• 한국응용과학기술학회지
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• 제26권3호
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• pp.288-296
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• 2009

In this study, the silica-based hybrid material with high barrier property was prepared by incorporating ethylene-vinyl alcohol (EVOH) copolymer, which has been utilized as packaging materials due to its superior gas permeation resistance, during sol-gel process. In preparation of this EVOH/$SiO_2$ hybrid coating materials, the (3-glycidoxy-propyl)-trimethoxysilane (GPTMS) as a silane coupling agent was employed to promote interfacial adhesion between organic and inorganic phases. As confirmed from FT-IR analysis, the physical interaction between two phases was improved due to the increased hydrogen bonding, resulting in homogeneous microstructure with dispersion of nano-sized silica particles. However, depending on the range of content of added silane coupling agent (GPTMS), micro-phase separated microstructure in the hybrid could be observed due to insufficient interfacial attraction or possibility of polymerization reaction of epoxide ring in GPTMS. The oxygen barrier property of the mono-layer coated BOPP (biaxially oriented polypropylene) film was examined for the hybrids containing various GPTMS contents. Consequently, it is revealed that GPTMS should be used in an optimum level of content to produce the high barrier EVOH/$SiO_2$ hybrid material with an improved optical transparency and homogeneous phase morphology.

• 한국세라믹학회지
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• 제44권12호
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• pp.727-732
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• 2007

In order to fabricate a highly performing cathode for low-temperature type solid oxide fuel cells working at below $700^{\circ}C$, electrode microstructure control and electrode polarization measurement were performed with an electronic conductor, $La_{0.8}Sr_{0.2}MnO_3$ (LSM) and a mixed conductor, $La_{0.6}Sr_{0.4}Co_{0.2}Fe_{0.8}O_3$(LSCF). For both cathode materials, when $Sm_{0.2}Ce_{0.8}O_2$ (SDC) buffer layer was formed between the cathode and yttria-stabilized zirconia (YSZ) electrolyte, interfacial reaction products were effectively prevented at the high temperature of cathode sintering and the electrode polarization was also reduced. Moreover, cathode polarization was greatly reduced by applying the SDC sol-gel coating on the cathode pore surface, which can increase triple phase boundary from the electrolyte interface to the electrode surface. For the LSCF cathode with the SDC buffer layer and modified by the SDC sol-gel coating on the cathode pore surface, the cathode resistance was as low as 0.11 ${\Omega}{\cdot}cm^2$ measured at $700^{\circ}C$ in air atmosphere.

• Bulletin of the Korean Chemical Society
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• 제24권11호
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• pp.1659-1663
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• 2003

$Al_2O_3$ thin films were grown on H-terminated Si(001) substrates using dimethylaluminum isopropoxide [DMAl: $(CH_3)_2AlOCH(CH_3)_2$], as a new Al precursor, and water by atomic layer deposition (ALD). The selflimiting ALD process by alternate surface reactions of DMAI and $H_2O$ was confirmed from measured thicknesses of the aluminum oxide films as functions of the DMAI pulse time and the number of DMAI-$H_2O$ cycles. Under optimal reaction conditions, a growth rate of ~1.06 ${\AA}$ per ALD cycle was achieved at the substrate temperature of $150\;^{\circ}C$. From a mass spectrometric study of the DMAI-$D_2O$ ALD process, it was determined that the overall binary reaction for the deposition of $Al_2O_3\;[2\;(CH_3)_2AlOCH(CH_3)_2\;+\;3\;H_2O\;{\rightarrow}\;Al_2O_3\;+\;4\;CH_4\;+\;2\;HOCH(CH_3)_2]$can be separated into the following two half-reactions: where the asterisks designate the surface species. Growth of stoichiometric $Al_2O_3$ thin films with carbon incorporation less than 1.5 atomic % was confirmed by depth profiling Auger electron spectroscopy. Atomic force microscopy images show atomically flat and uniform surfaces. X-ray photoelectron spectroscopy and cross-sectional high resolution transmission electron microscopy of an $Al_2O_3$ film indicate that there is no distinguishable interfacial Si oxide layer except that a very thin layer of aluminum silicate may have been formed between the $Al_2O_3$ film and the Si substrate. C-V measurements of an $Al_2O_3$ film showed capacitance values comparable to previously reported values.

