• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.2
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• pp.162-167
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• 1999

GaN epilayers deposited by the OMVPE method on sapphires with 3 different surface orientations were investigated by TEM and their difference in mucrostructure were compared with each other. GaN epilayers were grown on the all three kinds of sapphire substrates; however, the best interfacial state and crystallinity were observed in the specimen using a {0001} substrate The density of defects in GaN epilayers on {0001} substrates was also less than others. No buffer layer was found at the interfaces of all the specimens; however, it was observed that the region which shows lattice distortion at the interface was only a few nonameter wide. Accordingly, TEM investigation revealed that GaN epilayers having some internal defects could be grown on sapphire {1120} and {1102} planes without a buffer layer, and the hetero-epitaxial GaN films were obtained from the specimen using {0001} substrates with the microstructural point of view.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.47-53
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• 2004

Eutectic Au-20Sn(compositions are all in weight percent unless specified otherwise) solder alloys were soldered on the Ni substrate with various time and temperature. The composition, phase identification and morphology of intermetallic compounds(IMC) at the interface were examined using Scanning Electron Microscopy(SEM). There were two types of IMCs, $(Au,Ni)_3Sn_2$ and $(Au,Ni)_3Sn$ at the interface. The transition in morphology of $(Au,Ni)_3Sn_2$ has been observed at $300{\~}400^{\circ}C$. The morphology transition of $(Au,Ni)_3Sn_2$ is due to the decrease of enthalpy of formation of $(Au,Ni)_3Sn_2$ phase and has been explained well by Jackson's parameter with temperature. Because the number of diffusion channel is different at each soldering temperature, IMC thickness is nearly same at all temperature.

• Carbon letters
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• v.12 no.2
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• pp.95-101
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• 2011

To investigate new applications for illite as an additive for carbon-based composites, the composites were prepared with and without illite at different heat-treatment temperatures. The effects of the heat-treatment temperature on the chemical structure, microstructure, and thermal oxidation properties of the resulting composites were studied. As the heat-treatment temperature was increased, silicon carbide SiC formation via carbothermal reduction increased until all the added illite was consumed in the case of the samples heat-treated at $2,300^{\circ}C$. This is attributed to the intimate contact between the $SiO_2$ in the illite and the phenol carbon precursor or the carbon fibers of the preform. Among composites prepared at all temperatures, those with illite addition exhibited fewer pores, voids, and interfacial cracks, resulting in larger bulk densities and lower porosities. A delay of oxidation was not observed in the illite-containing composites prepared at $2,300^{\circ}C$, suggesting that the illite itself absorbed energy for exfoliation or other physical changes. Therefore, if the illite-containing C/C composites can reach a density generally comparable to that of other C/C composites, illite may find application as a filler for C/C composites. However, in this study, the illite-containing C/C composites exhibited low density, even when prepared at a high heat-treatment temperature of $2300^{\circ}C$, although the thermal oxidation of the resulting composites was improved.

• Transactions on Electrical and Electronic Materials
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• v.14 no.3
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• pp.121-124
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• 2013

The incorporation of 90 nm alumina particles into an epoxy matrix to form a composite microstructure is described in present study. It is shown that the use of ultrafine particles results in a substantial change in the behavior of the composite, which can be traced to the mitigation of internal charges when a comparison is made with conventional $Al_2O_3$ fillers. A variety of diagnostic techniques have been used to augment pulsed electro-acoustic space charge measurement to provide a basis for understanding the underlying physics of the phenomenon. It would appear that, when the size of the inclusions becomes small enough, they act cooperatively with the host structure and cease to exhibit interfacial properties. It is postulated that the $Al_2O_3$ particles are surrounded by high charge concentrations. Since $Al_2O_3$ particles have very high specific areas, these regions allow limited charge percolation through $Al_2O_3$ filled dielectrics. The practical consequences of this have also been explored in terms of the electric strength exhibited. It would appear that there was a window in which real advantages accumulated from the nano-formulated material. An optimum filler loading of about 0.5 wt.% was indicated.

