• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.449-449
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• 2007

OLED has many advantages of low voltage operation, self radiation, light weight, thin thickness, wide view angle and fast response time to overcome existing liquid crystal display (LCD)'s weakness. Therefore, It draws attention as promising display and has already developed for manufactured goods. Also, OLED is regarded as a only substitute of flexible display with a thin display. A considerable portion of the light originating film emissive centers buried in a solid film never escapes due to internal reflection at the air-film interface and is scattered as edge emission or dissipated within the solid film This is one of the major reasons why the luminous power efficiency of OLED remains low, in spite of research progress in OLED. Although several ways of overcoming this difficulty have been reported, no comprehensive method has been proposed yet. In this paper, we propose that use of anti-reflective coating layers.

• Tribology and Lubricants
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• v.16 no.3
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• pp.223-230
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• 2000

Factors influencing friction reduction with MODTP(molybdenum dialkyl dithiophosphate) lubricant were investigated through a frictioning experiment using two-cylinder edge surface frictioning tester and XPS surface analysis. The friction reduction effect gained with MoDTP lubricant appeared to be largely attributable to MoS$_2$ formation on the frictioning interface. Under N$_2$ atmosphere, Mo diffused into the metal substrate, easily escaping from MoS$_2$ so the friction reduction effect from MoDTP was not gained. However, when an oxide surface film was preliminary prepared on frictioning surface, this Mo diffusion to metal substrate from MoS$_2$ was effectively inhibited. Then desired lubulication effect of MoDTP was gained even under N$_2$atmosphere. As such, the existence of a surface oxide film on the frictioning surface was concluded to be of essential importance in order to gain a lubrcating effect with MoDTP.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.12
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• pp.71-77
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• 2021

An impeller identification technique that is essential for adding viscosity measurement functions to overhead stirrers is presented in this study. Previous studies have revealed that using magnets facing the same poles arranged in a row can aid in distinguishing the types of impellers by detecting the number of magnets in a non-contact manner. However, as these previous studies measured the magnetic fields using analog Hall sensors, a converting circuit for the digital signals is required that can interface with the MCU. In this study, it was demonstrated that the number of magnets can be distinguished without using a separate conversion circuit by using a Hall sensor with a digital output. Owing to the unique hysteresis characteristics of digital Hall sensors, it was confirmed through experiments that the complex and diverse outputs appear depending on the direction of the magnetic field, the arrangement of magnetic poles, and the moving direction of the magnet. The measurement of the magnetic field showed that an edge signal equal to the number of magnets inserted into the impeller was detected when the radial direction was used, and the south pole was first approached.

• Advances in aircraft and spacecraft science
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• v.6 no.1
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• pp.51-67
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• 2019

AMOSC (Automatic Margin Of Safety Calculation) is a SW tool which has been developed to calculate the failure index of layered composite structures by referring to the cutting edge state-of-the-art LaRC05 criterion. The stress field is calculated by a finite element code. AMOSC allows the user to calculate the failure index also by referring to the classical Hoffman criterion (which is commonly applied in the aerospace industry). When developing the code, particular care was devoted to the computational efficiency of the code and to the automatic reporting capability. The tool implemented is an API which has been embedded into Femap Siemens SW custom tools. Then, a user friendly graphical interface has been associated to the API. A number of study-cases have been solved to validate the code and they are illustrated through this work. Moreover, for the same structure, the differences in results produced by passing from Hoffman to LaRC05 criterion have been identified and discussed. A number of additional comparisons have thus been produced between the results obtained by applying the above two criteria. Possible future developments could explore the sensitivity of the failure indexes to a more accurate stress field inputs (e.g. by employing finite elements formulated on the basis of higher order/hierarchical kinematic theories).

• Journal of KIISE:Software and Applications
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• v.36 no.2
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• pp.161-168
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• 2009

In this paper, we develop an Intelligent Wheelchair(IW) control system for the people with various disabilities. The aim of the proposed system is to increase the mobility of severely handicapped people by providing an adaptable and effective interface for a power wheelchair. To facilitate a wide variety of user abilities, the proposed system involves the use of face-inclination and mouth-shape information, where the direction of an Intelligent Wheelchair(IW) is determined by the inclination of the user's face, while proceeding and stopping are determined by the shape of the user's mouth. To analyze these gestures, our system consists of facial feature detector, facial feature recognizer, and converter. In the stage of facial feature detector, the facial region of the intended user is first obtained using Adaboost, thereafter the mouth region detected based on edge information. The extracted features are sent to the facial feature recognizer, which recognize the face inclination and mouth shape using statistical analysis and K-means clustering, respectively. These recognition results are then delivered to a converter to control the wheelchair. When assessing the effectiveness of the proposed system with 34 users unable to utilize a standard joystick, the results showed that the proposed system provided a friendly and convenient interface.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.43-48
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• 2024

The discovery of a two-dimensional electron gas (2DEG) at the interface of LaAlO₃ (LAO) and SrTiO₃ (STO) substrates has sparked significant interest, providing a foundation for cutting-edge research in electronic devices based on complex oxide heterostructures. However, conventional methods for producing LAO thin films, typically employing techniques like pulsed laser deposition (PLD) within physical vapor deposition (PVD), are associated with high costs and challenges in precisely controlling the La and Al composition within LAO. In this study, we adopted a cost-effective alternative approach-solution-based processing-to fabricate LAO thin films and investigated their electrical properties. By adjusting the concentration of the precursor solution, we varied the thickness of LAO films from 2 to 65 nm and determined the sheet resistance and carrier density for each thickness. After vacuum annealing, the sheet resistance of the conductive channel ranged from 0.015 to 0.020 Ω·s^-1, indicating that electron conduction occurs not only at the LAO/STO interface but also into the STO bulk region, consistent with previous studies. These findings demonstrate the successful formation and control of 2DEG through solution-based processing, offering the potential to reduce process costs and broaden the scope of applications in electronic device manufacturing.

