• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.31-35
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• 2000

The stress state developed in a thin adhesive layer bonded between the semiconductor chip and the leadframe and subjected to a shear loading is investigated. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. Within the context of a linear elastic theory, a stress singularity of type $\gamma^{\lambda=1}$(0<1<1) exists at the point where the interface between one of the rigid adherends and the adhesive layer intersects the free surface. Such singularity might lead to edge crack or delamination.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.815-818
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• 2001

The buckling of an orthotropic layer bonded to an isotropic half-space with an interface crack subjected to compressive load under plane strain is considered. Basic stability equations derived from the mathematical theory of elasticity are applied to describe the buckling behavior. A system of homogeneous Cauchy-type singular integral equations of the second kind is solved numerically by utilizing Gauss-Chebyshev integral formulae. Numerical results for the buckling load are presented for various delamination geometries and material properties of both the layer and half-space.

• Journal of the Korea Concrete Institute
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• v.17 no.4 s.88
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• pp.637-643
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• 2005

Reinforced concrete beams or slabs are often strengthened or repaired using polymer modified cement concrete Stresses can develop in the structure by ambient temperature changes because thermal coefficients of the repair material and the existing concrete are typically different. Especially, shear stress often causes debonding of the interface. In this study, a rational procedure was developed where anchors can be designed in strengthened or repaired concrete members to prevent debonding at the interface. The current design procedure considers thicknesses and elastic moduli of the repair material and existing concrete, ambient temperature change, length, and beam-vs.-slab action. The procedure is also applicable to stresses developed by differential drying shrinkage.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.12
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• pp.95-103
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• 2001

The buckling of an orthotropic layer bonded to an orthotropic half-space with an interface crack subjected to compressive load under plane strain is analyzed. General solution to the stability equations describing the buckling behavior of both the layer and the half-space is expressed in terms of displacement functions. The displacement functions are represented by the solution of Cauchy-type singular integral equations, which are numerically solved. Numerical results of the critical buckling loads are presented fur various geometric parameters and material properties of both the layer and half-space.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.121-126
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• 2000

Metal/Ceramic structures have many attractive properties, with great potential for applications that demand high stiffness, as well as chemical and biological stability, thermal and electrical insulation. They are currently in use for mechanical and thermal protection in cutting tool and engine parts. With all their great advantage, ceramics suffer from one major problem they are brittle, and are especially susceptible to cracking from surface contacts. Delamination at the interfaces with adjacent layers is a particularly disturbing problem, and can cause premature failure of a composite system. so determination of adhesive properties of coating is one of the most important problems for the extension of the use of coated materials. In this work, mechanical characteristics of Interface of ceramic/Metal composites are evaluated by means of hardness test, indentation test apparent interfacial toughness and bonding strength test. The interface indentation test provides a relation between the applied load(P) and the length of the crack(a) created at the interface between the coating and the substrate.

• Geomechanics and Engineering
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• v.8 no.2
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• pp.237-255
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• 2015

From the related engineering principles, analytical solutions for horizontal crack initiation and propagation on a coal panel floor-underlying strata interface due to coal panel excavation are derived in this paper. Two important concepts, namely the critical panel width of horizontal crack initiation on the panel floor-underlying strata interface and the critical panel width of vertical fracture (crack) initiation in the panel floor, have been presented. The resulting analytical solution indicates that: (1) the first criterion can be used to express the condition under which horizontal plane cracks (on the panel floor-underlying strata interface or in the panel floor because of delamination) due to the mining induced vertical stress will initiate and propagate; (2) the second criterion can be used to express the condition under which vertical plane cracks (in the panel floor) due to the mining induced horizontal stress will initiate and propagate; (3) this orthogonal set of horizontal and vertical plane cracks, once formed, will provide the necessary weak network for the flow of gas to inrush into the panel. Two characteristic equations are given to quantitatively estimate both the critical panel width of vertical fracture initiation in the panel floor and the critical panel width of horizontal crack initiation on the interface between the panel floor and its underlying strata. The significance of this study is to provide not only some theoretical bases for understanding the fundamental mechanism of a longwall floor gas inrush problem but also a benchmark solution for verifying any numerical methods that are used to deal with this kind of gas inrush problem.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.123-127
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• 1997

Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circles and medical world, An Ultrasonic wave transmitted from a focused beam transducer is being expected as a powerful tool for NDE of micro-defect. The ultrasonic NDE of the defect is based on the form of the wave reflected form the interface In this study, regarding to the thickness of film which is in opaque object and thickness measurement was done by MEM-cepstrum analysis of received ultrasonic wave. In measument results, film thickness which is beyond distance resolution capacity was measured accurately. Also, automatically repeated discrimination analysis method can be decided in the category of all kinds of defects on semiconductor package.

• Journal of the Korean Society of Safety
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• v.38 no.2
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• pp.1-7
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• 2023

Fiber-metal laminates (FMLs) and polymer matrix composites (PMCs) are formed in various ways. In particular, FMLs in which aluminum is laminated as a reinforced layer are widely used. Also, glass fiber-reinforced plastics (GFRPs) are generally applied as fiber laminates. The bonding interface layer between the aluminum and fiber laminate exhibits low strength when subjected to hot press fabrication in the event of delamination fracture at the interface. This study presents a simple method for strengthening the interface bonding between the aluminum metal and GFRP layer of FML composites. The surfaces of the aluminum interface layer are engraved with three kinds of patterns by using the laser machine before the hot press works. Furthermore, the effect of the laser patterns on the interfacial toughness is investigated. The interfacial toughness was evaluated by the energy release rate (G) using an asymmetric double cantilever bending specimen (ADCB). From the experimental results, it was shown that the strip type pattern (STP) has the most proper pattern shape in GFRP/Al FML composites. Therefore, this will be considered a useful method for the safety assessment of FML composite structures.

• Journal of Mechanical Science and Technology
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• v.17 no.11
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• pp.1638-1649
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• 2003

A study is made on the characterization of damage tolerance by spherical indentation in hardly coated layer structure with modest elastic modulus mismatch. A hard silicon nitride is prepared for the coating material and silicon nitride with 5wt% of boron nitride composites for underlayer. Hot pressing to eliminate the effect of interface delamination during the fracture makes strong interfacial bonding. The elastic modulus mismatch between the layers is not only large enough to suppress the surface crack initiation from the coating layer but sufficiently small to prevent the initiation of radial crack from the interface. The strength degradation of the layer structure after sphere contact indentation does not significantly occur, while the degradation of silicon nitride-boron nitride composite is critical at a high load and high number of contacts.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.33-39
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• 2014

To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.