• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.12
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• pp.3202-3218
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• 1994

Mode shapes and natural frequencies of vibrating laminated composite plates are taken using real-time and time-average holographic interferometry. Debonds and delamination in the laminated plates are measured nondestructively. During holographic testing of composite plates, it has been found that the conditions for the local resonance in debonds are strongly dependent on the frequency of excitation. A membrane resonance model was proposed to describe this behavior. Relations between characteristic length according to the size, shape of debonds and membrane resonance frequency are presented. Several experiments were performed to verify the membrane resonance model. The agreements between the predicted excitation frequency and the observed resonance frequency are good. The experimental results show that higher stresses and strains due to local resonance lead to the debond detection.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.86-87
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• 2007

The dispersive method of white-light interferometry is proper for in-line 3-D inspection of dielectric thin-film thickness to be used in the semiconductor and flat-panel display industry. This research is the measurement application of CMP patterned wafer. The results describe 3-D and 2-D profile of the step height during polishing time.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.6
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• pp.1382-1390
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• 1995

Electronic Speckle Pattern Interferometry (ESPI) with a CW laser, a video system and an image processor was utilized to measure the in-plane displacement. Unlike traditional strain gauges or Moire method. ESPI method measure the in-plane displacement on real time with out any surface preparation on surface attachment. The specimen has a crack of 10*0.1 mm in the middle of plate and strain gauge was also attached on that surface to compare with ESPI method. This study reveled the ESPI method to measure the displacement and distribution of strain in the specimen. It was shown in tensile tests that the measurement by ESPI method was comparable with strain gauge.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.91-95
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• 1997

ESPI(Electronic Speckle Pattern Interferometry) is new optical measuring method to be able to measure the surface deformations of engineering components and materials in industrial areas. Conventional measuring method of surface deformation such as the strain gauge have many demerits because it is contact and point-to-point measuring one. But ESPI that is non-contact, whole field measuring method can overcome previous disadvantages. The speckle pattern to be formed with interference phenomena of scattering light from rough surfaces illuminated by laser light have phase information of surface In this study we used this interference phenomena and the phase shifting method to measure the in- plane deformation, together with the use of digital equipment to process the information contained in the speckle pattern and to display consequent inter ferograms. Finally we obtained good agreement between the experimenta results and those of FEM..

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.2
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• pp.104-109
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• 2011

I present a method of aspheric surface profile measurement using 2nd derivative of local area profile. This method is based on the principle of curvature sensor which measures the local 2nd derivative under test along a line. The profile is then reconstructed from the data on the each point. Unlike subaperture-stiching method and slope detection method, 2nd derivative method has strong points from a geometric point of view in measuring the aspheric surface profile. The second derivative terms of surface profile is an intrinsic property of the test piece, which is independent of its position and tip-tilt motion. The curvature is measured at every local area with high accuracy and high lateral resolution by using White-light scanning interferometry.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.2
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• pp.107-114
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• 2017

In this investigation, we describe a metrological technique for surface and thickness profiles of a silicon (Si) wafer by using a 6 degree of freedom (DOF) stitching method. Low coherence scanning interferometry employing near infrared light, partially transparent to a Si wafer, is adopted to simultaneously measure the surface and thickness profiles of the wafer. For the large field of view, a stitching method of the sub-aperture measurement is added to the measurement system; also, 6 DOF parameters, including the lateral positioning errors and the rotational error, are considered. In the experiment, surface profiles of a double-sided polished wafer with a 100 mm diameter were measured with the sub-aperture of an 18 mm diameter at $10\times10$ locations and the surface profiles of both sides were stitched with the sub-aperture maps. As a result, the nominal thickness of the wafer was $483.2{\mu}m$ and the calculated PV values of both surfaces were $16.57{\mu}m$ and $17.12{\mu}m$, respectively.

• Journal of the Optical Society of Korea
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• v.17 no.4
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• pp.317-322
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• 2013

We have proposed and demonstrated a low numerical aperture technique to measure the depth of through silicon vias (TSVs) using white-light scanning interferometry. The high aspect ratio hole like TSV's was considered to be impossible to measure using conventional optical methods due to low visibility at the bottom of the hole. We assumed that the limitation of the measurement was caused by reflection attenuation in TSVs. A novel interference theory which takes the structural reflection attenuation into consideration was proposed and simulated. As a result, we figured out that the low visibility in the interference signal was caused by the unbalanced light intensity between the object and the reference mirror. Unbalanced light can be balanced using an aperture at the illumination optics. As a result of simulation and experiment, we figured out that the interference signal can be enhanced using the proposed technique. With the proposed optics, the depth of TSVs having an aspect ratio of 11.2 was measured in 5 seconds. The proposed method is expected to be an alternative method for 3-D inspection of TSVs.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.04a
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• pp.48-53
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• 1997

Electronic Speckle Pattern Interferometry(ESPI) using the Model 95 Ar laserm, a video system and an image processor was applied to the in-plane displacement measurements. Unlike traditional strain gauges or moire method, ESPI method requires no special surface preparation or attachments and can be measured in-plane displacement with no contact and real time. In this experiment wpecimen was loaded in parallel with a loadcell. The specimen was the cold rolled sdteel sheet of 2mm thickness, which was attached strain gauges. The study provides an example of how ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI compare with the data which was measured by strain gauge method in tensile testing.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.349-353
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• 2005

This paper describes the variations of resonance frequencies and vibration mode shapes of laser welded cold rolled carbon steel plate(SCP1) induced by thermal loading during laser welding processing. The characteristics of those are analyzed with stroboscopic ESPI. Electronic speckle pattern interferometry (ESPI) that the electronic processes were added to SPI is one of the very powerful method in the experimental vibration analysis field. Stroboscopic ESPI to make it reliable are compared with theory and experimental method: Finite Element Method(FEM) and Scanning Laser Doppler Vibrometer(SLDV). The results of stroboscopic ESPI are well agreed with SLDV and also the comparison with theory give good agrement within $5\%$.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1996.10a
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• pp.414-421
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• 1996

The study of the vibration characteristics of annular sector plates which are clamped along their inner circumferential edge is important for structural engineers. The present analysis consists of experimental method and numerical method. The experimental method using time-average holographic interferometry is obtained vibration modes and frequencies. The experimental results are verified by a numerical method using F.E.M. The important aspects of the present paper is the dependence of the natural frequencies and the mode shape on the annular area changing sector angle. The radial nodal lines converge to the center of the plate. As increasing sector angle, the radial modes are predominant.