• Journal of Powder Materials
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• v.27 no.1
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• pp.25-30
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• 2020

Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m^-1K^-1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10^-6 to 3.06 × 10^-6K^-1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

• Elastomers and Composites
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• v.34 no.3
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• pp.222-228
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• 1999

In this work, the effect of chemical treatments on the carbon blacks as-received has been studied in the context of surface, adsorption, microstructure properties, and physical surface free energetics. As an experimental result, the basic chemical treatment leads to an increase in the either dispersive or specific component without significant change the pH and specific surface area. While, acidic chemical treatment do significantly change the surface and adsorption properties, and microstructures of the carbon blacks. In particular, the result given by basic chemical treatment shows an increase of the London dispersive component of the surface free energy which is a major parameter in evaluating the dispersion or specific surface area of the carbon blacks studied. This is probably a major role in evaluating the dispersion the carbon blacks, which are reinforced in elastomer matrix in a composite system.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.31 no.3A
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• pp.251-260
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• 2011

In this study, the effect of natural jute fiber volume fraction on the bond characteristics of polyolefin based macro fiber in natural jute fiber reinforced cement composites, including bond strength, interface toughness, and microstructure analysis are presented. The experimental results on polyolefin based macro fiber pullout test of different conditions are reported. Natural jute fiber volume fractions ranging from 0.1% to 0.2% are used in the mix proportions. Pullout tests are conducted to measure the bond characteristics of polyolefin based macro fiber from natural jute fiber reinforced cement composites. Test results are found that the incorporation of natural jute fiber can effectively enhance the polyolefin based macro fiber-cement matrix interfacial properties. The bond strength and interface toughness between polyolefin based macro fiber and natural jute fiber reinforced cement composites increases with the volume fraction of natural jute fiber. The microstructural observation confirms the findings on the interface bond mechanism drawn from the fiber pullout test results.

• Journal of Powder Materials
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• v.27 no.3
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• pp.219-225
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• 2020

The directed energy deposition (DED) process of metal 3D printing technologies has been treated as an effective method for welding, repairing, and even 3-dimensional building of machinery parts. In this study, stainless steel 316L (STS316L) and Inconel 625 (IN625) alloy powders are additively manufactured using the DED process, and the microstructure of the fabricated STS316L/IN625 sample is investigated. In particular, there are no secondary phases in the interface between STS316L and the IN625 alloy. The EDS and Vickers hardness results clearly show compositionally and mechanically transient layers a few tens of micrometers in thickness. Interestingly, several cracks are only observed in the STS 316L rather than in the IN625 alloy near the interface. In addition, small-sized voids 200-400 nm in diameter that look like trapped pores are present in both materials. The cracks present near the interface are formed by tensile stress in STS316L caused by the difference in the CTE (coefficient of thermal expansion) between the two materials during the DED process. These results can provide fundamental information for the fabrication of machinery parts that require joining of two materials, such as valves.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.500-507
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• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• Korean Journal of Materials Research
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• v.29 no.5
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• pp.282-287
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• 2019

The photovoltaic properties of $TiO_2$ used for the electron transport layer in perovskite solar cells(PSCs) are compared according to the particle size. The PSCs are fabricated and prepared by employing 20 nm and 30 nm $TiO_2$ as well as a 1:1 mixture of these particles. To analyze the microstructure and pores of each $TiO_2$ layer, a field emission scanning electron microscope and the Brunauer-Emmett-Teller(BET) method are used. The absorbance and photovoltaic characteristic of the PSC device are examined over time using ultraviolet-visible-near-infrared spectroscopy and a solar simulator. The microstructural analysis shows that the $TiO_2$ shape and layer thicknesses are all similar, and the BET analysis results demonstrate that the size of $TiO_2$ and in surface pore size is very small. The results of the photovoltaic characterization show that the mean absorbance is similar, in a range of about 400-800 nm. However, the device employing 30 nm $TiO_2$ demonstrates the highest energy conversion efficiency(ECE) of 15.07 %. Furthermore, it is determined that all the ECEs decrease over time for the devices employing the respective types of $TiO_2$. Such differences in ECE based on particle size are due to differences in fill factor, which changes because of changes in interfacial resistance during electron movement owing to differences in the $TiO_2$ particle size, which is explained by a one-dimensional model of the electron path through various $TiO_2$ particles.