• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.771-774
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• 2000

Recently, complex insulation method is used in insulation system for underground power delivery devices. Considering the interfaces which affect stability of insulation system, By modeling interface between Epoxy and Rubber, AC interfacial breakdown properties with variation of many conditions to influence on electrical properties were investigated. In this paper, toughened Epoxy and Silicone rubber were used for materials to make interface .

• 대한기계학회논문집A
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• 제27권7호
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• pp.1159-1169
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• 2003

This paper investigates the effects of T-stress and plastic hardening mismatch on the interfacial crack-tip stress field via finite element analyses. Plane strain elastic-plastic crack-tip fields are modeled with both MBL formulation and a full SEC specimen under pure bending. Modified Prandtl slip line fields illustrate the effects of T-stress on crack-tip constraint in homogeneous material. Compressive T-stress substantially reduces the interfacial crack-tip constraint, but increases the J-contribution by lower hardening material, J$\_$L/. For bimaterials with two elastic-plastic materials, increasing plastic hardening mismatch increases both crack-tip stress constraint in the lower hardening material and J$\_$L/. The fracture toughness for bimaterial joints would consequently be much lower than that of lower hardening homogeneous material. The implication of unbalanced J-integral in bimaterials is also discussed.

• Advances in concrete construction
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• 제7권3호
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• pp.151-166
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• 2019

This paper introduces a new efficient analytical method, based on shear deformations obtained with 2D elasticity theory approach, to perform an explicit closed-form solution for calculation the interfacial shear and normal stresses in plated RC beam. The materials of plate, necessary for the reinforcement of the beam, are in general made with fiber reinforced polymers (Carbon or Glass) or steel. The experimental tests showed that at the ends of the plate, high shear and normal stresses are developed, consequently a debonding phenomenon at this position produce a sudden failure of the soffit plate. The interfacial stresses play a significant role in understanding this premature debonding failure of such repaired structures. In order to efficiently model the calculation of the interfacial stresses we have integrated the effect of shear deformations using the equilibrium equations of the elasticity. The approach of this method includes stress-strain and strain-displacement relationships for the adhesive and adherends. The use of the stresses continuity conditions at interfaces between the adhesive and adherents, results pair of second-order and fourth-order coupled ordinary differential equations. The analytical solution for this coupled differential equations give new explicit closed-form solution including shear deformations effects. This new solution is indented for applications of all plated beam. Finally, numerical results obtained with this method are in agreement of the existing solutions and the experimental results.

• Advances in concrete construction
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• 제1권3호
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• pp.239-252
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• 2013

Mortar microstructure is considered as a three-phase composite material, which is cement paste, fine aggregate and interfacial transition zone. Interfacial transition zone is the weakest link between the cement paste and fine aggregate, so it has a significant role to determine the properties of cementitious composites. In this study, specimens (w/c = 0.35, 0.45, 0.55) with various volume fractions of fine aggregate ($V_f$ = 0, 0.1, 0.2, 0.3 and 0.4) were cast and tested. To predict the equivalent migration coefficient ($M_e$) and migration coefficient of interfacial transition zone ($M_{itz}$), double-inclusion method and Mori-Tanaka theory were used to estimate. There are two stages to estimate and calculate the thickness of interfacial transition zone (h) and migration coefficient of interfacial transition zone ($M_{itz}$). The first stage, the data of experimental chloride ion migration coefficient ($M_s$) was used to calculate the equivalent migration coefficient of fine aggregate with interfacial transition zone ($M_e$) by Mori-Tanaka theory. The second stage, the thickness of interfacial transition zone (h) and migration coefficient of interfacial transition zone ($M_{itz}$) was calculated by Hori and Nemat-Nasser's double inclusion model. Between the theoretical and experimental data a comparison was conducted to investigate the behavior of interfacial transition zone in mortar and the effect of interfacial transition zone on the chloride migration coefficient, the results indicated that the numerical simulations is derived to the $M_{itz}/M_m$ ratio is 2.11~8.28. Additionally, thickness of interfacial transition zone is predicted from $10{\mu}m$, 60 to $80{\mu}m$, 70 to $100{\mu}m$ and 90 to $130{\mu}m$ for SM30, M35, M45 and M55, respectively.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1991년도 봄 학술발표회 논문집
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• pp.65-68
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• 1991

