• 제목/요약/키워드: Intermetallic compound

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Sintering Mixtures in the Stage of Establishing Chemical Equilibrium

  • Savitskii, A.P.
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 1999.04a
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    • pp.5-5
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    • 1999
  • The Principal deficiency of the existing notion about the sintering-mixtures consists in the fact that almost no attention is focused on the Phenomenon of alloy formation during sintering, its connection with dimensional changes of powder bodies, and no correct ideas on the driving force for the sintering process in the stage of establishing chemical equilibrium in a system are available as well. Another disadvantage of the classical sintering theory is an erroneous conception on the dissolution mechanism of solid in liquid. The two-particle model widely used in the literature to describe the sintering phenomenon in solid state disregards the nature of the neighbouring surrounding particles, the presence of pores between them, and the rise of so called arch effect. In this presentation, new basic scientific principles of the driving forces for the sintering process of a two-component powder body, of a diffusion mechanism of the interaction between solid and liquid phases, of stresses and deformation arising in the diffusion zone have been developed. The major driving force for sintering the mixture from components capable of forming solid solutions and intermetallic compounds is attributed to the alloy formation rather than the reduction of the free surface area until the chemical equilibrium is achieved in a system. The lecture considers a multiparticle model of the mixed powder-body and the nature of its volume changes during solid-state and liquid-phase sintering. It explains the discovered S-and V-type concentration dependencies of the change in the compact volume during solid-state sintering. It is supposed in the literature that the dissolution of solid in liquid is realised due to the removal of atoms from the surface of the solid phase into the melt and then their diffusicn transfer from the solid-liquid interface into the bulk of liquid. It has been shown in our experimental studies that the mechanism of the interaction between two components, one of them being liquid, consist in diffusion of the solvent atoms from the liquid into the solid phase until the concentration of solid solutions or an intermetallic compound in the surface layer enables them to pass into the liquid by means of melting. The lecture discusses peculimities of liquid phase formation in systems with intermediate compounds and the role of the liquid phase in bringing about the exothermic effect. At the frist stage of liquid phase sintering the diffusion of atoms from the melt into the solid causes the powder body to grow. At the second stage the diminution of particles in size as a result of their dissolution in the liquid draws their centres closer to each other and makes the compact to shrink Analytical equations were derived to describe quantitatively the porosity and volume changes of compacts as a result of alloy formation during liquid phase sinteIing. Selection criteria for an additive, its concentration and the temperature regime of sintering to control the density the structure of sintered alloys are given.

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Effects of W Contents in Co Matrix of the Thermal Sprayed WC-Co on the Corrosion Behavior in Molten Zinc

  • Seong, Byeong-Geun;Hwang, Sun-Young;Kim, Kyoo-Young;Lee, Kee-Ahn
    • Corrosion Science and Technology
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    • v.6 no.4
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    • pp.147-153
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    • 2007
  • This study sought to investigate the reaction of Co-binder containing tungsten with molten zinc. Four kinds of Co-W alloys (pure, 10%W, 20%W, 30%W) were prepared using the powder metallurgy method. The specimens were immersion-tested in molten pure zinc baths at $460^{\circ}C$. To evaluate the corrosion property in molten zinc, the weight loss of the specimen was measured after the immersion tests at different immersion times (10~300 min.). Co-10%W alloys, compared with pure cobalt, showed no effect of tungsten addition on the reaction rate in molten zinc. The relationship between the weight loss and the square root of immersion period represents a straight line in both pure cobalt and Co-10%W alloy. The Co-Zn reaction layer in Co- 1O%W alloy consists of $\gamma2$, $\gamma1$, $\gamma$ and ($\beta1$ phases. The rate of weight loss significantly increases and the weight loss behavior is not well accord with the linear relationship as the tungsten content in the Co-W alloy increases. The $\beta1$ layer was not formed on the Co-20%W alloy and neither was a stable Co-Zn intermetallic compound layer found on the Co-30%W alloy. The main cause of increase in reaction rate with increasing tungsten content is related with the instability of the Co-Zn reaction phases as seen on micro-structural analysis.

Nondestructive Determination of Reinforcement Volume Fractions in Particulate Composites : Eddy Current Method (비파괴적 방법에 의한 입자 강화 복합재료의 부피분율 평가: 와전류법)

  • Jeong, Hyun-Jo
    • Journal of the Korean Society for Nondestructive Testing
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    • v.18 no.2
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    • pp.112-120
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    • 1998
  • A nondestructive evaluation technique was developed for the quantitative determination of the reinforcement volume fractions in particulate reinforced metal matrix composites. The proposed technique employed a composite micromechanics which accounts for the microstructure of the composite medium together with the measurement of anisotropic electrical conductivity. When the measured conductivity was coupled with the theoretically predicted conductivity, the unknown reinforcement volume fraction was calculated. An analytical model based on the Mori-Tanaka method was described which relates the NDE signatures to the composite microstructure. The volume fractions were calculated using eddy current measurements made on a wide range of silicon carbide particulate ($SiC_p$) reinforced aluminum (Al) matrix composites. The calculated $SiC_p$ volume fractions were in good agreement with the measured volume fractions in the range of 0-30%. The technique was also found to be effective in estimating the total volume percentage of reinforcement and intermetallic compound formed during the processing stage.

