• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 추계학술발표강연 및 논문개요집
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• pp.76-76
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• 1999

Low resistance ohmic contacts to the Si-doped InGaN(~$\times$10$^{19}$ ㎤) were obtained using the W metallization schemes. Specific contact resistance decreased with increasing annealing temperature. The lowest resistance is obtained after a nitrogen ambient annealing at 95$0^{\circ}C$ for 90s, which results in a specific contact resistance of 2.75$\times$10$^{-8}$ Ω$\textrm{cm}^2$. Interfacial reactions and surface are analyzed using x-ray diffraction, transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The X-ray diffraction results show that the reactions between the W film and the InGaN produce a $\beta$-W$_2$N phase at the interface. TEM results also show that the $\beta$-W$_2$N has a rough interface, which increase contact area. It shows that the morphology of the contacts is stable up to a temperature as high as 95$0^{\circ}C$. Possible mechanisms are proposed to describe the annealing temperature dependence of the specific contact resistance.

• 한국전기전자재료학회논문지
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• 제21권11호
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• pp.968-972
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• 2008

Ni/Ti/Al multilayer system ('/'denotes the deposition sequence) was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Ni 30 nm / Ti 50 nm / Al 300 nm layers were sequentially deposited by e-beam evaporation on the 4H-SiC samples which were implanted with Al (norminal doping concentration = $4\times10^{19}cm^{-3}$) and then annealed at $1700^{\circ}C$ for dopant activation. Rapid thermal anneal (RTA) temperature for ohmic contact formation was varied in the range of $840\sim930^{\circ}C$. Specific contact resistances were extracted from the measured current vs. voltage (I-V) data of linear- and circular transfer length method (TLM) patterns. In constrast to Ni contact, Ni/Ti/Al contact shows perfectly linear I-V characteristics, and possesses much lower contact resistance of about $2\sim3\times10^{-4}\Omega{\cdot}cm^2$ even after low-temperature RTA at $840^{\circ}C$, which is about 2 orders of magnitude smaller than that of Ni contact. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance. X-ray diffraction (XRD) analysis indicated the existence of intermetallic compounds of Ni and Al as well as $NiSi_{1-x}$, but characteristic peaks of $Ti_{3}SiC_2$, a probable narrow-gap interfacial alloy responsible for low-resistance Ti/Al ohmic contact formation, were not detected. Therefore, Al in-diffusion into SiC surface region is considered to be the dominant mechanism of improvement in conduction behavior of Ni/Ti/Al contact.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.195-202
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• 2003

In this study, failure mechanisms of Au stud bumps/ACF flip chip joints were investigated underhigh current stressing condition. For the determination of allowable currents, I-V tests were performed on flip chip joints, and applied currents were measured as high as almost 4.2Amps $(4.42\times10^4\;Amp/cm^2)$. Degradation of flip chip joints was observed by in-situ monitoring of Au stud bumps-Al pads contact resistance. All failures, defined at infinite resistance, occurred at upward electron flow (from PCB pads to chip pads) applied bumps (UEB). However, failure did not occur at downward electron flow applied bumps (DEB). Only several $m\Omega$ contact resistance increased because of Au-Al intermetallic compound (IMC) growth. This polarity effect of Au stud bumps was different from that of solder bumps, and the mechanism was investigated by the calculation of chemical and electrical atomic flux. According to SEM and EDS results, major IMC phase was $Au_5Al_2$, and crack propagated along the interface between Au stud bump and IMC resulting in electrical failures at UEB. Therefore. failure mechanisms at Au stud bump/ACF flip chip Joint undo high current density condition are: 1) crack propagation, accompanied with Au-Al IMC growth. reduces contact area resulting in contact resistance increase; and 2) the polarity effect, depending on the direction of electrons. induces and accelerates the interfacial failure at UEBs.

