• 대한인간공학회지
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• 제14권1호
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• pp.105-113
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• 1995

The objective of the study is to investigate the influence of aesthetic attributes on user interface design. Theories of aesthetics are first studied from which aesthetic attributes are defined as information sources. Representation of a product is viewed as a combination of aesthetic attributes, based on a hypothesis that each attribute has a certain influence on the performance in terms of user interface. An experiment was conducted to support the hypothesis. Various combinations of aesthetic attributes of a microwave oven were generated from the orthogonal array of a conjoint analysis. Subjects perfomed on a computer two types of tasks, each of which simulated a combination of attributes. Reaction time was evaluated as a performance measure for the conjoint analysis to find out how much influence each attribute has on the performance. A computer program, UISA(User interface Simulation system of Aesthetic attributes0, was developed and used for simulation. Findings on the influences of aesthetic attributes were summarized.

• Nuclear Engineering and Technology
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• 제50권4호
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• pp.619-626
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• 2018

Most publications confirm that an ecological interface is a very efficient tool to supporting operators in recognition of complex and unusual situations and in decision-making. The present article describes the experience of implementation of an ecological interface concept for visualization of material balance in a drum separator of RBMK-type NPPs. Functional analysis of the domain area was carried out and revealed main factors and contributors to the balance. The proposed ecological display was designed to facilitate execution of the most complicated cognitive operations, such as comparison, summarizing, prediction, etc. The experimental series carried out at NPPs demonstrated considerable reduction of operators' mental load, time of reaction, and error rate.

• Environmental Sciences Bulletin of The Korean Environmental Sciences Society
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• 제2권1호
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• pp.85-90
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• 1998

The reaction rate of $CO_2$ with 2-amino-2-methyl-1-propanol (AMP), MEA monoethanolamine(MEA) and diethanolamine (DEA) in aqueous solutions has been determined using a stirred vessel with a plane gas-liquid interface over a wide range of concentrations of amines at different temperatures. The results show that the overall reaction rate is first order with respect to both $CO_2$ and amine. The reaction rate constant varies with temperature according to the relationship which agrees with the experimental data. The proposed interpretation is that the kinetic rate determining step is a reaction of $CO_2$ with amine to form carbamic acid which is then totally and immediately ionized.

• 대한치과기공학회지
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• 제32권4호
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• pp.297-305
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• 2010

Purpose: The purpose of this study was to observe the change of metal-mold reaction and surface roughness in titanium casting specimens for phosphate-silica alumina bonded investment with mold temperatures. Methods: The metal-phosphate silica alumina bonded mold interface reaction and surface roughness of titanium casting specimens according to mold temperatures were investigated. The Specimens were analysed by scanning electron microscopy and surface roughness tester. Results: The oxidation behavior indicated by the growth of oxide thickness. The titanium-oxide layer were consisted two layer of a porous external and a dense internal one. The reaction layer and surface roughness increased with increasing investment material temperature. Conclusion: In this work, The most suitable mold temperature in casting of pure titanium was $200^{\circ}C$.

• 한국세라믹학회지
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• 제39권7호
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• pp.693-698
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• 2002

반응소결 탄화규소의 잔류 실리콘 양을 최소화하기 위해 3성분계 탄화규소 분말을 혼합하여 최밀 충전 반음소결 탄화규소를 제조하였다. 기지상의 충전밀도 증가로 인해 반응소결 중 실리콘의 불완전 침윤이 발생하였으며, 이로 인한 잔류 기공은 조대 탄화규소 입자의 표면을 따라 존재함을 확인하였다. 불완전 침윤은 승온 중 분해되지 않고 남은 산화물이 실리콘의 용융 온도 이상에서 분해되어 생긴 고립기공에 의한 것으로 확인되었다. 기지상의 표면에 존재하리라 여겨지는 산화물을 제거하기 위해 침윤전 열처리 및 부식처리를 통해 완전침윤을 달성하였다.

