• Title/Summary/Keyword: Interconnection capacity

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A Study on the Interconnection between National Disaster Management System and Private Disaster Prevention IT Technology through Application (국가재난관리 시스템과 민간 방재IT기술의 지능정보기술 적용 사례고찰을 통한 상호 연계에 관한 연구)

  • Kim, Jaepyo;Kim, Seungcheon
    • Journal of the Korea Convergence Society
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    • v.11 no.8
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    • pp.15-22
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    • 2020
  • In order to strengthen the disaster prevention phase and the management of social disasters, we will examine the plan of To-Be disaster management system interconnected by using intelligent information technologies such as IoT, Cloud, Big Data, Mobile and AI. The disaster management system can be upgraded by constructing an intelligent infrastructure based on Big Data analysis of the disaster signals before and after the disasters generated by private mobile and IoT. Big Data of disaster Signals can be customized to users in a timely manner through AI methodologies of supervised and unsupervised learning and reinforcement training. In the long term, it is expected that not only will the capacity of disaster response be improved, but the management ability centering on prevention will be enhanced as well.

Application of SFCL on Bus Tie for Parallel Operation of Power Main Transformers in a Fuel Cell Power Systems

  • Chai, Hui-Seok;Kang, Byoung-Wook;Kim, Jin-Seok;Kim, Jae-Chul
    • Journal of Electrical Engineering and Technology
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    • v.10 no.6
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    • pp.2256-2261
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    • 2015
  • In the power plant using high temperature fuel cells such as Molten Carbonate Fuel Cell(MCFC), and Solid Oxide Fuel Cell(SOFC), the generated electric power per area of power generation facilities is much higher than any other renewable energy sources. - High temperature fuel cell systems are capable of operating at MW rated power output. - It also has a feature that is short for length of the line for connecting the interior of the generation facilities. In normal condition, these points are advantages for voltage drops or power losses. However, in abnormal condition such as fault occurrence in electrical system, the fault currents are increased, because of the small impedance of the short length of power cable. Commonly, to minimize the thermal-mechanical stresses on the stack and increase the systems reliability, we divided the power plant configuration to several banks for parallel operation. However, when a fault occurs in the parallel operation system of power main transformer, the fault currents might exceed the interruption capacity of protective devices. In fact, although the internal voltage level of the fuel cell power plant is the voltage level of distribution systems, we should install the circuit breakers for transmission systems due to fault current. To resolve these problems, the SFCL has been studied as one of the noticeable devices. Therefore, we analyzed the effect of application of the SFCL on bus tie in a fuel cell power plants system using PSCAD/EMTDC.

A study on the Normal Steady State Operation Characteristics of PV System Based on the Test Device (태양광전원용 시험장치를 이용한 정상상태 운용특성에 관한 연구)

  • Hasan, Md.Mubdiul;Munkbaht, Munkbaht;Kim, Byung-Ki;Rho, Dae-Seok
    • Proceedings of the KAIS Fall Conference
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    • 2012.05b
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    • pp.512-516
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    • 2012
  • Recently the Korean government's green energy growth policy has been taken at the national level due to the sufficient supply of renewable energy. Some specific technique should be taken in consideration for the operation of the grid voltage and power quality management. In this case, there may have some chance of operational problems. Typical problems arise when grid-connected solar power produced by Pacific sunshine. The power flow in the reverse direction can create overvoltage on the distribution line and gives value of malfunction on the system. Line voltage and overvoltage adjustment practice can stop these symptoms occurred. Under these circumstances, this paper presents an interconnection test devices for photovoltaic(PV) systems composed of distribution system simulator, PV system simulator and control and monitoring systems using the LabVIEW S/W, and simulates the customer voltage characteristics considering the 3 parameters on the introduction capacity for PV systems, system configuration and Power factor. This paper also proposes a new calculation algorithm for voltage profile to make comparison between calculation values and test device values. The results show that the simulation results for the normal operation characteristics of PV systems which are very practical and effective.

