• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.392-394
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• 1995

The interfacial charge distribution was investigated using PE laminate system. It was found that a proper treatment of the interlace could decrease the amount of charge accumulated at the interfaces. High lamination temperature and long lamination time brought about little interfacial charge. It was also observed that the interfacial charge could be decreased by the addition of chemicals which had charge trap or hopping site.

• Journal of the Korean Society of Industry Convergence
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• v.2 no.2
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• pp.131-137
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• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• 한국정보컨버전스학회:학술대회논문집
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• 2008.06a
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• pp.173-176
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• 2008

Among human body parts, the human face has been studied the most actively for the interlace between humans and computers because face has statistic consistency in color, shape and texture. Those characteristics make computers detect and track human faces in images robustly and accurately. The human face consists of eyes, nose, mouth, eyebrows and other features, Detecting and tracking each feature have been researched. The open mouth is the largest in size and the easiest to detect among them, In this study, we present a system which can move mouse pointer using the position and state of the mouth.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.05a
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• pp.103-104
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• 2006

In this paper. we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interlace. $Pb_{1.1}(Zr_{0.52}Ti_{0.48})O_3$ (shortly PZT) ferroelectric film was fabricated by the sol-gel method. And then. we compared the structural characteristics before and alter CMP process of PZT films. Their dependence on slurry composition was also investigated. We expect that our results will be useful promise of global planarization for ferroelectric random access memories (FRAM) application in the near future.

• Journal of Magnetics
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• v.6 no.4
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• pp.145-147
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• 2001

The effect of interface roughness between [Ni/Mn] superlattice and pinned NiFe layer on magnetoresistance (MR) of [Ni/Mn] superlattice-based spin valve films was investigated. Antiferromagnetic phase structure and interface roughness of [Ni/Mn] superlattice spin valve films were compared in the as-deposited and the annealed samples at 240$\^{C}$, respectively. Surface morphology of spin valves was substantially flattened due to the formation of the antiferromatic NiMn phase. In case of Co insertion between Cu and NiFe, the interlace roughness and MR ratio in the annealed [NiMn] superlattice and pinned NiFe/Co layer increased more than those in the annealed [Ni/Mn] superlattice and pinned NiFe layers respectively.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1323-1326
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• 1994

the application of epoxy composite materials for outdoor insulating systems has some significant advantages compared with conventional inorganic materials, that is low weight in combination with high mechanical strength, small dimensions and design versatility. The experimental results for the basis composition and interlace characteristics of the matrix resin/inorganic fillers($SiO_2$) which are the composite materials have been studied. The electrical characteristics(electrical breakdown, dielectric, insulating resistivity, tracking) and mechanical characteristics( tensile strength, elongation, flexible strength) in the epoxy composite materials have been studied. The life of the epoxy composite material was evaluated by accelerated Weather-Ometer test and the degradation process due to outdoor exposure condition is discussed with respect to the mechanical and electrical properties.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.34C no.2
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• pp.19-28
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• 1997

This paper presents the design of an SSIC chip for synchronization between main and sub pictures in the multi channel TV system (MUCTS). This chip can resolve problems in MUCTS, such as passing through and vertical jolt phenomena. In addition, this chip rpvivides compatibility for normal/doulble scan, interlace/progressive and normal (4:3)/wide (16:9) systems and has high hjorizontal and vertical resolutions (340) dots and 150 lines). In each mode there are 1 channel, 3 channel, and 4 position display functions. This MUCTS chip including three A/D coverters, a D/A converter and seven line memories was fabricated with one chip by using the $0.8\mu\textrm{m}$ CMOS technology. The application areas of this MUCTS ASIC chip include the wide TV, projection TV and te next generation TV for the DBS (direct broadcast system).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.11
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• pp.959-964
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• 2007

To investigate the influence of partial discharge(PD) distribution characteristics due to various defects on the power cable joints interface, we used the K-means clustering method. As the result of PD number(n) distribution analyzing on $\Phi-n$ graph, the phase angle($\Phi$) of cluster centroid shifted to $0^{\circ}\;and\;180^{\circ}$ increasing with applying voltage. It was confirmed that the PD quantify(q) and euclidean distance of centroid were increased with applying voltage from the centroid distribution analyzing of $\Phi-q$ plane. The dispersion degree was increased with calculated standard deviation of the $\Phi-q$ cluster centroid. The PD number and mean value on $\Phi-q$ graph were some different by electric field concentration with defect types.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2004.05a
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• pp.101-105
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• 2004

In this paper, theoretical basis of stereoscopic display is investigated and programmed to shaw the application which could be used in the Virtual Reality (VR), especially for ship design. Stereoscopic is based on the seperated view point of left and right eyes on the screen and making 3 dimensional image. There different stereoscopic methods such are red-blue, interlacing, side-by-side and above-below are imvestigated and implemente to shaw the simple ship model and inside of ship. To shaw the 3 dimensional view, OpenGL is used to make program by implementing the logic of stereoscopic. Simple models and ship design are implemented to survey the applicability of stereoscopic for ship design. The best way is to use two projectors to emit interlaced shape. It is expected to imply this technique in the VR application for ship design.

• 한국HCI학회:학술대회논문집
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• 2008.02a
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• pp.240-244
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• 2008

This paper presents an EMG-based wireless and wearable computer interface. The wearable device contains 4 channel EMG sensors and is able to acquire EMG signals using signal processing. Obtained signals are transmitted to a host computer through wireless communication. EMG signals induced by the volitional movements are acquired from four sites in the lower limb to extract a user's intention and six classes of wrist movements are discriminated by employing an artificial neural network (ANN). This interface could provide an aid to the limb disabled to directly access to computers and network environments without conventional computer interface such as a keyboard and a mouse.