• 제목/요약/키워드: Interlocking

검색결과 489건 처리시간 0.027초

다발성 섬유성 골이형성증 변형에 대한 나사못 맞물림 골수정을 이용한 치료 (Treatment of Deformity in Polyostotic Fibrous Dysplasia Using Interlocking Intramedullary Nailing)

  • 이광석;오종건;구자성
    • 대한골관절종양학회지
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    • 제1권2호
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    • pp.249-253
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    • 1995
  • The fibrous dysplasia is a progressive and disabling condition that lead to deformity, especially weight bearing bones. The morbidity that is associated with the polyostotic fibrous dysplasia is the recurrent fracture and deformity. Various methods of treatment had been failed to control this problem. We used osteotomy and reconstruction nailing for polyostotic fibrous dysplasia occured in the proximal part of right femur with varus deformity and reconstruction nailing in left femur without osteotomy, and interlocking intramedullary nailing in right tibia to prevent pathologic fracture. These methods brought a good result of bone union and full weight bearing ambulation after 1 year and 6 month follow up. We think these methods are useful methods to control refracture and deformity, so we reported this case with bibliographic reviews.

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Unilateral Lumbosacral Facet Interlocking without Facet Fracture

  • Ha, Sang-Woo;Ju, Chang-Il;Kim, Seok-Won;Um, Chang-Su
    • Journal of Korean Neurosurgical Society
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    • 제45권3호
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    • pp.182-184
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    • 2009
  • Acute traumatic spondylolisthesis at L5-S1 level is a rare condition, almost exclusively the result of major trauma, frequently associated with transverse process fractures and severe neurologic deficits. Recently, open reduction and internal fixation with posterior stabilization has been the method of treatment most frequently reported. We report a rare case of traumatic L5-S1 spondylolisthesis with a unilateral facet locking with a review of literatures.

Spiral 철근 배근된 전단벽 단부의 내진성능 연구를 위한 예비 고찰 (Preliminary Study on Boundary Detailing of Structural Wall with Spirals)

  • 김록배;홍성걸
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2000년도 가을 학술발표회논문집(I)
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    • pp.589-594
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    • 2000
  • The necessary strength and ductility to avoid structural damage under moderate earthquake can be achieved by properly detailed transverse reinforcement in the plastic hinge zone. However, most structural walls have a higher aspect ratio(M/Vl\ulcorner) without well confined boundary regions. Therefore there is a need for adequate detailing in the plastic hinge zone, particularly boundary regions. In this paper, the fabricated interlocking spirals is introduced as a new seismic detailing for ductile behavior of the structural walls to be able to substitute for existing complicated detailing with ties. This paper also investigates the behavior characteristics of structural walls with interlocking spirals including confinement of the concrete and strength associated with flexure and shear.

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도시 쓰레기 소각 비산재를 활용한 인공골재의 인터로킹 블록 적용 (The Applications of the Artificial Aggregate using the Municipal Waste Incineration Fly-Ash to Interlocking Block)

  • 김대규;윤성진;문경주;소양섭
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2003년도 봄 학술발표회 논문집
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    • pp.327-332
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    • 2003
  • The incinerated municipal waste can be classified into two general types of ash; fly ash and bottom ash. The fly ash is appointed as specified waste, because it contains harmful heavy metals, ie Pb , Cd, etc. more than permitted standard index. The purpose of this study is to manufacture the non-sintering artificial aggregates using municipal waste incineration fly-ash and to evaluate their applications as coarse aggregates in concrete interlocking block. The test results of water absorpsion, strengths of the concrete block using artificial aggregates showed that the artificial aggregates could be used in part of 10-20% as coarse aggregate in concrete block.

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A STUDY ON CONTINUOUS POSITIONING METHOD USING INTERLOCKING RFID AND GPS

  • Song, Woo-Seok;Lee, Jung-Ho;Bea, Hwan-Sung;Yu, Ki-Yun
    • 대한원격탐사학회:학술대회논문집
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    • 대한원격탐사학회 2007년도 Proceedings of ISRS 2007
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    • pp.564-567
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    • 2007
  • GPS(Global Positioning System) data has a high accuracy at outdoor positioning generally, but its accuracy decreases in the urban areas with dense buildings. Moreover insufficient number of satelllites prevent us GPS positioning at inside of buildings. To complement these shortcomings of GPS, RFID(Radio Frequency IDentification) has been studied on indoor positioning parts. In Ubiquitous environment, LBS(Location Based Service) which can be used anytime and anywhere is an essential component. We use kalman filter to estimate the real location in GPS and RFID handover area. This study's purpose is to make a continuous positioning system using interlocking RFID and GPS.

