• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.115.1-115.1
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• 2014

Atom-thick 2-dimensional materials such as graphene, h-BN and MoS2 hold substantial potential for applications in future molecular-scale integrated electronics, transparent conducting membranes, nanocomposites, etc. From a fundamental point of view, 2-dim crystal-solid substrates can also serve as a unique system to study various physicochemical phenomena occurring at low dimensions or interfaces. In this talk, I will present our recent Raman spectroscopy studies on the surface science problems of graphene: interfacial charge transfer, molecular diffusion in confined space and structural deformation.

• Advances in Computational Design
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• v.4 no.4
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• pp.381-395
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• 2019

This paper proposes a new approach to model the screw joints of integrated ceilings via the finite element method (FEM). The simulation models consist of the beam elements. The screw joints used in the main bars and cross bars and in the W bars and cross bars are assumed to be rotation springs. The stiffness of the rotation springs is defined according to the technical standards proposed by the National Institute for Land and Infrastructure Management of Japan. By comparing the results of the sheer tests and the simulation models, the effectiveness and efficiency of the simulation models proposed in this paper are verified. This paper indicates the possibility that the seismic performance of suspended ceilings can be confirmed directly via beam element models using FEM if the stiffnesses of the screw joints of the ceiling substrates are appropriately defined. Because cross-sectional shapes, physical properties, and other variables of the ceiling substrates can be easily changed in the models, it is expected that suspended ceiling manufactures will be able to design and confirm the seismic performance of suspended ceilings with different cross-sectional shapes or materials via computers, instead of spending large amounts of time and money on shake table tests.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.413-413
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• 2014

In this paper, we present a fabrication method of functionalized gold nanostructures on flexible substrate that can be implemented for plasmonic sensing application. For biomolecular sensing, many researchers exploit unconventional lithography method like nanoimprint lithography (NIP), contact transfer lithography, soft lithography, colloidal transfer printing due to its usability and easy to functionalization. In particular, nanoimprint and contact transfer lithography need to have anti-adhesion layer for distinctive metallic properties on the flexible substrates. However, when metallic thin film was deposited on the anti-adhesion layer coated substrates, we discover much aggravation of the mold by repetitive use. Thus it would be impossible to get a high quality of metal nanostructure on the transferred substrate for developing flexible electronics based transfer printing. Here we demonstrate a method for nano-pillar mold and transfer the controllable nanoparticle array on the flexible substrates without an anti-adhesion layer. Also functionalization of gold was investigated by the different length of thiol applied for effectively localized surface plasmonic resonance sensing. First, a focused ion beam (FIB) and ICP-RIE are used to fabricate the nanoscale pillar array. Then gold metal layer is deposited onto the patterned nanostructure. The metallic 130 nm and 250 nm nanodisk pattern are transferred onto flexible polymer substrate by bi-layer functionalized contact imprinting which can be tunable surface energy interfaces. Different thiol reagents such as Thioglycolic acid (98%), 3-Mercaptopropionic acid (99%), 11-Mercaptoundecanoic acid (95%) and 16-Mercaptohexadecanoic acid (90%) are used. Overcoming the repeatedly usage of the anti-adhesion layer mold which has less uniformity and not washable interface, contact printing method using bi-layer gold array are not only expedient access to fabrication but also have distinctive properties including anti-adhesion layer free, functionalized bottom of the gold nano disk, repeatedly replicate the pattern on the flexible substrate. As a result we demonstrate the feasibility of flexible plasmonic sensing interface and anticipate that the method can be extended to variable application including the portable bio sensor via mass production of stable nanostructure array and other nanophotonic application.

• Journal of Information Display
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• v.13 no.2
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• pp.55-59
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• 2012

In this paper, a concept of an integrated elastomer substrate for a three-dimensional (3D) liquid crystal display based on the integral-imaging method is presented. The elemental lens array and columnar spacers were integrated into one of the two substrates, an elastomer substrate, through an imprinting process. The integrated elastomer substrate was capable of maintaining the uniform liquid crystal (LC) cell gap and promoting homeotropic LC alignment without any surface treatment. The monolithic approach reported herein will provide a key component for 3D displays with enhanced portability through a more than 40% weight reduction compared with the conventional integral-imaging method.

