• Title/Summary/Keyword: Interconnect architecture

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Design and Verification of PCI Controller in a Multimedia Processor (멀티미디어 프로세서의 PCI 컨트롤러 디자인 및 검증)

  • 이준희;남상준;김병운;임연호;권영수;경종민
    • Proceedings of the IEEK Conference
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    • 1999.11a
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    • pp.499-502
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    • 1999
  • This paper presents a PCI (Peripheral Component Interconnect) controller embedded in a multimedia processor, called FLOVA (FLOating point VLIW Architecture), targeting for 3D graphics applications. Fast I/O interfaces are essential for multimedia processors which usually handle large amount of multimedia data. Therefore, in FLOVA, PCI bus is adopted for I/O interface due to fast burst transaction. However, there are several problems in implementation and verification to use burst transaction of PCI. It is difficult to handle data transaction between two units which have two different operating frequency. FLOVA has more higher operating frequency about 100MHz than that of PCI local bus and it makes lower utilization of FLOVA bus. Also, traditional simulation is not sufficient for verification of PCI functionality. In this paper, we propose buffering schemes to implement the PCI controller with wide bandwidth and high bus utilization. Also, this paper shows how to verify the PCI controller using real PCI bus environments before its fabrication.

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A Simulation of Bridge using the Spanning Tree Protocol (스패닝 트리 프로토콜을 이용한 브릿지 시뮬레이션)

  • Lee, Sook-Young;Lee, Eun-Wha;Lee, Mee-Jeong;Chae, Ki-Joon;Choi, Kil-Young;Kang, Hun
    • Journal of the Korea Society for Simulation
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    • v.6 no.2
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    • pp.45-57
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    • 1997
  • MAC (media access control) bridge is used to interconnect separate LANs and to relay frames between the BLANs (bridged LANs). Bridge architecture consists of MAC entity, MAC relay entity and bridge protocol entity protocol entity and performs learning, filtering and forwarding functions using filtering database. In this paper, we simulate these functions of bridge and the STP (spanning tree protocol). The STP derives an active topology from an arbitrarily connected BLAN. Our simulation model assumes a BLAN consisted of three bridge forming a closed loop. In order to remove the loop, each bridge process exchanges configruation BPDU (bridge protocol data unit0 with other bridge processes connected to the bridge itself. To simulate the communication between bridges, we implement the IPC (inter-process communication) server using message queues. Our simulation results show that the assumed BLAN contains no closed loop and then there is no alternative route and no unnecessary traffic.

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CPU Technology and Future Semiconductor Industry (I) (CPU 기술과 미래 반도체 산업 (I))

  • Park, Sahnggi
    • Electronics and Telecommunications Trends
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    • v.35 no.2
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    • pp.89-103
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    • 2020
  • Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

CPU Technology and Future Semiconductor Industry (III) (CPU 기술과 미래 반도체 산업 (III))

  • Park, Sahnggi
    • Electronics and Telecommunications Trends
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    • v.35 no.2
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    • pp.120-136
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    • 2020
  • Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

CPU Technology and Future Semiconductor Industry (II) (CPU 기술과 미래 반도체 산업 (II))

  • Park, Sahnggi
    • Electronics and Telecommunications Trends
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    • v.35 no.2
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    • pp.104-119
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    • 2020
  • Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

The Design of Integrated Flying Vehicle Model for Engagement Analyses of Missiles

  • Ha, Sue Hyung
    • Journal of Korea Multimedia Society
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    • v.22 no.8
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    • pp.930-939
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    • 2019
  • High-Level Architecture(HLA)/Run-Time Infrastructure(RTI) are standards for distributed simulation systems and offer a technology to interconnect them and form one single simulation system. In defense domain, M&S is the only way to prove effectiveness of weapon systems except for Live Fire Testing (LFT). This paper focuses on guided missile simulations in weapon systems for engagement analyses and proposes the integrated flying vehicle model that is based on HLA/RTI. There are a lot of missiles in real world; therefore, we should develop each missile models in M&S in order to apply battlefield scenarios. To deal with the difficulties, in this paper, firstly, I classify these missiles into three models: ballastic, cruise, and surface-to-air missile models, and then I design each missile model and integrates them into a single model. This paper also offers a case study with my integrated flying vehicle model. At the conclusion, this paper presents contributions of this paper.

