• Korean Journal of Materials Research
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• v.8 no.5
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• pp.429-435
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• 1998

무정형 PEEK 필름의 self-bonding 공정 시에 일어나는 결정화 현상이 접합 면에서 개발되어지는 self-bonding 강도에 미치는 영향을 주사전자현미경(SEM)을 이용하여 고찰하였다. 무정형 PEEK 필름의 결정화 현상은 접합 시의 공정변수에 따라 변화하며, self-bonding 공정 동안 접합 면을 가로질러 PEEK의 결정들이 성장함에 따라 접합이 일어남을 알 수 있었다. 접합온도가 높을수록 접합 면을 가로지르는 결정들의 성장 정도가 낮은 온도에서 접합시켰을 때의 경우보다 훨씬 커서 결과적으로 높은 self-bonding 강도를 보였다. 각각의 시편들을 전단 파괴시킨 후 행한 파단면 관찰에서는 self-bonding 강도가 점차 높아짐에 따라 더욱 조밀한 물결무늬 파면과 dimple 형태와 유사한 파면 형상들이 관찰되는 것으로 보아 접합공정 시 접합 면을 가로지르는 PEEK 결정들의 성장 정도가 self-bonding 강도에 커다란 영향을 미친다고 판단되었다.

• Journal of Welding and Joining
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• v.23 no.6
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• pp.77-86
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• 2005

Low temperature bonding of the silicon and glass using the Spin-on Glass (SOG) has been conducted experimentally to figure out the effects of the SOG solution composition and process variables on bond strength using the Design of Experiment method. In order to achieve the high quality bond interface without rack, sufficient reaction time of the optimal SOG solution composition is needed along with proper pressure and annealing temperature. The shear strength under the optimal SOG solution composition and process condition was higher than that of conventional anodic bonding and similar to that of wafer direct bonding.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.10
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• pp.101-105
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• 1990

The use of a sol-gel processed cordierite precursor sinterable about$900^{\circ}C$ allows cosintering of the copper and the ceramic. A strong bonding between the copper film and the cordierite substrate can be achieved through an eutectic bonding technique. These interfaces were investigated using STEM. copper diffusion as well as strong chemical and structural modifications was observed in the interface region. Although these interfaces have good adhesion properties, there was no evidence of the formation of the copper compound at the interface.

• Structural Engineering and Mechanics
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• v.55 no.2
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• pp.335-348
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• 2015

The influence of the interface imperfect bonding on the flexural wave dispersion in the bilayered hollow circular cylinder is studied with utilizing three-dimensional linear theory of elastodynamics. The shear-spring type model is used for describing the imperfect bonding on the interface between the layers and the degree of the imperfectness is estimated through the dimensionless shear-spring parameters which enter the mentioned model. The method for finding the analytical expressions for the sought values and dispersion equation are discussed and detailed. Numerical results on the lowest first and second modes are presented and analyzed. These results are obtained for various values of the shear-spring parameters. According to these results, in particular, it is established that as a results of the imperfection of the bonding between the layers the new branches of the dispersion related the first fundamental mode arise and the character of the dispersion curve related to the second mode becomes more complicated.

• Journal of the Korean Ceramic Society
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• v.35 no.6
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• pp.535-542
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• 1998

SOI(silicon oninsulator) was fabricated through the direct bonding of a hydrophilized single crystal Si wafer and a thermally oxidized SiO2 thin film to investigate the stacking faults in silicon at the Si/SiO2 in-terface. At first the oxidation kinetics of SiO2 thin film and the stacking fault distribution at the oxidation interface were investigated. The stacking faults could be divided into two groups by their size and the small-er ones were incorporated into the larger ones as the oxidation time and temperature increased. The den-sity of the smaller ones based critically lower eventually. The SOI wafers directly bonded at the room temperature were annealed at 120$0^{\circ}C$ for 1 hour. The stacking faults at the bonding and oxidation interface were examined and there were anomalies in the distributions of the stacking faults of the bonded region to arrange in ordered ring-like fashion.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.857-863
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• 2014

