• 한국전기전자재료학회논문지
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• 제17권2호
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• pp.223-227
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• 2004

We have studied the interfacial diffusion of Fe/Cr multilayers using synchrotron x-ray techniques, such as x-ray reflectivity, extended x-ray absorption fine structures (EXAFS), and high-resolution x-ray scattering. The results of x-ray reflectivity indicated that the interfacial roughness of Fe/Cr multilayers increased with the Cr-layer thickness. The Fourier transform (FT) of EXAFS data clearly showed that the Fe atoms dominantly diffused into the stable Cr layers at the Fe/Cr interface. The results of high-resolution x-ray scattering supported the interfacial diffusion of Fe atoms. Out study revealed that the dominantly interfacial diffusion of Fe atoms into the Cr layers effects the interfacial roughness of the Fe/Cr multilayers.

• 한국주조공학회지
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• 제28권6호
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• pp.268-272
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• 2008

Interfacial characteristics of aluminum borate whisker reinforced AS52 matrix composite was investigated. Peak hardness of AS52 composite was obtained aging at $170^{\circ}C$ for 15h and the aging process was accelerated by the presence of the aluminium borate whisker. The MgO layer, which was the interfacial reaction product between the reinforcement and the Mg matrix, was produced with 20 nm thickness in as-cast condition. As the aging time increased, the thickness of the interfacial reaction layer increased to 50 nm in peak aged condition. The nano-indentation test results indicated that the strength of interface was improved by the aging but over-aging degraded the reinforcement and decreased the interfacial strength which resulted in the decrease of overall composite strength.

• 한국결정성장학회지
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• 제24권4호
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• pp.151-157
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• 2014

The degradation mechanisms of thermal barrier coatings (TBCs) were investigated in different thermal fatigue condition in terms of microstructural analyses. The isothermal and cyclic oxidation tests were conducted to atmospheric plasma sprayed-TBCs on NIMONIC 263 substrates. The delamination occurred by the oxide layer formation at the interface, the Ni/Cr-based oxide was formed after Al-based oxide layer grew up to ${\sim}10{\mu}m$ in the isothermal condition. In the cyclic oxidation with dwell time, the failure occurred earlier (500 hr) than in the isothermal oxidation (900 hr) at same temperature. The thickness of Al-based oxide layer of the delaminated specimen in the cyclic condition was ${\sim}4{\mu}m$ and the interfacial cracks were observed. The acoustic emission method revealed that the cracks generated during the cooling step. It was considered that the specimens were prevented from the formation of the Al-based oxide by cooling treatment, and the degradation mode in the cyclic test was dominantly interfacial cracking by the difference of thermal expansion coefficients of the coating layers.

• Bulletin of the Korean Chemical Society
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• 제23권1호
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• pp.71-74
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• 2002

The apparent barrier height for charge transfer through an interfacial water layer between a Pt/Ir tip and a gold surface has been measured using STM technique. The average thickness of the interfacial water layer inside an STM junction was controlled by the amount of moisture. A thin water layer on the surface was formed when relative humidity was in the range of 10 to 80%. In such a case, electron tunneling through the thin water layer became the majority of charge transfers. The value of the barrier height for the electron tunneling was determined to be 0.95 eV from the current vs. distance curve, which was independent of the tip-sample distance. On the other hand, the apparent barrier height for charge transfer showed a dependence on tip-sample distance in the bias range of 0.1-0.5 V at a relative humidity of approximately 96%. The non-exponentiality for current decay under these conditions has been explained in terms of electron tunneling and electrochemical processes. In addition, the plateau current was observed at a large tip-sample distance, which was caused by electrochemical processes and was dependent on the applied voltage.

• 연구논문집
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• 통권28호
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• pp.219-227
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• 1998

In order to investigate the interfacial structure between TiN and iron nitride, an AISI 4140 steel was nitrided to form a layer of thickness 15$\mum$ by DC ion nitriding, then the surface was bombarded with Ti ions and subsequently coated a TiN film of 5$\mum$ by arc ion plating method. The interfacial microstructure between TiN and iron nitride was characterized by optical microscope, SEM and XRD. So called black layer was observed in the duplex treatment. It was resulted from the decomposition of iron nitride during the bombardment. Its thickness was increased with increasing bombardment time at high bias voltage. But the thickness was greatly decreased when the iron nitride was bombarded with a nitrogen gas or at a reduced bias voltage. The adhesion strength of the top TiN coating was decreased with increasing thickness of the black layer. Furthermore, the reduced adhesion strength in this system was discussed in view of the interfacial structural relationship between TiN and iron nitride.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2004년도 동계학술연구발표회 논문개요집
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• pp.200-201
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• 2004

The $H_{EB}$ was investigated for exchange coupling $20\;{\AA}\;Fe/x\;{\AA}\;NiO\;(type-I samples)$, $20\;{\AA}\;Fe/x\;{\AA}$ nonmagnetic layer $(MgO, Ag, Cu)/(500-x{\AA})$ NiO (type-II smaples). In type-I samples, the $H_{EB}$ is long-range coupling when looking from the point of view of the AFM. The $H_{EB}$ consistent with a generalized Meiklejohn-Bean approach. The critical thickness, which $H_{EB}$ is observed, is $130\;{\AA}$. In type-II samples, MgO layer more decouples the thin interfacial NiO from bottom NiO than other nonmagnetic layer. Nd the decoupling of Ag smallest. This means that the Ag layer has strong coupling the thin interfacial NiO with bottom NiO.

• 신재생에너지
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• 제4권1호
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• pp.31-36
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• 2008

Stainless steels have been widely considered as metallic bipolar plates, due to their passive surface film, which is good for corrosion resistance. However, the high resistivity of the passive film increases interfacial contact resistance between the bipolar plates and the electrodes. Stainless steels thermal spray coated with a mixture of tungsten carbide and stainless steel powders showed that the coated layer safely combined with the matrix but they suffered many internal defects including voids and cracks. Many cracks were formed in the coated layer and the interface of the matrix and the coated layer during the rolling process. The coated and rolled stainless steels showed lower interfacial contact resistance and corrosion resistance than bare stainless steel because of low resistivity of tungsten carbide and numerous defects, which caused crevice corrosion, in the coated layer.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2008년도 추계학술대회 논문집
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• pp.1-5
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• 2008

Stainless steels have been widely considered as metallic separators, due to their passive surface film, which is good for corrosion resistance. However, the high resistivity of the passive film increases interfacial contact resistance between the separators and electrodes. Stainless steels thermal spray coated with a mixture of tungsten carbide and stainless steel powders showed that the coated layer safely combined with the matrix but they suffered many internal defects including voids and cracks. Many cracks were formed in the coated layer and the interface of the matrix and the coated layer during the rolling process. The coated and rolled stainless steels showed lower interfacial contact resistance and corrosion resistance than bare stainless steel because of low resistivity of tungsten carbide and numerous defects, which caused crevice corrosion, in the coated layer.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.784-786
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• 2009

Thermal transfer of emitting layer from the donor film to the substrates depends on the physical interaction between the donor film, the emitting layer, and the hole-transport layer (HTL). The interfacial adhesion between the donor film and the EML, the cohesive force of the EML, and the interfacial adhesion between the EML and the HIL have to be optimized to achieve good LITI pattern quality. It was found that surface pretreatment of the donor plate was important on the laser induced thermal transfer of the emitting layer onto the HIL layer of the OLED devices.

• 한국주조공학회지
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• 제22권2호
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.