• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.60-63
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• 2002

Metal/intermetallic laminated composites have been manufactured by SHS reactions between Ni and Al elemental metal foils. Microstructure showed that the intermetallic volume fraction was 55%, 45%, 35% in the 1:1, 2:1, 4:1 thickness ratio(Ni:Al) specimen and the main phases of the intermetallic were transformed from $Ni_2Al_3$ to NiAl when the thickness ratio was increased. Tensile strength and elongation were increased when the volume fraction of Ni metallic phase was increased. Under assumptions of isostrain condition, the tensile strength of metal/intermetallic laminated composites didn't obey the ROM due to the thermal residual stress and this was confirmed by X-ray residual stress analysis. Fracture toughness results by the SENB test showed R-curves with upward curvature based on LSB condition. Bridging stress based on LSB condition was determined by the curve fitting analysis, In-situ observed microstructure during fracture test showed that the various bridging mechanism such as crack bridging, crack branching and ductile failure of metallic layer were occurred

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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• pp.155-158
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• 2002

Fabrication process of metal/intermetallic laminated composites by using self-propagating high temperature synthesis(SHS) reactions between Ni and Al elemental metal foils have been investigated. Al foils were sandwiched between Ni foils and heated in a vacuum hot press to the melting point of aluminium. SHS reaction kinetics was thermodynamically analyzed through the final volume fraction of the unreacted Al related with the initial thickness ratio of Ni:Al and diffusion bonding stage before SHS reaction. Thermal aging of laminated composites resulted in the formation of functionally gradient series of intermetallic phases. Microstructure showed that the main phases of intermetallics were NiAl and $Ni_3Al$ having higher strength at room and high temperatures. The volume fractions of intermetallic phases were measured as 82.4, 58.6, 38.4% in 1:1, 2:1, 4:1 initial thickness ratio of Ni:Al.

• 한국재료학회지
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• 제17권3호
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• pp.179-183
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• 2007

A plate heat exchanger (PHE) normally uses vacuum brazing technology for connecting plates and fins. However, the reliability of high temperature brazing, especially with nickel-based filler metals containing boron the formation of brittle intermetallic compounds (IMCs) in brazed joints is of major concern. since they considerably degrade the mechanical properties. This research was examined the vacuum brazing of commercially SUS304 stainless steel with BNi-2 (Ni-Cr-B-Si) filler metal, and discussed to determine the influence of brazing temperatures on the microstructure and mechanical strength of brazed joints. In the metallographic analysis it is observed that considerable large area of Cr-B intermetallic compound phases at the brazing layer and the brazing tensile strength is related to removal of this brittle phase greatly. The mechanical properties of brazing layer could be stabilized through increasing the brazing temperature over $100^{\circ}C$ more than melting temperature of filler metals, and diffusing enough the brittle intermetallic compound formed in the brazing layer to the base metal.

• Bulletin of the Korean Chemical Society
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• 제29권9호
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• pp.1787-1789
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• 2008

• Composites Research
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• 제16권3호
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• pp.68-74
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• 2003

본 논문에서는 Ni과 Al 금속박판 사이의 자전고온반응을 이용한 금속간화합물/금속 적층복합재료의 제조시 제조공정 조건이 최종 미세조직에 미치는 영향을 연구하였다. 열분석을 통하여 Ni과 Al사이의 반응은 먼저 NiA1$_3$가 핵생성­성장 기구에 의해 생성된 후 다시 Ni$_2$A1$_3$로 확산변태됨을 확인하였다. 자전고온반응을 열역학적으로 해석하여 금속박판의 두께비(Ni:Al) 및 반응전 열처리와 반응후 미세조직에서 잔류한 Al의 부피분율과의 관계를 정립하였다. 후열처리 공정에 의해 Ni/Nl$_3$Al/NiAl의 적층구조와 각 두께비에서 82%(1:1), 59.5%(2:1), 40%(4:1)의 부피분율을 가지는 금속간화합물/금속적층복합재료를 얻을 수 있었다.

• Journal of Welding and Joining
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• 제20권5호
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• pp.106-112
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• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.555-560
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• 2002

Brazing of Al to Cu using AI-Si-Mg-Bi brazing alloy has been carried out in the vacuum furnace. In the bonded interlayer, there were two kinds of intermetallic compounds. One of these intermetallic compounds was e phase and the other was b phase. The growth of b phase was controlled by diffusion Al into Cu. Deformation behavior of Al-Cu brazing joint was brittle without deformation of the base metal. Shear strength of the joint was only about 20MPa. The shear specimen broken in the intermetallic compound, which was mainly e phase. Shear strength did not depend on the bonding temperature.

• 한국분말재료학회지
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• 제6권1호
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• pp.49-55
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• 1999

Al-Cr-Zr nanocomposite metal powders were prepared by mechnical alloying (MA) in order to develop aircraft structure materials with lighter weight and lower cost than the conventional Ti and Ni alloys. The morphological changes and microstrutural evolution of Al-6wt.%Cr-3wt.%Zr nanocomposite metal powders during MA were investigated by SEM, XRD and TEM. The approximately 50$\mu$m sized Al-Cr-Zr nanocomposite metal powders has been formed after 20 h of MA. The individual X-ray diffraction peaks of Al, Cr and Zr were broadened and peak intensitied were decreased as a function of MA time. The observed Al crystallite size by TEM was in the range of 20 nm, which is a simliar value calculated by Scherrer equation. The microhardness of Al-Cr-Zr nanocomposite metal powders increases alomost linearly with increase of the processing time, reaching a saturation hardness value of 127 kg/$mm^2$ after 20 h of processing. The intermetallic compound phase of $Al_3Zr_4$ in the matrix was identifed by XRD and TEM.

• 마이크로전자및패키징학회지
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• 제9권2호
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• pp.1-9
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• 2002

실제 BGA패키지에서 Sn-Ag-(Cu) 솔더와 금속패드가 반응하여 생성된 금속간 화합물의 특성을 Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS)f) X-ray Diffractometer (XRD)를 사용하여 분석하였다. EDS로 분석한 결과를 보면 BGA 패키지에서 Sn-Ag-Cu 솔더와 Au/Ni/Cu 금속층간의 반응으로 생성된 금속간화합물은 $(Cu,Ni)_6Sn_5$로 예상되며 . Cu의 편석은 솔더와 Ni 층 사이에서 발견되었다. XRD 분석결과 Cu를 함유하고 있는 Sn-Ag-Cu 솔더와 Ni층 사이에서는 $\eta -Cu_6 Sn_5$ 타입의 금속간화합물이 분석되었으며 Sn-Ag 솔더와 Ni층 사이에서는 $Ni_3$Sn_4$가 분석되었다. 계면에 생성된 금속간화합물은 리플로 회수와솔더내의 Cu의 함량에 따라증가하였다

• Bulletin of the Korean Chemical Society
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• 제27권12호
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• pp.2045-2050
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• 2006

The interstitial hydrogen bonding in NiTi solid and its effect on the metal-to-metal bond is investigated by means of the EH tight-binding method. Electronic structures of octahedral clusters $Ti_4Ni_2$ with and without hydrogen in their centers are also calculated using the cluster model. The metal d states that interact with H 1s are mainly metal-metal bonding. The metal-metal bond strength is diminished as the new metal-hydrogen bond is formed. The causes of this bond weakening are analyzed in detail.