• 한국세라믹학회지
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• 제33권9호
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• pp.1045-1049
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• 1996

Pressureless-sintered polycrystalline alumina and carbon steel were joined with Ag-33.5Cu-1.5Ti (wt%) brazing alloy. SEM observation revealed that two reaction layers with different thicknesses were continuously formed between the alumina and the brazing alloy. A thick layer formed on the brazing alloy side was identified as Ti3(Cu0.93Al0.07)3O phase with diamond cubic structure. Another thin layer adjacent to the alumina was revealed as $\delta$-TiO phase of which the crystal structure was HCP with a lattice parameter of a0=0.419 nm and c0=0.284 nm. It was confirmed using XPS analysis that $\delta$-TiO was formed directly by a redox reaction of alumina with titanium ir, molten brazing alloy.

• 한국환경과학회지
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• 제2권1호
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• pp.85-90
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• 1993

The reaction rate of $CO_2$ with 2-amino-2-methyl-1-propanol (AMP), MEA monoethanolamine (MEA) and diethanolamine (DEA) in aqueous solutions has been determined using a stirred vessel with a plane gas-liquid interface over a wide range of concentrations of amines at different temperatures. The results show that the overall reaction rate is first order with respect to both $CO_2$ and amino. The reaction rate constant varies with temperature according to the relationship which agrees with the experimental data. The proposed interpretation is that the kinetic rate determining step is a reaction of $CO_2$ with amine to form carbamic acid which is then totally and immediately ionized.

• Journal of Welding and Joining
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• 제13권3호
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• pp.106-115
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• 1995

To know the bonding phenomena of Ti/Cu brazed joint, a characteristic of microstructures in bonding interlayer of vacuum brazed pure Ti to Cu has been studied in the temperature range from 1088 to 1133K for various bonding times using Ag-28wt%Cu filler metal. Also intermediate phases formed in bonded interlayer and behavior of layer growth have been investigated. The obtained results in this study are as follows: 1) Liquid insert metal width at the each brazing temperature was proportional to the square root of brazing time, and it was considered that the liquid insert metal width was controlled by the diffusion rate process of primary .alpha.-Cu formed at the Ti side. 2) Intermediate phases formed near the Ti interface were .betha.-Ti and intermetallic compounds TiCu, Ti$_{2}$Cu, Ti$_{3}$Cu, and TiCu. 3) .betha.-Ti formed in Ti base metal durig brazing transformed to lamellar structure, .alpha.-Ti + Ti$_{2}$Cu. The structure came from the eutectoil decomposition reaction in cooling. And the width of .betha.-Ti layer was proportional to the square root of brazing time, and it was considered that the growth of .betha.-Ti layer was controlled by interdiffusion rate process in .betha.-Ti. 4) The layer growth of TiCu, Ti$_{3}$Cu$_{4}$ and TiCu, phases formed near the Ti interface was linerface was linearly proportional to the brazing time, and it was considered that the layer growth of these phases was controlled by the chemical reaction rate at the interface.

• 접착 및 계면
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• 제21권2호
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• pp.51-57
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• 2020

최근 산업활동을 통해 배출되는 유해 오염물질 제거에 대한 관심이 증가하고 있다. 본 연구에서는 수증기 활성화 법을 이용하여 활성탄소섬유를 제조하고, 이의 유해가스 흡착 및 전기화학적 감응 특성을 분석하였다. 활성탄소섬유의 균일한 기공 구조, 활성 반응 면적 및 반응 위치를 조절하기 위하여, 활성화 온도(750-850 ℃) 및 활성화 시간(30-240 min)을 조절하였고, 다양한 활성화 조건을 통해 제조된 활성탄소섬유의 SO₂와 NO 가스 흡착 및 가스 센서를 통한 감응 특성을 분석하였다. 특히, 850 ℃에서 45 min동안 수증기 활성화 반응을 통해 제조된 활성탄소섬유가 가장 높은 비표면적(1,041.9 ㎡/g)과 기공 특성(0.42 ㎤/g)을 보였으며, 우수한 SO₂ (1.061 mg/g) 및 NO (1.210 mg/g) 가스 흡착 특성을 보였다.

• 한국주조공학회지
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• 제22권2호
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.