• Elastomers and Composites
• /
• v.45 no.1
• /
• pp.2-6
• /
• 2010

The sizing treatments of PAN-based carbon fiber surfaces were carried out in order to improve the interfacial adhesion in the carbon fibers/nylon6 composite system. The parameter to characterize the wetting performance and surface free energy of the sized fibers were determined by a contact angle method. The mechanical interfacial properties of the composites were investigated using critical stress intensity factor ($K_{IC}$). The cross-section morphologies of sized CFs/nylon6composites were observed by SEM. As the experimental results, it was observed that silane-based sizing treated carbon fibers showed higher surface free energies than other sizing treatments. In particular, the KIC of the sizing-treated carbon fibers reinforced composites showed higher values than those of untreated carbon fibers-reinforced composites. This result indicated that the increase in the surface free energy of the fibers leads to the improvement of the mechanical interfacial properties of carbon fibers/nylon6 composites.

• Journal of Adhesion and Interface
• /
• v.9 no.4
• /
• pp.1-11
• /
• 2008

In the present study, kenaf fibers were treated with sodium hydroxide using soaking and ultrasonic methods prior to biocomposite processing, respectively. The effect of alkali treatment on the kenaf-PLA interfacial adhesion and mechanical and thermal characteristics of kenaf/poly(lactic acid) biocomposites was investigated in terms of their interfacial shear strength, flexural properties, dynamic mechanical properties and thermal stability and also microscopic observations of kenaf fibers and the composite fracture surfaces. As a result, use of both soaking and ultrasonic methods for treating kenaf fiber surfaces played a role in increasing the fiber-matrix adhesion and the mechanical properties of the biocomposites. Their characteristics depended not only on the fiber surface treatment method but also on the treatment condition like alkali concentration and treatment time.

• Journal of the Korean Society of Safety
• /
• v.30 no.1
• /
• pp.21-27
• /
• 2015

In this study, interfacial characteristics between SOFC and Ag paste as current collector was estimated in the high temperature environment. The Ag paste was used to connect the unit cell of SOFC strongly with interconnector and provide the electrical conductivity between them. To confirm electrical conductivity, Ag paste was treated in the furnace at $800^{\circ}C$ for 48 hours. The sheet resistance of Ag paste was measured to compare the resistance values before and after the heat treatment. Also, the four-point bending test was performed to measure the interfacial adhesion. The unit cell of SOFC and $SiO_2$ wafer were diced and then attached by Ag paste. The $SiO_2$ wafer had the center notch to initiate a crack from the tip of the notch. The modified stereomicroscope combined with the CCD camera and system for measuring the length was used to observe the fracture behavior. To compare the characteristics before heat treatment and after heat treatment, the specimen was exposed in the furnace at $800^{\circ}C$ for 48 hours and then the interfacial adhesion was evaluated. Finally, the interfacial adhesion energy quantitatively increases $1.78{\pm}0.07J/m^2$ to $4.9{\pm}0.87J/m^2$ between the cathode and Ag paste and also increase $2.9{\pm}0.47J/m^2$ to $5.12{\pm}1.01J/m^2$ between the anode and Ag paste through the high temperature. Therefore, it is expected that Ag paste as current collector was appropriate for improving the structural stability in the stacked SOFC system if the electrical conductivity was more increased.

• Elastomers and Composites
• /
• v.37 no.4
• /
• pp.258-264
• /
• 2002

In this work, the influence of thermal treatment on surface properties of silicas and mechanical interfacial properties of silicas/polyurethane composites was investigated. The surface properties of thermally treated silicas were studied in the context of Fourier Transform-IR (FT-IR), solid-state 29Si NMR spectroscopy, and contact angle. And the mechanical interfacial properties of the silica/polyurethane composites were evaluated by composite tearing energy (GIIIC). As a result, it was found that the thermally treated silica surfaces became hydrophobic in nature, due to the condensation of surface hydroxyls and the formation of siloxane bonds, resulting in increasing the London dispersive component of surface free energy. From which, the increase of the London dispersive component of the silicas led to an improvement of the dispersion of silicas in a polyurethane matrix, finally resulting in improving the tearing energy (GIIIC) of the silicas/polyurethane composites.