In this work, we introduce various bonding technologies for 3D package and suggest Insert-Bump bonding (ISB) process newly to stack multi-layer chips successively. Microstructure of Insert-Bump bonding (ISB) specimens is investigated with respect to bonding parameters. Through experiments, we study on find optimal bonding conditions such as bonding temperature and bonding pressure and also evaluate in the case of fluxing and no-fluxing condition. Although no-fluxing bonding process is applied to ISB bonding process, good bonding interface at $270^{\circ}C$ is formed due to the effect of oxide layer breakage.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Proceedings of the KOSOMBE Conference
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• v.1996 no.11
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• pp.337-346
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• 1996

Debonding of cement-femoral stem interface has been suggested as a initial focus of loosening mechanism in many previous studies of cemented total hip replacement. The purpose of this study was to investigate the effect of debonding of cement-femoral stem interface to the bone-cement interface by using three-dimensional non-liner finite element analysis. Three cases of partial debonded, full debonded, full bonded cement-bone interface were modelled with partial bonding of distal 70mm from the tip of femoral stem. Each situation was studied under loading stimulating one-leg stanced gait of 68kg patient. The results showed that under partial and full debonded cement-stem interface condition the peak von Mises stress(3.1 MPa) were observed at the cement of bone-cement interface just under the calcar of proximal medial of femur, and sudden high peak stresses(3.5MPa) were developed at the distal tip of femoral stem at the lateral bone-cement interface in all 3 cases of bonding. The stresses were transfered very little to the cement of upper lateral bone-cement interface in partial and full debonded cases. Thus, once partial or full debonded cement-femoral stem interface occured, 3 times higher stress concentration were developed on the cement of proximal medial bone-cement interface than full bonded interface, and these could cause loosening of cemented total hip replacement. Clinically, preservation of more rigid cement-femoral stem interface may be important factor to prevent loosening of femoral stem.

• Computers and Concrete
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• v.26 no.3
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• pp.257-273
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• 2020

Concrete bond strength with steel re-bars depends on multiple factors including concrete-steel interface and mechanical properties of concrete. However, the hydration development of cementitious paste, and in turn the mechanical properties of concrete, are negatively affected by cold weather. This study aimed at exploring the concrete-steel bonding behavior in concrete cast and cured under freezing temperatures. Three concrete mixtures were cast and cured at -10 and -20℃. The mixtures were protected using conventional insulation blankets and a hybrid system consisting of insulation blankets and phase change materials. The mixtures comprised General Use cement, fly ash (20%), nano-silica (6%) and calcium nitrate-nitrite as a cold weather admixture system. The mixtures were tested in terms of internal temperature, compressive, tensile strengths, and modulus of elasticity. In addition, the bond strength between concrete and steel re-bars were evaluated by a pull-out test, while the quality of the interface between concrete and steel was assessed by thermal and microscopy studies. In addition, the internal heat evolution and force-slip relationship were modeled based on energy conservation and stress-strain relationships, respectively using three-dimensional (3D) finite-element software. The results showed the reliability of the proposed models to accurately predict concrete heat evolution as well as bond strength relative to experimental data. The hybrid protection system and nano-modified concrete mixtures produced good quality concrete-steel interface with adequate bond strength, without need for heating operations before casting and during curing under freezing temperatures down to -20℃.

• Korean Journal of Materials Research
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• v.20 no.9
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• pp.478-482
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• 2010

A series of molecular dynamic (MD), finite element (FE) and ab initio simulations are carried out to establish suitable modeling schemes for the continuum-based analysis of aluminum matrix nanocomposites reinforced with carbon nanotubes (CNTs). From a comparison of the MD with FE models and inferences based on bond structures and electron distributions, we propose that the effective thickness of a CNT wall for its continuum representation should be related to the graphitic inter-planar spacing of 3.4${\AA}$. We also show that shell element representation of a CNT structure in the FE models properly simulated the carbon-carbon covalent bonding and long-range interactions in terms of the load-displacement behaviors. Estimation of the effective interfacial elastic properties by ab initio simulations showed that the in-plane interfacial bond strength is negligibly weaker than the normal counterpart due to the nature of the weak secondary bonding at the CNT-Al interface. Therefore, we suggest that a third-phase solid element representation of the CNT-Al interface in nanocomposites is not physically meaningful and that spring or bar element representation of the weak interfacial bonding would be more appropriate as in the cases of polymer matrix counterparts. The possibility of treating the interface as a simply contacted phase boundary is also discussed.