• Restorative Dentistry and Endodontics
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• 제33권4호
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• pp.405-412
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• 2008

본 연구의 목적은 여러 가지 계면조건의 변화를 통해서 layering시 복합레진 층간의 결합에 oxygen inhibition layer (OIL)가 필수적인지를 고찰해보는 것이다. 가로 $\times$ 세로 $\times$ 두께가 16 $\times$ 28 $\times$ 2.5 mm인 알루미늄판에 지름 3.7 mm의 구멍을 형성하여 몰드를 제작하고 다음과 같이 복합레진 (Z-250, 3M ESPE)을 충전하여 광중합하였다. 1 군: 하층판에 복합레진을 충전하고 광중합 한 후, 상층판을 접합하고 레진을 충전하여 광중합을 하였다 (OIL를 남김). 2 군: 하층판에 복합레진을 충전하고 광중합 한 후 acetone에 적신 cotton으로 문질러서 OIL를 제거하고 상층판을 접합하여 복합레진을 충전하고 광중합을 하였다 (OIL를 제거). 3 군: 하층판에 복합레진을 충전하고 Mylar strip을 접합하여 공기와의 접촉을 차단한 후 광중합을 하였다. Mylar strip을 제거하고 상층판을 접합 후 복합레진을 충전하여 광중합을 하였다 (OIL형성을 억제). 4 군: 하층판에 복합레진을 충전하고 광중합 한 후 glycerin을 OIL 표면에 도포하고 다시 광중합하였다. 상층판을 접합하여 복합레진을 충전하고 광중합을 하였다 (OIL를 중합). 5군 (대조군): 하층판과 상층판의 경계에 복합레진층의 계면이 위치하지 않도록 복합레진을 bulk충전하였다 (계면형성 없이 bulk 충전한 복합레진). 24 시간 100% 습도에서 보관 후 상층판과 하층판 사이의 계면 전단결합강도를 측정하고 파절 양상을 관찰하였다. 계면을 통한 중합과정의 확산을 관찰하기 위하여 제조한 광개시제가 들어있지 않은 실험적 복합레진 (Exp_Com)을 몰드에 충전하고 상부에 flowable 복합 레진 (Aelite Flow) 또는 접착레진 (ScotchBond Multipurpose)을 접촉시킨 후 광조사하였다. 몰드내의 미중합된 Exp_Com을 acetone bath 에서 5 분 동안 제거한 후 몰드내에 다시 Aelite Flow를 충전하고 광중합을 시행하였다. 경화된 복합레진 시편의 단면을 관찰하여 Exp_Com 층의 두께를 측정하였다. OIL를 배제하거나 중합시킨 2-4군은 OIL이 존재하는 1 군과 통계적으로 유의한 결합강도의 차이를 보이지 않았으며, Mylar strip을 이용하여 OIL의 생성을 억제했던 3군과 glycerin을 도포하여 OIL를 중합시킨 4군은 계면을 생성하지 않은 대조군인 5 군과도 통계적으로 유의한 차이를 보이지 않았다. 중합과정의 확산에 의해 중합개시제가 포함되지 않은 Exp_Com내에 중합된 층이 생겨난 것을 시각적으로 확인할 수 있었으며, Exp_Com의 중합층 두께는 flowable 레진의 경우 20.95 (0.90) um였고 접착레진의 경우 42.13 (2.09) 였다.

• 한국해양공학회지
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• 제25권4호
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• pp.66-71
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• 2011

The flexural strength of $MoSi_2$ based composites reinforced with Nb sheets has been investigated, based on the detailed examination of their microstructure and fractured surface. Both sintered density and porosity of Nb/$MoSi_2$ composites were also examined. Nb/$MoSi_2$ composites were fabricated by different conditions such as temperature, applied pressure and its holding time, using a hot-press device. The volume fraction of Nb sheet in this composite system was fixed as 10%. The characterization of Nb/$MoSi_2$ composites were investigated by means of optical microscopy, scanning electron microscope and three point bending test. Nb/$MoSi_2$ composites represented a dense morphology at the interfacial region, accompanying the creation of two types of reaction layer by the chemical reaction of Nb and $MoSi_2$. Nb/$MoSi_2$ composites possessed an excellent density at the fabricating temperature of $1350^{\circ}C$, corresponded to about 95% of theoretical density. The flexural strength of Nb/$MoSi_2$ romposites were greatly affected by the pressure holding time at the same fabricating temperature, owing to the large suppression of porosity in the microstructure. Especially, Nb/$MoSi_2$ composites represented a good flexural strength of about 310 MPa at the fabricating condition of $1350^{\circ}C$, 30MPa and 60min, accompanying the pseudo-ductile fracture behavior by the deformation of Nb sheet and the interfacial delamination.