• Transactions on Electrical and Electronic Materials
• /
• v.7 no.1
• /
• pp.16-20
• /
• 2006

In this paper, we investigated the effects of short-term oxygen plasma treatment of semiconducting silicone layer to improve interfacial performances in joints prepared with a insulating silicone materials. Surface characterizations were assessed using contact angle measurement and x-ray photoelectron spectroscopy (XPS), and then adhesion level and electrical performance were evaluated through T-peel tests and electrical breakdown voltage tests of treated semi-conductive and insulating joints. Plasma exposure mainly increased the polar component of surface energy from $0.21\;dyne/cm^2$ to $47\;dyne/cm^2$ with increasing plasma treatment time and then leveled off. Based on XPS analysis, the surface modification can be mainly ascribed to the creation of chemically active functional groups such as C-O, C=O and COH on semi-conductive silicone surface. This oxidized rubber layer is inorganic silica-like structure of Si bound with three to four oxygen atoms ($SiO_x,\;x=3{\sim}4$). The oxygen plasma treatment produces an increase in joint strength that is maximum for 10 min treatment. However, due to brittle property of this oxidized layer, the highly oxidized layer from too much extended treatment could be act as a weak point, decreasing the adhesion strength. In addition, electrical breakdown level of joints with adequate plasma treatment was increased by about $10\;\%$ with model samples of joints prepared with a semi-conducting/ insulating silicone polymer after applied to interface.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2001.10a
• /
• pp.153-157
• /
• 2001

Interfacial properties and microfailure modes of electrodeposition (ED) treated carbon fiber reinforced polyetherimide (PEI) toughened epoxy composite were investigated using microdroplet test and the measurement of surface wettability. As PEI content increased, Interfacial shear strength (IFSS) increased due to enhanced toughness and plastic deformation of PEI. In the untreated case, IFSS increased with adding PEI content, and IFSS of pure PEI matrix showed the highest. On the other hand, for ED-treated case IFSS increased with PEI content with rather low improvement rate. The work of adhesion between fiber and matrix was not directly proportional to IFSS for both the untreated and ED-treated cases. The matrix toughness might contribute to IFSS more likely than the surface wettability. Interfacial properties of epoxy-PEI composite can be affected efficiently by both the control of matrix toughness and ED treatment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.10
• /
• pp.873-877
• /
• 2007

In order to apply a complex multilayer chip LC filter, this study has estimated the interfacial reaction and coupling properties of dielectric materials $Pb(Fe_{1/2}Nb_{1/2})O_3$ and Ni-Zn-Cu ferrite materials through low-temperature co-sintering (LTCS). PFN powders were fabricated using double calcinated at $700^{\circ}C$ and then $850^{\circ}C$. While the perovskite phase rate was found to be 91 %, after heat treatment at $900^{\circ}C$ for 6h, the perovskite phase rate and density exhibited a value of 100 % and 7.46$g/cm^3$, respectively. The PFN/Ni-Zn-Cu ferrite, PFN/CUO (or $Pb_2Fe_2O_5$) and ferrite/CuO (or $Pb_2Fe_2O_5$) were mechanically coupled through interfacial reactions after the specimen was co-sintered at $900^{\circ}C$ for 6 h. No intermediate layer exists for the mutual coupling reaction. This result indicates the possibility of low-temperature co-sintering without any interfacial reaction layer for a multilayer chip LC filter.

• Journal of Korea Foundry Society
• /
• v.17 no.3
• /
• pp.245-251
• /
• 1997

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

• Korean Journal of Metals and Materials
• /
• v.49 no.11
• /
• pp.910-915
• /
• 2011

The microstructures and mechanical properties of roll-bonded STS439/Al1050/STS304 clad materials were investigated after an annealing process at various temperatures. Interfacial layer was developed at the STS439/Al1050 and Al1050/STS304 interfaces at $550^{\circ}C$. STS439/Al1050/STS304 clad metals fractured suddenly in a single step and the fracture decreased with increasing annealing temperatures at $450^{\circ}C$. After annealing at $550^{\circ}C$, samples fractured in three steps with each layer fracturing independently. Interfacial layers formed at $550^{\circ}C$ with a high Vickers microhardness were found to be brittle. During tensile testing, periodic parallel cracks were observed at the interfacial reaction layer. Observed micro-void between Al1050 and the interfacial layer was found to weaken the Al1050/reaction layer interface, leading to the total separation between Al1050 and the reaction layer.

• Journal of Welding and Joining
• /
• v.29 no.1
• /
• pp.99-106
• /
• 2011

Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.