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ESS 연동형 스마트 플러그 기반의 미디어 플랫폼 설계 (Design of Smart Plug based Media Platform interlocking with ESS)

  • 강민구
    • 스마트미디어저널
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    • 제3권2호
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    • pp.37-42
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    • 2014
  • 본 논문에서는 갑작스런 전력난이나 피크 전력시간 등의 비상 전력상황에서 필수적으로 동작해야 할 정보기기기가 전력을 공급받기 위해 우선순위(Priority) 제어기능을 부여한 스마트 플러그 기반의 스마트 콘센트에 의한 스마트 모니터링 및 표시장치를 갖는 스마트 미디어 플랫폼의 제어기능 설계를 제안한다. 이러한 스마트 게이트웨이는 에너지 저장장치(ESS, Energy Storage System)와 연동함으로서 스마트 플러그가 양방향 송배전과 우선순위 제어형 스마트 제어모듈에 의한 전력관리 효율을 극대화할 수 있다.

준설매립지반의 세립토가 액상화 강도에 미치는 영향 (Effect of Liquefaction Resistence of Fine-Grained Soils on the Reclaimed Land)

  • 김종국;윤원섭;박상준;채영수
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 2008년도 추계 학술발표회
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    • pp.1717-1726
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    • 2008
  • Vibration triaxial compression test was put in influence for liquefaction strength of fine grained soil of dredged and reclaimed ground and consideration for fine fraction content, relative density, overconsolidation ratio and plasticity index in this study. By the results of these test, the liquefaction strength increased with fine fraction content and the relative density, overconsolidation ratio incresed with liquefaction strength too. However, in the case of nonplastic silt was the smalist liquefaction strength which influenced by dilatancy and interlocking when silt content was 34.7%(average grading 0.12mm). Therefore, liquefaction strength of fine grained soil of dredged and reclaimed ground increased with fine fraction content so it will help to make lower liquefaction.

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표면매립공법으로 휨보강된 RC보의 부착파괴 방지 상세에 대한 실험연구 (An Experimental Study to Prevent Debonding Failure of RC Beams Strengthened with Near Surface Mounted CFRP)

  • 정우태;박종섭;유영준;박영환;강재윤
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2004년도 추계 학술발표회 제16권2호
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    • pp.469-472
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    • 2004
  • This paper presents test results to prevent debonding failure of reinforced concrete beams strengthened with near-surface mounted(NSM) CFRP. Beams strengthened with different strengthening systems with externally bonded CFRP, NSM CFRP and NSM CFRP with mechanical interlocking. Test results indicated that using NSM CFRP is improved the stiffness and increased the flexural capacity of RC beams and NSM CFRP with mechanical interlocking prevented debonding failure of RC beams.

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Irregular Failures at Metal/polymer Interfaces

  • Lee, Ho-Young
    • 한국표면공학회지
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    • 제36권4호
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    • pp.347-355
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    • 2003
  • Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

칩 스택 패키지용 Sn 관통-실리콘-비아 형성공정 및 접속공정 (Formation of Sn Through-Silicon-Via and Its Interconnection Process for Chip Stack Packages)

  • 김민영;오택수;오태성
    • 대한금속재료학회지
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    • 제48권6호
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    • pp.557-564
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    • 2010
  • Formation of Sn through-silicon-via (TSV) and its interconnection processes were studied in order to form a three-dimensional interconnection structure of chip-stack packages. Different from the conventional formation of Cu TSVs, which require a complicated Cu electroplating process, Sn TSVs can be formed easily by Sn electroplating and reflow. Sn via-filling behavior did not depend on the shape of the Sn electroplated layer, allowing a much wider process window for the formation of Sn TSVs compared to the conventional Cu TSV process. Interlocking joints were processed by intercalation of Cu bumps into Sn vias to form interconnections between chips with Sn TSVs, and the mechanical integrity of the interlocking joints was evaluated with a die shear test.