• Composites Research
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• 제22권5호
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• pp.8-14
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• 2009

유리섬유 강화 CNT-에폭시 나노복합재료의 계면특성은 미세역학적 시험법과 젖음성 측정을 통하여 평가하였다. CNT-에폭시 나노복합재료의 접촉저항은 전기적 접촉부가 일정하게 점차적으로 증가하는 경사형 (gradient) 시편으로 측정되었다. CNT-에폭시나노복합재료의 접촉저항은 2-점법 대신에 4-점법을 사용하여 평가하였다. 불균일한 표면에 존재하는 소수성 영역 때문에 CNT-에폭시 나노복합재료의 어떤 부분은 초소수성보다는 다소 낮은 접촉각인 120도를 가졌다. 표면처리된 유리섬유는 에칭된 섬유 표면의 흠이 있지만 인장 강성도는 약간의 변화가 나타나는 반면에, 인장강도는 현저하게 감소하였다. 에칭된 유리섬유와 CNT-에폭시 나노복합재료는 표면 에너지와 거친 정도가 증가함으로써, 계면전단강도가 증가되었다 열역학적 에너지 일인 $W_a$가 증가함에 따라, 기계적 계면전단강도와 겉보기 강성도 모두 상호일치하게 증가를 보여주었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.220.1-220.1
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• 2014

본 연구에서는 PECVD 공법 중에 이온화 에너지가 높은 선형이온빔 소스를 이용하여 고온에서 전도성 카본박막을 코팅하였다. 카본 박막 코팅을 위한 Precursor는 $C_2H_2$ gas를 이용하였으며, 온도에 따른 카본 박막의 전기적 특성 및 두께에 따른 카본 박막 성장 구조를 분석하였다. 카본 박막의 전기적 특성은 Interfacial contact resistance (ICR) 방법으로 측정하였으며, 접촉 저항 측정을 위한 모재는 SUS316L stainless steel을 사용하였고 카본 박막 성장 구조 분석을 위해서는 폴리싱된 Si-wafer를 사용하였다. 선형이온빔 소스를 이용하여 상온에서 증착한 카본 코팅의 접촉저항 값은 50 nm 코팅 두께에서 $660m{\Omega}cm^2@10kgf/cm^2$으로 비정질상의 특성을 나타냈으며, 고온에서는 $14.8m{\Omega}cm^2@10kgf/cm^2$으로 온도가 증가함에 따라 비정질상의 카본 박막이 전도성을 가지는 카본박막으로의 성장을 확인할 수 있었다. 또한 전도성 카본 박막의 성장 구조 분석은 FE-SEM 및 Raman spectrum 분석을 통해 확인하였으며, 그 결과 코팅 두께가 증가할수록 카본 입자들은 수nm에서 약 150 nm의 카본 cluster를 형성하며 성장하였다. 이때 전도성 카본 박막의 두께에 따른 접촉저항의 값은 고온 조건에서 카본 박막의 두께가 약 100 nm일 때, $12.1m{\Omega}cm^2@10kgf/cm^2$의 가장 낮은 값을 가졌다. 위의 결과를 경제성이 아주 우수한 대면적 전도성 나노 카본 박막의 상용화 가능성이 높아질 것으로 기대된다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 추계학술대회
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• pp.348-351
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• 2006

Bipolar plate, which forms about 50% of the stack cost, is an important core part with polymer electrolyte membrane in PEMFC. Bipolar plates have been commonly fabricated from graphite meterial having high electrical conductivity and corrosion resistance. Lately, many researchers have concentrated their efforts on the development of metallic bipolar plate and stainless steel has been considered as a potential material for metallic bipolar plate because of its high strength, chemical stability, low gas permeability and applicability to mass production. However, it has been reported that its inadequate corrosion behavior under PEMFC environment lead to a deterioration of membrane by dissolved metal ions and an increase in contact resistance by the growth of passive film therefore, its corrosion resistance as well as contact resistance must be improved for bipolar plate application. In this work, several types of coating were applied to 316L and their electrical conductivity and corrosion resistance were evaluated In the simulated PEMFC environment. Application of coating gave rise to low interfacial contact resistances below $19m{\Omega}cm^2$ under the compress force of $150N/cm^2$. It also made the corrosion potential to shift in the posit ive direct ion by 0.3V or above and decreased the corrosion current from ca. $9{\mu}A/cm^2$ to ca. $0.5{\mu}A/cm^2$ in the mixed solution of $0.1N\;N_2SO_4$ and 2ppm HF A coat ing layer under potentiostatic control of 0.6V and $0.75V_{SCE}$ for 500 hours or longer showed some instabilities, however, no significant change in coat Ing layer were observed from Impedance data. In addition, the corrosion current maintained less than $1{\mu}A/cm^2$ for most of time for potentiostatic tests. It indicates that high electrical conductivity and corrosion resistance can be obtained by application of coatings in the present work.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 추계학술발표대회 논문집
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• pp.17-21
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• 2000