Improving Parallel Testing Efficiency of Memory Chips using NOC Interconnect (NOC 인터커넥트를 활용한 메모리 반도체 병렬 테스트 효율성 개선)

  • Hong, Chaneui;Ahn, Jin-Ho
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.68 no.2
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    • pp.364-369
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    • 2019
  • Generally, since memory chips should be tested all, considering its volume, the reduction in test time for detecting faults plays an important role in reducing the overall production cost. The parallel testing of chips in one ATE is a competitive solution to solve it. In this paper, NOC is proposed as test interface architecture between DUTs and ATE. Because NOC can be extended freely, there is no limit on the number of DUTs tested at the same time. Thus, more memory can be tested with the same bandwidth of ATE. Furthermore, the proposed NOC-based parallel test method can increase the efficiency of channel usage by packet type data transmission.

SAMBA Type MPSoC Bus Architecture Optimization under Performance Constraints (성능 제약 조건 하에서의 SAMBA 형 MPSoC 버스 구조 최적화)

  • Kim, Hong-Yeom;Jung, Sung-Chul;Shin, Hyun-Chul
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.1
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    • pp.94-101
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    • 2010
  • Optimization of interconnects among processors and memories becomes important as multiple processors and memories can be integrated on a Multi-Processor System-on-Chip (MPSoC). Since the optimal interconnection architecture is usually dependent on the applications, systematic design methodology for various data transfer requirements is necessary. In this paper, we focus on bus interconnection for MPSoC applications which use 4 ~ 16 processors. We propose a new systematic bus design methodology under performance constraints using Single Arbitration Multiple Bus Accesses (SAMBA) style bus architectures. Optimized bus architecture is found to satisfy performance constraints for a single or multiple applications. When compared to the unoptimized architecture, our method can reduce the bus switch logic circuits significantly (by more than 50% sometimes). Furthermore, low cost bus architectures can be found to satisfy the performance constraints for multiple applications.

Interconnecting Methods of Web based IPTV Contents Provider to IMS and Its Characteristics (IMS 네트워크에 웹기반 IPTV 콘텐츠 사업자 접속 방식 및 특성)

  • Kim, Hyun-Ji;Han, Chi-Moon
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.47 no.6
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    • pp.49-57
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    • 2010
  • In the near future IPTV services will be emerged the various types through Internet, but IMS based IPTV service is one of the very attractive IPTV services. This paper describes the interconnecting architectures of Web based IPTV contents provider to IMS(IP Multimedia System) network and describes the three difference architectures as method to find its IP address. One is the architecture using DNS or HSS to find IP address of Web based IPTV contents provider and connecting gateway function to I-CSCF in IMS. The other is the architecture connecting gateway AS to ISC interface of S-CSCF in IMS. This paper describes the characteristics of traffic generating due to interconnect the Web contents provider, and the traffic model of each architectures. The proposed each architecture is emulated the session establishment delay characteristics in CoD service of IPTV by the simulation. This paper shows that the architecture connecting gateway AS to ISC interface of S-CSCF is the excellent method compare to other two methods in view of the session establishment delay.

A Design of AXI hybrid on-chip Bus Architecture for the Interconnection of MPSoC (MPSoC 인터커넥션을 위한 AXI 하이브리드 온-칩 버스구조 설계)

  • Lee, Kyung-Ho;Kong, Jin-Hyeung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.8
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    • pp.33-44
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    • 2011
  • In this paper, we presents a hybrid on-chip bus architecture based on the AMBA 3.0 AXI protocol for MPSoC with high performance and low power. Among AXI channels, data channels with a lot of traffic are designed by crossbar-switch architecture for massively parallel processing. On the other hand, addressing and write-response channels having a few of traffic is handled by shared-bus architecture due to the overheads of (areas, interconnection wires and power consumption) reduction. In experiments, the comparisons are carried out in terms of time, space and power domains for the verification of proposed hybrid on-chip bus architecture. For $16{\times}16$ bus configuration, the hybrid on-chip bus architecture has almost similar performance in time domain with respect to crossbar on-chip bus architecture, as the masters's latency is differenced about 9% and the total execution time is only about 4%. Furthermore, the hybrid on-chip bus architecture is very effective on the overhead reduction, such as it reduced about 47% of areas, and about 52% of interconnection wires, as well as about 66% of dynamic power consumption. Thus, the presented hybrid on-chip bus architecture is shown to be very effective for the MPSoC interconnection design aiming at high performance and low power.