• 한국전기화학회:학술대회논문집
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• 1999.04a
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• pp.14-14
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• 1999

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.9
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• pp.1369-1374
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• 1989

Electrical characteristics at the p-GaP semiconductor/CsNO3 electrolyte interfaces were investigated. It is found that such interfacial phenomena are well analyzed by semiconductor-semiconductor pn junction diode models and image charge effects of semiconductor-vacuum interfaces. The formation processes of electrical double layers and their potential variations are verified using cyclic voltammetric methods. The interfacial current are influenced by Cs+ ion coverage onto the semiconductor electrode surface and structure of electrical double layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.115.1-115.1
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• 2014

Atom-thick 2-dimensional materials such as graphene, h-BN and MoS2 hold substantial potential for applications in future molecular-scale integrated electronics, transparent conducting membranes, nanocomposites, etc. From a fundamental point of view, 2-dim crystal-solid substrates can also serve as a unique system to study various physicochemical phenomena occurring at low dimensions or interfaces. In this talk, I will present our recent Raman spectroscopy studies on the surface science problems of graphene: interfacial charge transfer, molecular diffusion in confined space and structural deformation.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.867-870
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• 2007

In order to solve image sticking phenomena, the gas-phase and liquid-phase interfacial reactions of photosensitive polyimide can annihilate photoreactive carbon-carbon double bonds, which remain after photo-alignment process. The annihilation processes dramatically affect residual DC and photochemical reorientation of photoactive functional groups.

• Journal of Adhesion and Interface
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• v.3 no.4
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• pp.44-52
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• 2002

Composite materials are created by combining two or more component to achieve desired properties which could not be obtained with the separate components. The use of reinforcing fillers, which can reduce material costs and improve certain properties, is increasing in thermoplastic polymer composites. Currently, various inorganic fillers such as talc, mica, clay, glass fiber and calcium carbonate are being incorporated into thermoplastic composites. Nevertheless, lignocellulose fibers have drawn attention due to their abundant availability, low cost and renewable nature. In recent, interest has grown in composites made from lignocellulose fiber in thermoplastic polymer matrices, particularly for low cost/high volume applications. In addition to high specific properties, lignocellulose fibers offer a number of benefits for lignocellulose fiber/thermoplastic polymer composites. These include low hardness, which minimize abrasion of the equipment during processing, relatively low density, biodegradability, and low cost on a unit-volume basis. In spite of the advantage mentioned above, the use of lignocellulose fibers in thermoplastic polymer composites has been plagued by difficulties in obtaining good dispersion and strong interfacial adhesion because lignocellulose fiber is hydrophilic and thermoplastic polymer is hydrophobic. The application of lignocellulose fibers as reinforcements in composite materials requires, just as for glass-fiber reinforced composites, a strong adhesion between the fiber and the matrix regardless of whether a traditional polymer matrix, a biodegradable polymer matrix or cement is used. Further this article gives a survey about physical and chemical treatment methods which improve the fiber matrix adhesion, their results and effects on the physical properties of composites. Coupling agents in lignocellulose fiber and polymer composites play a very important role in improving the compatibility and adhesion between polar lignocellulose fiber and non-polar polymeric matrices. In this article, we also review various kinds of coupling agent and interfacial mechanism or phenomena between lignocellulose fiber and thermoplastic polymer.

• Korean Journal of Chemical Engineering
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• v.35 no.11
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• pp.2313-2320
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• 2018

Tetramethylene-1,4-bis(N,N-dodecylammonium bromide), cationic gemini surfactant, (12-4-12) was first synthesized with an one-step and shortened procedure and its interfacial and antimicrobial properties were compared with a conventional single-chain cationic surfactant, cetyltrimethylammonium bromide (CTAB). The interfacial and thermodynamic properties of both surfactants reveal that critical micelle concentration (CMC) of this novel synthetic cationic dimeric surfactant is lower than that of cationic monomeric surfactant at almost 15 times of its magnitude, which is due to the increase in hydrophobicity of the surfactant molecules by having dual hydrocarbon chains. In comparison with CTAB, the produced compound 12-4-12 yields much better interfacial and thermodynamic properties. The antimicrobial activities of the synthesized gemini surfactant were tested against eight strains of bacteria, as well as two strains of fungi. The results showed that both 12-4-12 compound and CTAB exhibited higher inhibitory effects on the growth of Gram-positive bacteria and fungi than that of Gram-negative bacteria. The minimum inhibitory concentrations in molar of 12-4-12 against all tested Gram-negative bacteria were lower than those of CTAB, which is hypothetically due to the lower HLB together with smaller CMC values of our gemini surfactant.

