• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.

• The Transactions of the Korea Information Processing Society
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• v.6 no.7
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• pp.1756-1769
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• 1999

Parallel paths in an interconnection network have some significance in that message transmission time can be reduced because message is divided into packets and transmitted in parallel through several paths, and also an whose nodes has 2n binary bit string, is an interconnection network which has a lower network cost than hypercube and its variation. In this paper, we analyze node disjoint parallel path in Folded Hyper-Star graph FHS(2n,n) proposed as the topology of parallel computers and, using the result, prove that the fault diameter of a Folded Hyper-Star graph FHS(2n,n) is 2n-1.

• Journal of information and communication convergence engineering
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• v.19 no.2
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• pp.114-119
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• 2021

This paper proposes a method to find an optimal T' with the most terminal of the subset of T' trees that can be connected by a given length by improving a memetic genetic algorithm within several constraints, when the set of terminal T is given to the Euclidean plane R². Constraint (1) is that a given length cannot connect all terminals of T, and (2) considers only the rectilinear layout of the edge connecting each terminal. The construction of interconnections has been used in various design-related areas, from network to architecture. Among these areas, there are cases where only the rectilinear layout is considered, such as wiring paths in the computer network and VLSI design, network design, and circuit connection length estimation in standard cell deployment. Therefore, the heuristics proposed in this paper are expected to provide various cost savings in the rectilinear layout.

• Journal of information and communication convergence engineering
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• v.20 no.2
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• pp.90-95
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• 2022

This paper proposes a method to find a tree with the maximum number of terminals that can be connected by a given length when numerous terminals distributed in a cluster form are given to the Euclidean plane R2 with several constraints. First constraint is that a given terminal is distributed in a cluster form, second is that a given length cannot connect all terminals in the tree, and third is that there is no curved connection between each terminal. This paper proposes a method to establish more efficient interconnections within terminals distributed in a cluster form by improving a randomly distributed memetic genetic algorithm. The construction of interconnections has been extensively used in design-related fields, from networking to architecture. Additionally, in real life, the construction of interconnections is mostly distributed in the form of clusters. Therefore, the heuristic algorithm proposed in this paper can be effectively utilized in real life and is expected to provide various cost savings.

• Journal of Korea Multimedia Society
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• v.9 no.9
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• pp.1173-1183
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• 2006

Matrix-star, Pancake, and RFM graphs have such a good property of Star graph and a lower network cost than Hypercube. Matrix-star graph has Star graph as a basic module and the node symmetry, the maximum fault tolerance, and the hierarchical decomposition property. Also it is an interconnection network that improves the network cost against Star graph. In this paper, we propose a method to embed among Matrix-star Pancake, and RFM graphs using the edge definition of graphs. We prove that Matrix-star $MS_{2,n}$ can be embedded into Pancake $P_{2n}$ with dilation 4, expansion 1, and $RFM_{n}$ graphs can be embedded into Pancake $P_{n}$ with dilation 2. Also, we show that Matrix-star $MS_{2,n}$ can be embedded into the $RFM_{2n}$ with average dilation 3.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2003.11a
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• pp.305-308
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• 2003

It is widely used that a network termination rate is calculated by using a Long Run Incremental Costing model. Interconnection Order issued Ministry of Information and Communication in Korea on December 2002 has declared that termination charges of local, national, payphone, and mobile calls are going to be determined by LRIC costing models after 2004. There are lots of preceding researches on a fixed network costing model for applying to LRIC method but on a mobile network not pretty much of them. Besides, Most important basis of current calculation models for termination charges are access costs to connect subscribers to network such as a local loop. In this paper, we look into being of access costs in mobile network and show the applicable standards for cost allocation of access costs in implementing LRIC costing model.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.601-602
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.605-606
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• 2006

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.2233-2234
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.2235-2236
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.