• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.12
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• pp.1875-1882
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• 2013

Micro-array technology contributes numerous achievements such as ordering of gene network and integration of genomic. This technology is well established as means for investigating patterns of gene expression. DNA micro-arrays utilize Affymetric chips where a large quantity of DNA sequences may be synthesized. There are two general type of conventional DNA array spotter: contact and piezoelectric. The contact technology used spotting pin technology to make contact with the glass slide surface. This may caused damage or scratches to the surface matrix where protein will be contaminated and may not bind specifically. Piezoelectric technology available at this present time on the other hand requires the analyzer to print the result that can only be done within the laboratory despite of mass production. Therefore, in this paper, high-throughput technology is developed for providing greater consistency in feature spot without touching the glass slide surface.

• Journal of Welding and Joining
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• v.6 no.4
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• pp.44-53
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• 1988

The mechanical strengths of buried lamellar tears located near the weld toe in the welded tee joints were evaluated in terms of the loss of load carrying capacity as a function of tear area. In static loading, the load carrying capacity was significantly reduced when tear intercepted over 10% of the cross-sectional area of the welded joints. However, the welded joints containing buried tears still failed at stresses over the yield strength of the base metal in the through-thickness direction in spite of the presence of tears up to 20-25% of the area. Fatigue strength of welded joints containing tears markedly reduced with increasing tear areas. Lehigh lamellar tearing test used in this study to produce speicmens was described in detail. The load carrying cpapacity in static loading was influenced by the reduction of supporting area whereas that in fatigue loading was influenced by the stress-concentration effects of lamellar tears and the reduction of supporting area. In bend tests, the pre-existing lamellar tears always grew up toward the weld toe. However, in fatigue loading, cracks grew up and down simultaneously form both the weld toe and the top of lamellar tears because of stress concentration. In fatigue loading, delaminations and decohesion of inclusion/matrix interface generated in multipass welds provided crack propagation paths and enhanced crack propagation because the tips of delaminations and deconhesios acted as stress raisers.

• Korean Journal of Materials Research
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• v.14 no.9
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• pp.676-681
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• 2004

In-situ observation in SBM on the microfracture behavior of coating layer was performed for GA steel sheets that have various Fe contents and thickness of coating layer. In case of cross sectional side of coating layer that was in a tensile stress state during bending, fine perpendicular crack pre-induced during galvannealing grew and propagated rapidly toward the coating surface with the increase of strain. And then it grew and propagated along the ${\Gamma}/Fe$ matrix interface, and combined with the nearest another perpendicular crack. Consequently, flaking occurred. The more Fe content and thickness of coating layer increased, the more average crack interval and flaking resistivity increased. Exfoliation was little observed at coating surface in a tensile stress state.

• Journal of Korea Foundry Society
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• v.31 no.2
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• pp.66-70
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• 2011

Hot dip aluminizing (HDA) is widely used in industry for improving corrosion resistance of material. The formation of intermetallic compound layers during the contact between dissimilar materials at high temperature is common phenomenon. Generally, intermetallic compound layers of $Fe_2Al_5$ and $FeAl_3$ are formed at the Al alloy and Fe substrate interface. In case of cast iron, high contact angle of graphite existed in the matrix inhibits the formation of intermetallic compound layer, which carry with it the disadvantage of a reduced reaction area and mechanical properties. In present work, the process for the removal of graphite existed on the surface of specimen has been investigated. And also HDA was proceeded at $800^{\circ}C$ for 3 minutes in aluminum alloy melt. The efficiency of graphite removal was increased with the reduction of particle size in sanding process. Graphite appears to be present both in the region of melting followed by re-solidification and in the intermetallic compound layer, which could be attributed to the fact that the surface of cast iron is melted down by the formation of low melting point phase with the diffusion of Al and Si to the cast iron. Intermetallic compound layer consisted of $Fe(Al,Si)_3$ and $Fe_2Al_5Si$, the layer formed at cast iron side contained lower amount of Si.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.4 no.3
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• pp.713-719
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• 2000

In order to Prepare the$Ge_xSi_{1-x}/Si$(111) heterosructure by solid phase epitaxy (SPE), about 1000A of Au and about 1000A Ge were sequentially deposited on the Si(111) substrate. The resulting Ge/Au/Si(111) samples were isochronically annealed in the high vacuum condition. The behaviors of Au and Ge during thermal annealing and the structural Properties of $Ge_xSi_{1-x}$ films were characterized by Auger electron spectroscopy (AES), X-ray diffraction (XRD) and high resolution transmission electron microscopy (TEM). The a-Ge/Au/Si(111) structure was converted to the Au/GeSi/Si(111) structure. Defects such as stacking faults, point defects and dislocations were found at the GeXSil-X(111) interface, but the film was grown epitaxially with the matching face relationship of $Ge_xSi_{1-x}/$(111)/Si(111). Twin crystals were also found in the $Ge_xSi_{1-x}/$(111) matrix.

