed at TiAl/Cu interface while no IMC formation was formed at SCM440/Cu interface. Since understanding of the IMCs effects on the mechanical performance of welded joint is also essential for ensuring the reliability and integrity of the turbocharger system, we estimated the nanohardness of welded joint region through nanoindentation. The relation between the microstructural feature and its mechanical property is discussed in detail.

• Corrosion Science and Technology
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• v.6 no.4
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• pp.206-210
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• 2007

Aerospace aluminum alloys such as Al alloy 2024-T3 and 7075-T6 are subject to localized corrosion due the existence of intermetallics containing Cu, Mg or Zn. Chromate is currently widely used in the aerospace industry as the corrosion inhibitor for these alloys. However, chromate needs to be replaced due to its strong carcinogenicity. In this study, an extensive pigment screening has been performed to find replacements for chromates. Different categories of inhibitors were evaluated by immersion tests, DC polarization tests and other methods. Phosphates, zinc salts, cerium salts, vanadates and benzotriazole were found to be effective inhibitors for AA7075. Among those inhibitors, zinc phosphate was found to be the most effective in our novel, silane-based, one-step aqueous primer system. The performance of this primer is comparable to that of currently used chromate primers in accelerated corrosion tests, while it is completely chromate-free and its VOC is about 80% less than that of current primers. Studies by SEM/EDS showed that the unique structure of the superprimer accounts for the strong anti-corrosion performance of the zinc phosphate pigment. The self-assembled stratified double-layer structure of the superprimer is characterized by a less-penetrable hydrophobic layer at the top and a hydrophilic layer accommodating the inhibitors underneath. The top layer functions as the physical barrier against water ingress, while the lower layer functions as a reservoirfor the inhibitor, which is leached out only if the coating is damaged by a scratch or scribe. The presence of a silane in the primer further improves the adhesion and anti-corrosion performance of the primer.

• Journal of Korea Foundry Society
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• v.18 no.5
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• pp.431-438
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• 1998

Microstructure of A356 aluminum alloys cast in the permanent mold was investigated by optical microscope and image analyzer, with particular respect to the shape and size distribution of iron intermetallics known as ${\beta}-phase$ ($Al_5FeSi$). Morphologies of the ${\beta}-phase$ was found to change gradually with the Be:Fe ratio like these. In Be-free alloys, ${\beta}-phase$ with needlelike morphology was well developed, but script phase was appeared when the Be:Fe ratio is above 0.2:1. With the Be:Fe ratios of 0.4:1-1:1, script phase as well as Be-rich phase was also observed. In case of higher Be addition, above 1:1, Be-rich phase was observed on all regions of the specimens, and increasing of the Be:Fe ratios gradually make the Be-rich phase coarse. It was also observed that the ${\beta}-phase$ with needlelike morphology was coarsened with increase of the Fe content in Be-free alloys. However, in Be-added alloys, length and number of these ${\beta}-phases$ were considerably decreased with the increased Be:Fe ratio. Beryllium addition improved tensile properties and impact toughness of the A356 aluminium alloy, due to the formation of a script phase or a Be-rich phase instead of a needlelike ${\beta}-phase$. The DSC tests indicated that the presence of Be could increase the amount of Mg which is available for $Mg_2Si$ precipitate hardening, and enhance the precipitation kinetics by lowering the ternary eutectic temperature.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Bulletin of the Korean Chemical Society
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• v.34 no.6
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• pp.1656-1662
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• 2013

The ternary phase $EuZn_xIn_{4-x}$ has been identified as the main product of reactions of Eu, Zn, and In by using the In-flux method and characterized by both powder and single-crystal X-ray diffraction. The structure belongs to the common $BaAl_4$-type (tetragonal space group I4/mmm, Pearson code tI10) with lattice parameters of a = 4.5610(9) ${\AA}$, c = 12.049(3) ${\AA}$ for composition $EuZn_{1.10(12)}In_{2.90}$ and a = 4.5463(3) ${\AA}$, c = 12.028(2) ${\AA}$ for composition $EuZn_{1.18(2)}In_{2.82}$, respectively. In this structure, the Eu atoms are situated at the center of 18-vertex Fedorov polyhedra made of Zn and In atoms, where the 4d site is preferentially occupied by In and the 4e site is occupied by randomly mixed Zn and In atoms. Theoretical investigations using tight-binding linear muffintin orbital (TB-LMTO) method provide rationale for the observed site preferences and suggest potentially wider homogeneity range than the experimentally established for $EuZn_xIn_{4-x}$ ($x{\approx}1.1$).

• Tribology and Lubricants
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• v.36 no.3
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• pp.124-132
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• 2020

The effect of the stoichiometry on the sliding wear properties of NiAl coatings has been investigated. Three different powder mixtures with the compositions of Ni-50at%Al, Ni-54at%Al and Ni-42at%Al were diepressed respectively, and which were subsequently coated on mild steel through combustion synthesis in an induction heating system. Sliding wear behavior of the coatings was examined against an alloyed tool steel using a pin-on-disc type sliding wear test machine. As results, it could be seen that powder mixture(Ni-54at%Al) with displaying Al-rich deviations from the stoichiometry of NiAl(Ni-50at%Al) was promoted the most the synthetic reactivity. The microstructure of the coating layer with the compositions of Ni-54at%Al exhibits the porous NiAl single phase structure. However, the microstructure of the coating layer of the compositions of Ni-42at%Al exhibits the denser multi-phase structure containing several intermediate phases in addition to NiAl. Densification of the coating layer was enhanced by increasing the reacting temperature. On the other hand, the wear properties of the coating layers showed that the wear mode at speeds of around 1 m/s was severe wear, regardless of the stoichiometry and reacting temperature. However, wear properties of coating layer with the compositions of Ni-42at%Al were superior to those of coating layer with the compositions of Ni-54at%Al. This would be attributed by the fact that coating layer with the compositions of Ni-42at%Al develops little void and much intermediate phases with high strength.

• Korean Journal of Materials Research
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• v.26 no.4
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• pp.167-172
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• 2016

The high temperature deformation behavior of $Ni_3Al$ and $Ni_3(Al,Mo)$ single crystals that were oriented near <112> was investigated at low strain rates in the temperature range above the flow stress peak temperature. Three types of behavior were found under the present experimental conditions. In the relatively high strain rate region, the strain rate dependence of the flow stress is small, and the deformation may be controlled by the dislocation glide mainly on the {001} slip plane in both crystals. At low strain rates, the octahedral glide is still active in $Ni_3Al$ above the peak temperature, but the active slip system in $Ni_3(Al,Mo)$ changes from octahedral glide to cube glide at the peak temperature. These results suggest that the deformation rate controlling mechanism of $Ni_3Al$ is viscous glide of dislocations by the <110>{111} slip, whereas that of $Ni_3(Al,Mo)$ is a recovery process of dislocation climb in the substructures formed by the <110>{001} slip. The results of TEM observation show that the characteristics of dislocation structures are uniform distribution in $Ni_3Al$ and subboundary formation in $Ni_3(Al,Mo)$. Activation energies for deformation in $Ni_3Al$ and $Ni_3(Al,Mo)$ were obtained in the low strain rate region. The values of the activation energy are 360 kJ/mol for $Ni_3Al$ and 300 kJ/mol for $Ni_3(Al,Mo)$.