• Geophysics and Geophysical Exploration
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• v.15 no.2
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• pp.92-101
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• 2012

Three-dimensional finite-difference simulation in a small-scale half-sphere basin with planar free-surface is performed for an arbitrary shear-dislocation point source. A new scheme to deal with free-surface boundary condition is presented. Then basin parameters are examined to understand main characteristics on ground-motion response in the basin. To analyze the frequency content of ground motion in the basin, spectral amplitudes are compared with each other for four sites inside and outside the basin. Also particle motions for those sites are examined to find which kind of wave plays a dominant role in ground-motion response. The results show that seismic energy is concentrated on a marginal area of the basin far from the source. This focusing effect is mainly due to constructive interference of the direct Swave with basin-edge induced surface waves. Also, ground-motion amplification over the deepest part of the basin is relatively lower than that above shallow basin edge. In the small-scale basin with relatively simple bedrock interface, therefore, the ground-motion amplification may be more related to the source azimuth or direction of the incident waves into the basin rather than depth of it.

• Korean Journal of Cleft Lip And Palate
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• v.4 no.1
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• pp.13-26
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• 2001

Cleft lip and/or palate is the congenital orofacial malformation most commonly occurred in humans, The disease is multifactorial and is probably caused by genetic and/or environmental factors, So, there are many problems in research concerning etiology and in treatment of the disease, Even the most practiced and sophisticated methods of surgical repair are necessarily followed by scar contraction and fibrosis, which result in skeletal defects, dental abnormalities, cosmetic disfigurement, and speech impairment, As a result, Fetal surgery can be considered but practiced rarely when the deformity is not fatal to life, And treatment of cleft palate is performed in the form of medicine projection into uterus in animal experiments, Many studies show that growth factor and its receptor emerge from the developing palate; and the epidermal growth factor receptors have a important role in craniofacial development and in palatal fusion, The palatal morphogenesis of the avine is different from the mammal's; it takes the form of physiologic cleft palate, Recently, cleft palate fusion experiment was performed when the avine were in the period of palate formation through the exogenous TGF-β3 addition, and it showed that the exogenous TGF-β3 makes fusion of divided palate through certain process when cleft palate is occurred in palatal formation, In this study, I had the conformation of the fusion of cleft palate through the addition of TGF-β in case of chicken embryo, and observed the effect of TGF-β in EGF receptor distribution, And the following is the results of this study, 1. In case of the TGF-βl and β3 addition group, there was the decrease of EGFR(Epidermal Growth Factor Receptor) immunoreactivity in mesenchymal cells beneath the medial edge epithelium and also in epithelial mesenchymal interface which is between medial edge epithelium and nasal septum in 72 hours, 2, The immunoreactivity of the control group resembles that of normal chicken embryo palate in development, 3. In the view through fluorescence confocal microscopy, there was confluence in TGF-β3 addition group, This shows that the confluence induced by exogenous TGF-β3 is related to EGFR expression in palate of chicken embryo, which is a physiologic cleft palate model.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.812-818
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• 2000

We studied the effects of Ge preamorphization (PAM) on 0.25$\mu\textrm{m}$ Ti-salicide junctions using comparative study with As PAM. For each PAM schemes, ion implantations are performed at a dose of 2E14 ion/$\textrm{cm}^2$ and at 20keV energy using $^{75}$ /As+and GeF4 ion sources. Ge PAM showed better sheet resistance and within- wafer uniformity than those of As PAM at 0.257m line width of n +/p-well junctions. This attributes to enhanced C54-silicidation reaction and strong (040) preferred orientation of the C54-silicide due to minimized As presence at n+ junctions. At p+ junctions, comparable performance was obtained in Rs reduction at fine lines from both As and Ge PAM schemes. Junction leakage current (JLC) revels are below ~1E-14 A/$\mu\textrm{m}^{2}$ at area patterns for all process conditions, whereas no degradation in JLC is shown under Ge PAM condition even at edge- intensive patterns. Smooth $TiSi_2$ interface is observed by cross- section TEM (X- TEM), which supports minimized silicide agglomeration due to Ge PAM and low level of JLC. Both junction break- down voltage (JBV) and contact resistances are satisfactory at all process conditions.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.69-73
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• 2010

Finite-element analyses were conducted to investigate the thermal stress in 3-dimensional stacked wafers package containing through-silicon-via (TSV), which is being widely used for 3-Dimensional integration. With finite element method (FEM), thermal stress was analyzed with the variation of TSV diameter, bonding diameter, pitch and TSV height. It was revealed that the maximum von Mises stresses occurred at the edge of top interface between Cu TSV and Si and the Si to Si bonding site. As TSV diameter increased, the von Mises stress at the edge of TSV increased. As bonding diameter increased, the von Mises stress at Si to Si bonding site increased. As pitch increased, the von Mises stress at Si to Si bonding site increased. The TSV height did not affect the von Mises stress. Therefore, it is expected that smaller Cu TSV diameter and pitch will ensure mechanical reliability because of the smaller chance of plastic deformation and crack initiation.