• 한국재료학회지
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• 제29권10호
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• pp.617-622
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• 2019

In order to develop a process for manufacturing a composite structure of an intermetallic compound foam and a hollow material, the firing and pore form of the Al-Ni precursor in a steel pipe are investigated. When the Al-Ni precursor is foamed in a hollow pipe, if the temperature distribution inside the precursor is uneven, the pore shape distribution becomes uneven. In free foaming, no anisotropy is observed in the foaming direction and the pore shape is isotropic. However, in the hollow pipe, the pipe expands in the pipe axis direction and fills the pipe. The interfacial adhesion between $Al_3Ni$ foam and steel pipe is excellent, and interfacial pore and reaction layer are not observed by SEM. In free foaming, the porosity is 90 %, but it decreases to about 80 % in the foam in the pipe. In the pipe foaming, most of the pore shape appears elongated in the pipe direction in the vicinity of the pipe, and this tendency is more remarkable when the inside pipe diameter is small. It can be seen that the pore size of the foam sample in the pipe is larger than that of free foam, because coarse pores remain after solidification of the foam because the shape of the foam is supported by the pipe. The vertical/horizontal length ratio expands along the pipe axis direction by foaming in the pipe, and therefore circularity is reduced.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.1-6
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• 2004

자동차 전장품의 시험환경 조건이 엄격해짐에 따라, 전장품 개발 기술자들은 이에 부합하는 성능, 신뢰성, 비용 등을 고려한 보다 효과적인 제품 설계를 위해 노력하고 있다. 본 논문에서는 ECM 알루미나 기판의 플라즈마 세척 영향과 리플로우 후 Sn-37wt%Pb 솔더와 패드 접합부 계면에서 형성되는 금속간 화합물을 관찰하였다. 기판의 플라즈마 세척은 계면 접착력을 저해하였던 C에 의한 유기 잔류물 층이 제거되어 계면 접착력을 향상시키는 효과가 있다. 또한 AFM 분석 결과 도체 패드의 표면 거칠기는 304 nm에서 330 m로 증가하였다. 리플로우 과정에서 솔더와 TiWN/Cu 패드 계면에서 형성된 $Cu_6/Sn_5$는 리플로우 횟수가 증가할 수록 결정립의 크기도 조대화되었다. 솔더와 Ag-Pd 도체패드 계면에서는 세포질 형태의 $Ag_3Sn$화합물이 관찰되었다. $Ag_3Sn$은 지름이 약 0.1∼0.6 $\mu\textrm{m}$이며, 솔더 내부에서는 침상 모양도 관찰되었다.

• 한국진공학회지
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• 제7권2호
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• pp.104-111
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• 1998

저압 MOCVD 방법을 이용하여 InGaAs/InP 양자우물구조를 성장하였다. 성장 정지 시간에 따른 photoluminescence특성의 변화를 통하여 계면구조를 분석하였다. InP표면을 $PH_3$ 분위기로, InGaAs표면을 $AsH_3$분위기로 유지하며 성장을 정지하는 경우에는 성장 정지 시간이 길어짐에 따라 불순물 유입에 의한 것으로 생각되는 PL반가폭의 증가를 관찰하였다. InP표면에 AsH3을 공급하는 경우에는 As-P교환에 의해 우물층 두께가 증가하여 PL피크가 저에너지로 이동하였고, 반가폭의 변화는 크지 않았다. 계면 양자우물구조를 형성하여 As-P 교환작용에 대해 조사하였고, 1-2monolayer가 InAs유효두께로 계산되었다. InGaAs 표면에 $PH_3$을 공급한 결과, PL피크가 고에너지로 이동하는 것을 관찰하였고 동시에 반가폭도 증가 하였다. 이는 메모리 효과에 의해 InP층으로 As침투를 억제하고, InGaAs표면에서의 국부적 인 As-P교환에 의한 것으로 생각된다.

• 한국수소및신에너지학회논문집
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• 제24권2호
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• pp.186-192
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• 2013

In order to reduce the costs and to improve the durability of solid oxide fuel cell (SOFC), the operating temperature should be decreased while the power density is maintained as much as possible. However, lowering the operating temperature increases the cathode interfacial polarization resistances dramatically, limiting the performance of low-temperature SOFC at especially purely electronic conducting cathode. To improve cathode performance at low temperature, the number of reaction sites for the oxygen reduction should be increased by using a mixed ionic and electronic conducting (MIEC) material. In this study, anode-supported fuel cells with two different thicknesses of the MIEC cathode were fabricated and tested at various operating temperatures. The anode supported cell with $32.5{\mu}m$-thick BSCFZn-LSCF cathode layer showed much lower polarization resistance than that with $3.2{\mu}m$ thick cahtode and higher power density especially at low temperature. The effects of cathode layer thickness on the electrochemical performance are discussed with analysis of impedance spectra.

• 한국재료학회지
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• 제12권9호
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.