Finite element analysis is used to study the role of interfacial properties on the bond strength of reinforcing steel to concrete. Specifically, the role played by epoxy coatings on the failure of standard beam-end specimens is explored. Experimental results show that epoxy coatings reduce bond strength, but that the effect is dependent on the bar size and the deformation pattern. The finite element model for the beam-end specimen includes representations for the deformed steel bar, the concrete, and the interfacial material. The interface elements can be varied to match the stiffness and friction properties of the interfacial material. Cracking within the concrete is represented using Hillerborg's ficticious crack model. The model is used to study important aspects or behavior observed in the tests and to provide an explanation for the effect of the various test parameters.

• Journal of Mechanical Science and Technology
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• 제15권10호
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• pp.1386-1397
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• 2001

In this paper, the plane elasticity equations are used to investigate the in-plane normal (mode I) and shear (mode II) behavior of a crack perpendicular to and terminating at the interface in bonded media with a graded interfacial zone. The interfacial Bone is treated as a nonhomogeneous interlayer with the continuously varying elastic modulus between the two dissimilar, homogeneous semi-infinite constituents. For each of the individual loading modes, based on the Fourier integral transform technique, a singular integral equation with a Cauchy kernel is derived in a separate but parallel manner. In the numerical results, the values of corresponding modes of stress intensity factors are illustrated for various combinations of material and geometric parameters of the bonded media in conjunction with the effect of the material nonhomogeneity within the graded interfacial zone.

• Structural Engineering and Mechanics
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• 제52권1호
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• pp.1-17
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• 2014

An interfacial penny-shaped crack between piezoelectric layer and elastic half-space subjected to mechanical and electric loads is investigated. Using Hankel transform technique, the mixed boundary value problem is reduced to a system of singular integral equations. The integral equations are further reduced to a system of algebraic equations with the aid of Jacobi polynomials. The stress intensity factor and energy release rate are determined. Numerical results reveal the effects of electric loadings and material parameters of composite on crack propagation and growth. The results seem useful for design of the piezoelectric composite structures and devices of high performance.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.53-57
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• 2002

Reduction of insulation thickness would be beneficial not only for increasing the cable length but would also improve its thermal performance. An interfacial diffusion method was devised to reduce insulation thickness by improving the interfacial properties of XLPE cable insulation. In this paper, to evaluate superficially the interface properties between XLPE insulation and semiconducting layer, the dielectric and insulation properties of tan${\delta}$ and volume resistance were measured with temperature dependence. Above the results, dielectirc and insulation properties with semiconductor/XLPE were more anormal than its bulk caused by the interfacial properties.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.149-152
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• 2000

AC impedance measurements on poly-p-phenylenevinylene (PPV) LEDs in the frequency range between 10 Hz and 10$\^$6/ Hz were carried out. The complex-plane impedance spectra indicate that PPV devices can be represented by equivalent circuits that corresponds to the bulk and interfacial regions at high and low frequencies, respectively. As a result of complex impedance analysis through the separation of bulk and interfacial region impedances, increase of forward bias in Al/PPV/ITO devices gave rise to relative decrease of the interfacial region impedance. Above the electric field of 10$\^$6/ V/cm the PPV device showed a space charge limited current (SCLC) conduction. The dependence of the transport mechanism and dielectric properties on the applied bias voltage is discussed.

• 한국전기전자재료학회논문지
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• 제33권4호
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• pp.255-262
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• 2020

Grain boundaries play a major role in determining device performance, particularly of polysilicon-based photodetectors. Through the post-annealing of as-deposited polysilicon and then, the analysis of electric behavior for a metal-polysilicon-metal (MSM) photodetector, we were able to identify the influence of grain boundaries. A modified model of polysilicon grain boundaries in the MSM structure is presented, which uses a crystalline-interfacial layer-SiO_x layer- interfacial layer-crystalline system that is similar to the Si-SiO₂ system in MOS device. Hydrogen passivation was achieved through a hydrogen ion implantation process and was used to passivate the defects at both interfacial layers. The thin SiO_x layer at the grain boundary can enhance the photosensitivity of an MSM photodetector by decreasing the dark current and increasing the light absorption.