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Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.1 s.34
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    • pp.9-16
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    • 2005
  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

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High-Voltage Liquid-Electrolyte Microbatteries Inspired from Electric Eels (전기뱀장어의 전기발생을 모사한 고전압 액체 전해질 미소전지)

  • Kim, Mun-Chul;Cho, Young-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.5
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    • pp.469-473
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    • 2009
  • We present high-voltage liquid-electrolyte microbatteries, inspired from the high-voltage generation mechanism of electric eels using serially connected multiple-cell arrays. In the microbatteries, we purge air into the electrolyte filled in a channel layer to isolate serially connected multiple cell arrays using three surface-tension valves (cell-front, outlet, and cell-end valves). Compared to the previous multi-cell stack or interconnection, present microbatteries provide a reduced multi-cell charging time. We have designed and characterized four different prototypes C1, C10, C20, and C40 having 1, 10, 20, and 40 cells, respectively. In the experimental study, the threshold pressures of cell-front, outlet, and cell-end valves were measured as $460{\pm}47$, $1,000{\pm}53$, and $2,800{\pm}170$ Pa, respectively. The average charging time for C40 was measured as $26.8{\pm}4.9$ seconds where the electrolyte and air flow-rates are 100 and $10{\mu}l/min$, respectively. Microbatteries showed the maximum voltage of 12 V (C40), the maximum power density of $110{\mu}W/cm^2$ (C40), and the maximum power capacity of $2.1{\mu}Ah/cm^2$ (C40). We also proposed a tapered-channel to remove the reaction gas from the cell chamber using a surface tension effect. The present microbatteries are applicable to high-voltage portable power devices.

Analysis of Effect of Surface Temperature Rise Rate of 72.5 Ah NCM Pouch-type Lithium-ion Battery on Thermal Runaway Trigger Time (72.5 Ah NCM계 파우치형 리튬이온배터리의 표면온도 상승률이 열폭주 발생시간에 미치는 영향 분석)

  • Lee, Heung-Su;Hong, Sung-Ho;Lee, Joon-Hyuk;Park, Moon Woo
    • Journal of the Korean Society of Safety
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    • v.36 no.5
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    • pp.1-9
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    • 2021
  • With the convergence of the information and communication technologies, a new age of technological civilization has arrived. This is the age of intelligent revolution, known as the 4th industrial revolution. The 4th industrial revolution is based on technological innovations, such as robots, big data analysis, artificial intelligence, and unmanned transportation facilities. This revolution would interconnect all the people, things, and economy, and hence will lead to the expansion of the industry. A high-density, high-capacity energy technology is required to maintain this interconnection. As a next-generation energy source, lithium-ion batteries are in the spotlight today. However, lithium-ion batteries can cause thermal runaway and fire because of electrical, thermal, and mechanical abuse. In this study, thermal runaway was induced in 72.5 Ah NCM pouch-type lithium-ion batteries because of thermal abuse. The surface of the pouch-type lithium-ion batteries was heated by the hot plate heating method, and the effect of the rate of increase in the surface temperature on the thermal runaway trigger time was analyzed using Minitab 19, a statistical analysis program. The correlation analysis results confirmed that there existed a strong negative relationship between each variable, while the regression analysis demonstrated that the thermal runaway trigger time of lithium-ion batteries can be predicted from the rate of increase in their surface temperature.

Behaviour and design of stainless steel shear connectors in composite beams

  • Yifan Zhou;Brian Uy;Jia Wang;Dongxu Li;Xinpei Liu
    • Steel and Composite Structures
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    • v.46 no.2
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    • pp.175-193
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    • 2023
  • Stainless steel-concrete composite beam has become an attractive structural form for offshore bridges and iconic high-rise buildings, owing to the superior corrosion resistance and excellent ductility of stainless steel material. In a composite beam, stainless steel shear connectors play an important role by establishing the interconnection between stainless steel beam and concrete slab. To enable the best use of high strength stainless steel shear connectors in composite beams, high strength concrete is recommended. To date, the application of stainless steel shear connectors in composite beams is still very limited due to the lack of research and proper design recommendations. In this paper, a total of seven pushout specimens were tested to investigate the load-slip behaviour of stainless steel shear connectors. A thorough discussion has been made on the differences between stainless steel bolted connectors and welded studs, in terms of the failure modes, load-slip behaviour and ultimate shear resistance. In parallel with the experimental programme, a finite element model was developed in ABAQUS to simulate the behaviour of stainless steel shear connectors, with which the effects of shear connector strength, concrete strength and embedded connector height to diameter ratio (h/d) were evaluated. The obtained experimental and numerical results were analysed and compared with existing codes of practice, including AS/NZS 2327, EN 1994-1-1 and ANSI/AISC 360-16. The comparison results indicated that the current codes need to be improved for the design of high strength stainless steel shear connectors. On this basis, modified design approaches were proposed to predict the shear capacity of stainless steel bolted connectors and welded studs in the composite beams.

