• Journal of the Microelectronics and Packaging Society
• /
• v.5 no.2
• /
• pp.21-26
• /
• 1998

대용량, 고속데이터 처리가 요구되는 System 개발은 이들의 복잡하고 고기능의 회 로 구현이 가능하냐에 달려 있고 또한 이들고기능 요구를 가장 잘 만족할수 있는 패키지는 MCM 이라 할 수있다. 시스템의 고속화, 소형화는 회로의 복잡성을 요구하는 있는 이를 패 키지로 구현하는 MCM은 시험성 확보에 심각한 문제점으로 나타나고 있다. 본 논문에서는 고밀도 구조의 MCM 기판에 대한 Interconnetion Line 시험검증을 위한 Flying Prober의 적 용 및 모듈 패키징 공정에 대한 조립성 검증을 위한 BST에 대해 설명한다. 연구에 사용된 MCM 모듈은 MCM-D 공정으로 제작되었으며 31um 신호선폭, 50um Via Hole Dia. 5신호 선층 5절연층 및 455 Net의 기판으로절연층은 Dow chemical의 BCB-4024/4026을 적용하였 다. 조립은 3 ASIC, 24소자 실장 및 2000 Wire Bonding으로 이루어지며 패키지는 방열특성 을 고려한 BGA(491 I /O,50mil pitch)를 개발하여 사용하였다. MCM 기판의미세패턴으로 구성된 Interconnection Line에 대해 Fine Ptich Probing이 가능한 Flying Prober를 사용하 여 평가하였으며 BST를 이용하여 실장소자의 KGD평가 및 능동, 수동소자가 실장된 MCM Package의 조립시험성을 확보할수 있었다.

• Proceedings of the KIEE Conference
• /
• 1999.07e
• /
• pp.2069-2072
• /
• 1999

The extended 765 kV system may have severe electrical transients according to the interconnection of transmission lines and have long transmission line over 250 km. So we need to analyze the transient phenomena to confirm the insulation coordination which is designed for 765 kV project step I. In particular, this paper shows the analysis results of secondary arc extinction by HSGS (high speed ground switch) application. The EMTP/MODELS were used to simulation study of secondary arc phenomena. We had confirmed the TRV(transient recovery voltage) and rated current of HSGS which will be used in the KEPCO 765 kV system.

• Journal of Electrical Engineering and Technology
• /
• v.8 no.4
• /
• pp.712-718
• /
• 2013

With the development of industry and the improvement of living standards, better quality in power electric service is required more than ever before. This paper deals with the optimal algorithms for voltage regulation in the case where Distributed Storage and Generation (DSG) systems are operated in distribution systems. It is very difficult to handle the interconnection issues for proper voltage managements, because the randomness of the load variations and the irregular operation of DSG should be considered. This paper proposes the optimal on-line real time voltage regulation methods in power distribution systems interconnected with the DSG systems. In order to deliver suitable voltage to as many customers as possible, the optimal sending voltage should be decided by the effective voltage regulation method by using artificial neural networks to consider the rapid load variation and random operation characteristics of DSG systems. The simulation results from a case study show that the proposed method can be a practical tool for the voltage regulation in distribution systems including many DSG systems.

• Journal of the Korean Vacuum Society
• /
• v.15 no.1
• /
• pp.89-96
• /
• 2006

Recent ULSI and multilevel structure trends in microelectronic devices minimize the line width down to less than $0.25{\mu}m$, which results in high current densities in thin film interconnections. Under high current densities, an EM(electromigration) induced failure becomes one of the critical problems in a microelectronic device. This study is to improve thin film interconnection materials by investigating the EM characteristics in Ag, Cu, Au, and Al thin films, etc. EM resistance characteristics of Ag, Cu, Au, and Al thin films with high electrical conductivities were investigated by measuring the activation energies from the TTF (Time-to-Failure) analysis. Optical microscope and XPS (X-ray photoelectron spectroscopy) analysis were used for the failure analysis in thin films. Cu thin films showed relatively high activation energy for the electromigration. Thus Cu thin films may be potentially good candidate for the next choice of advanced thin film interconnection materials where high current density and good EM resitance are required. Passivated Al thin films showed the increased MTF(Mean-time-to-Failure) values, that is, the increased EM resistance characteristics due to the dielectric passivation effects at the interface between the dielectric overlayer and the thin film interconnection materials.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.52 no.4
• /
• pp.173-178
• /
• 2003

In this paper, we studied the physical and electrical characteristics of $\textrm{WSi}_{x}$ thin film with respect to the adoption of the DCS (dichlorosiliane) post flow and the variation of deposition temperature. XRD measurements show that as deposited thin film has a hexagonal structure regardless of deposition Process. However, we find that the phase of thin film has changed to a tetragonal structure after the heat treatment at $680^{\circ}C$. Adoption of DCS post flow and increment of deposition temperature result in the increments of Si/W composition ratio. These conditions also result in the increment of sheet resistance by the amount 3.0~4.2$\Omega$/$\square$, but give the tendency in the decrement of stress by 0.27~0.3 E10dyne/$\textrm{cm}^2$. We also find that the contact resistance of word line and bit line interconnection was decreased by the amount 5.33~16.43$\mu$$\Omega$-$\textrm{cm}^2$, when applying DCS post flow and increasing deposition temperature.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.18 no.4
• /
• pp.118-123
• /
• 2004

This paper studies islanding detection of DG(distributed generation) considering fault location. Through the past studies, we found that islanding detection has been studied that DG disconnected when power islanding was detected by power state change and output change of DG. But, fault location was not considered. For example, fault in adjacent distribution line, fault on interconnection line fault, load shave by overload and normal operation were not considered. In this paper, We distinguish these considerations through power state change. Also, we proved islanding detection algorithm through PSCAD/EMTDC simulation.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
• /
• 2009.10a
• /
• pp.305-309
• /
• 2009

This paper operate with variable line impedance equipment consist of resister and reactor, when connect to 3phase induce motor present solve problem appear grid interconnection before/after about voltage transient of pv inverter through test and analysis solve problem.

• Journal of Electrical Engineering and Technology
• /
• v.8 no.5
• /
• pp.1070-1077
• /
• 2013

Owing to the consistent increase in energy efficiency issues, studies for improving regenerative energy utilization have been receiving attention in the Urban DC railway systems, where currently, the utilization of regenerative energy is low due to the lack of a specific plan for using this energy. The regenerative energy in railway systems has a low efficiency problem which results in the increase of the catenary voltage and a possibility to create problems to the electrical devices connected to the system. This paper deals with the power integration of large urban railway subsystems to improve regenerative energy utilization where the railway subsystems are integrated with other railway subsystems to improve the energy efficiency. Through the case studies, to find the realistic effect of integrated operation, the Seoul Metro subsystems, namely Line 5 and Line 7, has been applied. Also, evaluation for the electricity cost saving has been performed by using KEPCO electricity cost table.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.4
• /
• pp.298-302
• /
• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.18 no.2 s.117
• /
• pp.111-117
• /
• 2007

In this paper, a new marchand balun using broadside-coupled coplanar waveguide(CPW) on flexible printed circuit (FPC) is proposed. The proposed balun is designed based on the coupled line theory. The fabricated balun shows compact size and improved performance compared to the conventional microstrip line marchand balun. Measured amplitude and phase imbalance between the two balanced output ports are within 0.2 dB and $1^{\circ}$ respectively in a wide frequency range($1.63{\sim}3.44$ GHz). The proposed balun is expected to be used between various antennas and RF front-ends as a functional interconnection.