• Journal of Korea Foundry Society
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• v.15 no.4
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• pp.360-367
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• 1995

Effects of metal coating treatment on SiC particle on wetting behavior and interfacial strength were studied. Experimental variables are included types of coated metallic films such as Cu and Ni-P, and temperatures of heat-treatment under vacuum. The experimental results concerning wetting phenomena of liquid Al on SiC, showed that coating treatment of metallic film on SiC particles remarkably improves the wetting behavior of liquid Al on SiC, especially in the case of Ni-P coating. The interfacial strength of Al/SiC composites made of coated SiC plate was higher than that of the composite with non-coated SiC plate although the coating treatment was not perfect.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.1
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• pp.41-47
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• 1992

In SFB Process, after 110$0^{\circ}C$ annealing in wet OS12T(95$^{\circ}C$ HS12TO bubbling) atmosphere, the existence of the interfacial oxide film in micro-gap at Si-Si bonding interface was identified. The angle lapping/staining and SEM morphologies of bonding interface showed that the growing behavior of interfacial oxide made a contribution to eliminate the micro-gaps having a width of 200-300$\AA$. In case of the diodes composed of p-n wafer pairs made by SFB processes, the annealed one in wet OS12T atmosphere exhibited a dielectric breakdown phenomena of interfacial oxide at 37-40 volts d.c.

• Journal of Energy Engineering
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• v.7 no.1
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• pp.122-130
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• 1998

A simplified heat transfer model for the cooling capability of the AP 600 PCCS is proposed I this paper. As the PCCS domain is covered with very thin and long water film, it is phenomenologically divided into 3 regions; water entrance effect region, asymptotic region, and air entrance effect region. As the length of the asymptotic region is estimated to be over 90% of the whole domain, the phenomena in the asymptotic region is focused. Using the analogy between heat and mass transfer phenomena in a turbulent situation, a new dependent variable combining temperature and vapor mass fraction was defined. The similarity between the PCCs phenomena in the asymptotic region and the buoyant air flow phenomena on a vertical heated plate is derived. Using the similarity, the simplified heat transfer correlations for the interfacial heat fluxes and the ratios of latent heat transfer to sensible heat transfer were established. To verify the accuracy of the correlation, the results of this study were compared with those of other numerical analyses performed for the same configuration and they are well within the range of 15% difference.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.267-270
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• 2003

We have studied the interfacial diffusion phenomena and the role of ${\alpha}-Al_2O_3$ buffer layer as a diffusion barrier in the $Ba-ferrite/SiO_2$ magnetic thin films for high-density recording media. In the interface of amorphous Ba-ferrite ($1900-{\AA}-thick)/SiO_2$ thin film during annealing, the interfacial diffusion started to occur at ${\sim}700^{\circ}C$. As the annealing temperature increased up to $800^{\circ}C$, the interfacial diffusion abruptly proceeded resulting in the high interface roughness and the deterioration of the magnetic properties. In order to control the interfacial diffusion at the high temperature, we introduced ${\alpha}-Al_2O_3$ buffer layer ($110-{\AA}-thick$) in the interface of $Ba-ferrite/SiO_2$ thin film. During the annealing of $Ba-ferrite/{\alpha}-Al_2O_3/SiO_2$ thin film even at ${\sim}800^{\circ}C$, the interface was very smooth. The smooth interface of the film was also clearly shown by the cross-sectional FESEM. The magnetic properties, such as saturation magnetization 3nd intrinsic coercivity, were also enhanced, due to the inhibition of interfacial diffusion by the ${\alpha}-Al_2O_3$ buffer layer. Our study suggests that the ${\alpha}-Al_2O_3$ buffer layer act as a useful interfacial diffusion barrier in the $Ba-ferrite/SiO_2$ thin films.