Logarithmic electrical resistivity of the untreated or thin diameter carbon fiber composite increased suddenly to the infinity when the fiber fracture occurred by tensile electro-micromechanical test, whereas that of the ED or thick fiber composite increased relatively broadly up to the infinity. Electrical resistance of single-carbon fiber composite increased suddenly due to electrical disconnection by the fiber fracture in tensile electro-micromechanical test, whereas that of SFC increased stepwise due to the occurrence of the partial electrical contact with increasing the buckling or overlapping in compressive test. Electrical resistivity measurement can be very useful technique to evaluate interfacial properties and to monitor curing behavior of single-carbon fiber/epoxy composite under tensile/compressive loading.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1413-1415
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• 2005

The OTFT performance depends strongly on the interfacial properties between an organic semiconductor and ${\alpha}$ metal electrode. The contact resistance is critical to the current flow in the device. The contact resistance arises mainly from the Schottky barrier formation due to the work function difference between the semiconductor and electrodes. We doped pentacene/source-drain interfaces with $F_4TCNQ$ (2,3,5,6-Tetrafluoro-7,7,8,8-tetracyanoquinodimethane), resulting in p-doped region at the SD contacts, in order to solve this problem. We found that the mobility increased and the threshold voltage decreased.

• Composites Research
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• 제30권4호
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• pp.235-240
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• 2017

아교는 수용성을 띄는 접착제로, 이 특징에 의해 물에 약하다는 단점에도 불구하고 전통적인 고가구에 많이 사용되어 왔다. 이러한 단점을 개선하기 위하여 많은 연구가 진행되고 있다. 본 연구에서는 탄소나노튜브를 도입에 따른 아교의 계면특성 및 열적특성 그리고 방수특성 개선에 대한 연구를 진행하였다. 탄소나노튜브의 비율이 증가함에 따라 아교를 이용하여 접착한 돌침대용 목재 샌드위치 판 상부의 실시간 온도측정을 진행하였다. 나무와 아교접착제 간의 계면특성의 변화를 알아보기 위하여 랩 전단 실험을 실시하였고, 습도가 높아짐에 따라 물성이 약해지는 아교의 단점을 개선하기 위하여 탄소나노튜브를 도입에 따른 아교의 방수특성이 개선되는지 대한 실험을 진행하였다. 랩 전단시편을 물에 담근 후 랩 전단 실험을 진행하여 기존의 결과와 비교하여 차이가 얼마나 나는지 비교하였다. 이를 증명하기 위하여 물과의 정적 접촉각을 이용해 탄소나노튜브의 함량에 따른 아교접착제의 소수성 정도를 비교하였다. 실험결과 아교 접착제에 탄소나노튜브를 도입으로 계면특성, 열적특성 및 방수특성이 개선되었다.

• Bulletin of the Korean Chemical Society
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• 제33권4호
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• pp.1177-1182
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• 2012

The corrosion resistance of 316L stainless steel coated with NiO-YSZ (Ni added yttria stabilized zirconia) was examined in a proton exchange membrane fuel cell (PEMFC) environment. The NiO-YSZ coating was carried out using a sol-gel dip coating method, and the corrosion resistance and interfacial contact resistance (ICR) were determined by the composition and morphology of the NiO-YSZ film. The corrosion resistance increased with increasing Ni content in the NiO-YSZ film, but rapid corrosion was observed when the YSZ film contained more than 15 wt % Ni due to surface cracks. The polarization resistance was improved by several orders of magnitude when 316L stainless steel was coated with a 15 wt % NiO-YSZ film compared to bare 316L. The ICR of the NiO-YSZ film was decreased to that of bare 316L when the YSZ film contained 25 wt % NiO, suggesting the possible application of NiO-YSZ coated stainless steel for a bipolar plate.