• Bulletin of the Korean Chemical Society
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• v.27 no.1
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• pp.17-26
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• 2006

We have shown that zeolite microcrystals can be readily organized in the form of uniformly oriented monoand multilayers on various substrates by well-defined chemical linkages based on covalent, ionic, and hydrogen bondings between the microcrystals and the substrates. This finding establishes the fact that micrometer-scale building blocks can be readily organized into organized entities through interconnection of the surface-tethered large number of functional groups. Since zeolite crystals have highly regular and uniform nanochannels and nanopores within them, the resulting mono and multilayers of zeolite microcrystals bear great potential to be utilized in various novel applications.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1279-1282
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• 2008

Organic field effect transistors are excellent candidates for addressing and local amplification elements for large area electronics because they can easily be processed at low temperatures on essentially arbitrary substrates. We present the use of these devices in an active matrix photodetector and as a buffer for a strain sensor.

• ETRI Journal
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• v.23 no.1
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• pp.23-32
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• 2001

Examination of the statistical variation of integrated passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, the statistical analysis of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process is presented. A set of integrated capacitor structures is fabricated, and their scattering parameters are measured for a range of frequencies from 50 MHz to 5 GHz. Using optimized equivalent circuits obtained from HSPICE, mean and absolute deviation is calculated for each component of each device model. Monte Carlo Analysis for the capacitor structures is then performed using HSPICE. Using a comparison of the Monte Carlo results and measured data, it is determined that even a small number of sample structures, the statistical variation of the component values provides an accurate representation of the overall capacitor performance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.160-163
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• 2002

Silica waveguide for an integrated diffractive optical head system was designed and fabricated. The waveguide was designed to optimize the optical efficiency of red and/or blue laser source, and a lab-made RF magnetron sputter was adopted to deposit silica cladding and core layers on SiO$_2$/Si substrates. The cladding and core layers were formed using commercial targets, and the former was done with ＃7740 and the latter with BK7 and BAK4, respectively The surface roughness of the waveguide layers was measured to be 30.3${\AA}$ for BK7 and 17.8${\AA}$ for BAK4, and the difference of refractive indices between core and cladding layers was 0.9% and 2.5%, respectively. The waveguide fabricated with the core layer of BK7 showed better optical properties when the final diffractive optical probe heads were measured with red laser(650nm) source.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.300-300
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• 2006

Nondestructive nanostructural analysis is indispensable in the development of nano-materials and nano-fabrication processes for use in nanotechnology applications. In this paper, we demonstrate for the first time a quantitative, nondestructive analysis of nanostructured thin films supported on substrates and their templated nanopores by using grazing incidence X-ray scattering and data analysis with a derived scattering theory. Our analysis disclosed that vertically oriented nanodomain cylinders had formed in 20-100 nm thick films supported on substrates consisting of a mixture of poly(styrene-b-methyl methacrylate) (PS-b-PMMA) and PMMA homopolymer, and that the PMMA nanodomains were selectively etched out by ultraviolet light exposure and a subsequent rinse with acetic acid, resulting in a structure consisting of hexagonally packed cylindrical nanopores.

• Journal of Sensor Science and Technology
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• v.32 no.6
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• pp.386-390
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• 2023

Stiffness-engineered stretchable substrate technology has been widely used to produce stretchable displays, transistors, and integrated circuits because it is compatible with various flexible electronics technologies. However, the stiffness-engineering technology has never been applied to transistor-based stretchable strain sensors. In this study, we developed thin-film transistor-based strain sensors on stiffness-engineered stretchable substrates. We designed and fabricated strain-sensitive stretchable resistors capable of inducing changes in drain currents of transistors when subjected to stretching forces. The resistors and source electrodes of the transistors were connected in series to integrate the developed stretchable resistors with thin-film transistors on stretchable substrates by printing the resistors after fabricating transistors. The thin-film transistor-based stretchable strain sensors demonstrate feasibility as strain sensors operating under strains of 0%-5%. This strain range can be extended with further investigations. The proposed stiffness-engineering approach will expand the potential for the advancement and manufacturing of innovative stretchable strain sensors.