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Role of Ca in Modifying Corrosion Resistance and Bioactivity of Plasma Anodized AM60 Magnesium Alloys

  • Anawati, Anawati;Asoh, Hidetaka;Ono, Sachiko
    • Corrosion Science and Technology
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    • v.15 no.3
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    • pp.120-124
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    • 2016
  • The effect of alloying element Ca (0, 1, and 2 wt%) on corrosion resistance and bioactivity of the as-received and anodized surface of rolled plate AM60 alloys was investigated. A plasma electrolytic oxidation (PEO) was carried out to form anodic oxide film in $0.5mol\;dm^{-3}\;Na_3PO_4$ solution. The corrosion behavior was studied by polarization measurements while the in vitro bioactivity was tested by soaking the specimens in Simulated Body Fluid (1.5xSBF). Optical micrograph and elemental analysis of the substrate surfaces indicated that the number of intermetallic particles increased with Ca content in the alloys owing to the formation of a new phase $Al_2Ca$. The corrosion resistance of AM60 specimens improved only slightly by alloying with 2 wt% Ca which was attributed to the reticular distribution of $Al_2Ca$ phase existed in the alloy that might became barrier for corrosion propagation across grain boundaries. Corrosion resistance of the three alloys was significantly improved by coating the substrates with anodic oxide film formed by PEO. The film mainly composed of magnesium phosphate with thickness in the range $30-40{\mu}m$. The heat resistant phase of $Al_2Ca$ was believed to retard the plasma discharge during anodization and, hence, decreased the film thickness of Ca-containing alloys. The highest apatite forming ability in 1.5xSBF was observed for AM60-1Ca specimens (both substrate and anodized) that exhibited more degradation than the other two alloys as indicated by surface observation. The increase of surface roughness and the degree of supersaturation of 1.5xSBF due to dissolution of Mg ions from the substrate surface or the release of film compounds from the anodized surface are important factors to enhance deposition of Ca-P compound on the specimen surfaces.

Effect of V additions on the thermal stability of mechanically alloyed AI-alloys (기계 합금화한 AI-Ti합금의 열적 안정성에 미치는 V첨가의 영향)

  • O, Jun-Yeong;Park, Chi-Seung;Kim, Seon-Jin
    • Korean Journal of Materials Research
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    • v.4 no.4
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    • pp.483-490
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    • 1994
  • The effect of vanadium additions on the thermal stability of Al-TI alloy \vas investigated. Al- 8wt.%Ti and Al-8wt.%(Ti+V) alloys wirh different Ti to V atomic ratios of 3 : 1 and 1 : 1 were pre- pared by mechanical alloying. The steady states wwe obtalncd after mechanical alloy~ng for ltihours for all the alloy compositions. The mechanically alloyed powders were consolidaicd by vacuum hot pressing and thermal st.ability was investigated by hardness testing afrcr aging thc specimens at $400^{\circ}C$, $480^{\circ}C$, $550^{\circ}C$ for up to 1000hrs. It was confirmed that addit~on of V- increased the thermal stability of Al-Ti alloy by reducing coarsening rate of $Ai_{3}Ti$ intermetallic compound.

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A Study of Properties of Sn-3Ag-0.5Cu Solder Based on Phosphorous Content of Electroless Ni-P Layer (Sn-3Ag-0.5Cu Solder에 대한 무전해 Ni-P층의 P함량에 따른 특성 연구)

  • Shin, An-Seob;Ok, Dae-Yool;Jeong, Gi-Ho;Kim, Min-Ju;Park, Chang-Sik;Kong, Jin-Ho;Heo, Cheol-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.6
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    • pp.481-486
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    • 2010
  • ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.