Experimental and Numerical Analysis of Microvia Reliability for SLP (Substrate Like PCB) (실험 및 수치해석을 이용한 SLP (Substrate Like PCB) 기술에서의 마이크로 비아 신뢰성 연구)

  • Cho, Youngmin;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.1
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    • pp.45-54
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    • 2020
  • Recently, market demands of miniaturization, high interconnection density, and fine pitch of PCBs continuously keep increasing. Therefore, SLP (substrate like PCB) technology using a modified semi additive process (MSAP) has attracted great attention. In particular, SLP technology is essential for the development of high-capacity batteries and 5G technology for smartphones. In this study, the reliability of the microvia of hybrid SLP, which is made of conventional HDI (high density interconnect) and MSAP technologies, was investigated by experimental and numerical analysis. Through thermal cycling reliability test using IST (interconnect stress test) and finite element numerical analysis, the effects of various parameters such as prepreg properties, thickness, number of layers, microvia size, and misalignment on microvia reliability were investigated for optimal design of SLP. As thermal expansion coefficient (CTE) of prepreg decreased, the reliability of microvia increased. The thinner the prepreg thickness, the higher the reliability. Increasing the size of the microvia hole and the pad will alleviate stress and improve reliability. On the other hand, as the number of prepreg layers increased, the reliability of microvia decreased. Also, the larger the misalignment, the lower the reliability. In particular, among these parameters, CTE of prepreg material has the greatest impact on the microvia reliability. The results of numerical stress analysis were in good agreement with the experimental results. As the stress of the microvia decreased, the reliability of the microvia increased. These experimental and numerical results will provide a useful guideline for design and fabrication of SLP substrate.

A study on the Development of Surveillance System for Agricultural Injuries in Korea (농작업재해 감시체계 개발)

  • Koh, Jae-Woo;Kwon, Soon-Chan;Kim, Kyung-Ran;Lee, Kyung-Suk;Jang, Eun-Chul;Kwon, Young-Jun;Ryu, Seung-Ho;Lee, Soo-Jin;Song, Jae-Chul
    • Journal of agricultural medicine and community health
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    • v.32 no.3
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    • pp.139-153
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    • 2007
  • Injury in agriculture is a serious public health issue with a major impact on the lives of Korean farmers. It is one of the leading causes of death and is also a major cause of longand short-term disability. In 2001, the social cost of one accident in agricultural machinery was estimated as 97.7-97.8 million won that is 4 fold of farm household income in Korea. Effective prevention and control of injuries requires a system of surveillance that monitors the incidence of injuries, their causes, treatment and outcomes. This requires an integrated system of data collection, analysis and interpretation and communication. Creating effective injury surveillance system in Korea requires to establish a framework for a national agenda. Discussions regarding the development of the framework should address, but not be limited to issues related to Data Holdings and Linkages; Capacity and Skills; Communication; Interconnection; and Surveillance Products. Ideally, an injury surveillance system would meet the information requirements across all sectors, while allowing each to have the ongoing information it needs for its policy and programming needs. This study was carried out to develop a surveillance system of agricultural injuries in Korea. Study subjects were residents who lived in a typical agricultural area (Yangpyung area in Kyung-gi province). The main data sources were reports of village headmen, compared with data of 'National Emergency Management Agency', 'National Health Insurance Corporation', 'Insurance of National Agricultural Cooperative', and 'Emergency Medical Centers'. Each data were reviewed to validate the strengths and weaknesses.