• Journal of the Korean Society of Safety
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• v.17 no.3
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• pp.7-12
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• 2002

The object of this paper is to investigate collapse characteristics of CF/Epoxy(Carbon Fiber/Epoxy resin) composite tubes on the change of interlaminar number and fiber orientation angle of outer and to evaluate reappearance of collapse characteristics on the change of tension strength of fibers under static and impact axial compression loads. When a CF/Epoxy composite tube is mushed, static/impact energy is consumed by friction between the loading plate and the splayed fiends of the tube, by fracture of the fibers, matrix and their interface. In general, CF/Epoxy tube with 6 interlaminar number(C-type) absorbed more energy than other tubes(A, B, D-types). The maximum collapse load seemed to increase as the interlaminar number of such tubes increases. The collapse mode depended upon orientation angle of outer of CF/Epoxy tubes and loading status(static/impact). Typical collapse modes of CF/Epoxy tubes are wedge collapse mode, splaying collapse mode and fragmentation collapse mode. The wedge collapse mode was shorn in case of CF/Epoxy tubes with 0$^{\circ}$ orientation angle of outer under static and impact loadings. The splaying collapse mode was shown in only case of CF/Epoxy tubes with 90$^{\circ}$ orientation angie or outer under static loadings, however in impact tests those were collapsed in fragmentation mode. So that CF/Epoxy tube with 6 interlaminar number and 90$^{\circ}$ outer orientation angle presented to the optimal collapse characteristics.

• Korean Journal of Soil Science and Fertilizer
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• v.45 no.4
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• pp.622-627
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• 2012

The processes to determine the composition, dynamics, and activity of infection mechanisms by the rhizosphere microflora have attracted the interest of scientists from multiple disciplines although considerable progress of the infection pathways and plant-pathogen interactions by soil borne fungal pathogens have been made. Soilborne pathogens are confined within a three-dimensional matrix of mineral soil particles, pores, organic matter in various stages of decomposition and a biological component. Among the physical and chemical properties of soils soil texture and matric water potential may be the two most important factors that determine spread exudates by soil borne fungal pathogens, based on the size of the soil pores. Pathogenic invasion of plant roots involves complex molecular mechanisms which occur in the diffuse interface between the root and the soil created by root exudates. The initial infection by soilborne pathogens can be caused by enzymes which breakdown cell wall layers to penetrate the plant cell wall for the fungus. However, the fate and mobility of the exudates are less well understood. Therefore, it needs to develop methods to control disease caused by enzymes produced by the soilborne pathogens by verifying many other possible pathways and mechanisms of infection processes occurring in soils.

• Journal of Powder Materials
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• v.13 no.5 s.58
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• pp.321-326
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• 2006

Electronic packaging involves interconnecting, powering, protecting, and cooling of semiconductor circuits fur the use in a variety of microelectronic applications. For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different thermal expansion coefficients of semiconductor chips and packaging materials. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers. The advantages of carbon nanofibers, especially the good thermal conductivity, are utlized to obtain a composite material having a thermal conductivity higher than 400 W/mK. The main challenge is to obtain a homogeneous dispersion of carbon nanofibers in copper. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed. In order to improve the bonding strength between copper and nanofibers, different alloying elements were added. The microstructure and the properties will be presented and the influence of interface modification will be discussed.

• Journal of the Korea Computer Industry Society
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• v.7 no.4
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• pp.427-436
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• 2006

State-space method for the analysis of the dynamic characteristics of a body motion is set up as mathematical tool for the solution of differential equation by computer. Representation of a system is described as a simple form of matrix calculation and unique form of model is available for the linear or nonlinear, time variant or time invariant, mono variable or multi variable system etc. For the analysis of state-space method a complicated vector calculation is required, but this analysis can be simplified with the specific functions of a software package. Recently as the Graphical User Interface softwares are well-developed, then it is very simplified to execute the simulation of the dynamic characteristics for the state-space model with the interactive graphics treatment. The purpose of this study is to developed the simulator for the educational analysis of the dynamic characteristics of body motion, and for the analysis of the longitudinal dynamic characteristics of an aircraft that is primarily to design the simulator for the analysis of the transient response of an aircraft longitudinal stability.

• Journal of Korea Multimedia Society
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• v.15 no.3
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• pp.323-335
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• 2012

In this paper, we propose an AR(augmented reality) system using user's bare hand based on computer vision. It is important for registering a virtual object on the real input image to detect and track correct feature points. The AR systems with markers are stable but they can not register the virtual object on an acquired image when the marker goes out of a range of the camera. There is a tendency to give users inconvenient environment which is limited to control a virtual object. On the other hand, our system detects fingertips as fiducial features using adaptive ellipse fitting method considering the geometric characteristics of hand. It registers the virtual object stably by getting movement of fingertips with determining the shortest distance from a palm center. We verified that the accuracy of fingertip detection over 82.0% and fingertip ordering and tracking have just 1.8% and 2.0% errors for each step. We proved that this system can replace the marker system by tacking a camera projection matrix effectively in the view of stable augmentation of virtual object.