Mechanically Driven Decomposition of Intermetallics

  • Kwon, Young-Soon;Kim, Hyun-Sik;Gerasimov, Konstantin B.
    • Journal of Powder Materials
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    • v.9 no.6
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    • pp.422-432
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    • 2002
  • Mechanically driven decomposition of intermetallics during mechanical milling(MM 1 was investigated. This process for Fe-Ce and Fe-Sn system was studied using conventional XRD, DSC, magnetization and alternative current susceptibility measurements. Mechanical alloying and milling form products of the following composition (in sequence of increasing Gecontent): $\alpha$(${\alpha}_1$) bcc solid solution, $\alpha$+$\beta$-phase ($Fe_{2-x}Ge$), $\beta$-phase, $\beta$+FeGe(B20), FeGE(B20), FeGe(B20)+$FeGe_2$,$FeGe_2$,$FeGe_2$+Ge, Ge. Incongruently melting intermetallics $Fe_6Ge_5$ and $Fe_2Ge_3$ decompose under milling. $Fe_6Ge_5$ produces mixture of $\hat{a}$-phase and FeGe(B20), $Fe_2Ge_3$ produces mixture of FeGe(B20) and $FeGe_2$ phases. These facts are in good agreement with the model that implies local melting as a mechanism of new phase for-mation during medchanical alloying. Stability of FeGe(B20) phase, which is also incongruently melting compound, is explained as a result of highest density of this phase in Fe-Ge system. Under mechanical milling (MM) in planetary ball mill, FeSn intermetallic decomposes with formation $Fe_5Sn_3$ and $FeSn_2$ phases, which have the biggest density among the phases of Fe-Sn system. If decomposition degree of FeSn is relatively small(<60%), milled powder shows superparamagnetic behavior at room temperature. For this case, magnetization curves can be fitted by superposition of two Langevin functions. particle sizes for ferromagnetic $Fe_5Sn_3$ phase determined from fitting parameters are in good agreement with crystalline sizes determined from XRD data and remiain approximately chageless during MM. The decomposition of FeSn is attributed to the effects of local temperature and local pressure produced by ball collisions.

Effects of Hf Addition on Microstructure and Hot Workability of Fe-30at.%A1-5at.%Cr Alloy (Hf가 첨가된 Fe-30at.%A1-5at.%Cr 합금의 미세조직 및 열간압연가공 특성)

  • Yoon, Kye-Lim;Lee, Doh-Jae;Baek, Dae-Hwa;Lee, Kyung-Ku
    • Journal of Korea Foundry Society
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    • v.21 no.6
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    • pp.336-342
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    • 2001
  • This study was carried out to examine the effects of adding 0.3at.%Hf in Fe-30at.%Al-5at.%Cr alloy on the variation of microstructures and hot workability. The effect of hot rolling on mechanical properties was estimated by measuring the elongation and tensile strength after rolling at 800 and 1000 respectively. Microstructure of Fe-30at.%Al-5at.%Cr alloy was consisted of large equiaxed grains and it was changed to quasi-equiaxed or columnar structures by adding 0.3at.%Hf to Fe-30at.%Al-5at.%Cr alloy. Every specimens showed a decreased tensile strength after hot rolling compared to that of before rolling. The elongation was increased by hot rolling. Remarkable changes in elongation by hot rollong was observed such as from 1.4% to 4.5% elongation at the specimen of 0.3at.%Hf added to Fe-30at.%Al-5at.%Cr. Fe-30at.%Al-5at.%Cr alloy showed typical cleavage fracture on tensile failure and hot rolling has negligible effects on fracture mode in this alloy. However at the alloy containing Hf fracture mode was changed by hot rolling from intergranular to mixed intergranular and transgranular fracture mode.

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Research on the Power Drop of Photovoltaic Module’s Aging Through the Thermal Shock Test

  • Kang, MinSoo;Jeon, YuJae;Kim, DoSeok;Shin, YoungEui
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.5
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    • pp.268-273
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    • 2015
  • While analyzing the specimens before and after the thermal shock test, we found that the power drop rate of the bare cell was 5.08%, while the power drop rate of the ribboned cell was 16.49%. In comparative terms, the efficiency was lower at the ribboned cell than at the bare cell. While analyzing through EL (Electroluminescence) shots and cross sections, we tried to decipher the exact cause of the power drop. Although mere color change of the cell was observed at the surface of the bare cell, no abnormality could be found inside the cell. On the surface of the ribboned cell, the short circuit of gridfinger extended from the front part of the front electrode of the ribboned cells. Therefore, cracks occurred on the surface of the cell. Cracks also appeared inside the cell. While analyzing the I-V curve, we determined an increase in the leakage current and an increase of resistances in series in the bare cell. In the ribboned cell, the resistances in parallel reduced remarkably. An increase of resistances in series could also be verified. Conclusively, we deduced that the power drop rate in the bare cell is a life span of the cell itself; aging is the cause of power drop rate in cells. In case of ribboned cell, the power drop rate was directly influenced by internal cracks and an intermetallic compound layer joining the ribbon at the front electrode.

Failure Mechanism and Test Method for Reliability Standardization of Solder Joints (솔더조인트의 신뢰성 표준화를 위한 취성파괴 메커니즘 및 평가법 연구)

  • Kim, Kang-Dong;Huh, Seok-Hwan;Jang, Joong-Soon
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.4
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    • pp.85-90
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    • 2011
  • With regard to reliability of solder joint, the significant failures include open defects that occurs from alignment problem, Head in Pillow by PCB's warpage, the crack of solder by CTE mismatch, and the crack of IMC layer by mechanical impact. Especially as PCB down-sizing and surface finish is under progress, brittle failure of IMC layer between solder bump and PCB pad becomes a big issue. Therefore, it requires enhancing the level of difficulty in the existing assessment method and improving the measurement through the study on the mechanism of IMC formation, growth and brittle failure. Under this circumstance, this study is intended to suggest the direction of research for improving the reliability on the crack such as improvement of IMC brittle fracture.