• Title/Summary/Keyword: Integrated substrate

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RF Characteristics of Open Stubs on PES Substrate for Application to Capacitive Matching Components on Flexible MMIC

  • Yun, Young;Jeong, Jang-Hyeon;Kim, Hong-Seung;Jang, Nak-Won
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.3
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    • pp.142-145
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    • 2015
  • In this work, open stubs were fabricated on a polyether sulfone (PES) substrate, and their basic radio frequency (RF) characteristics were investigated for application to RF matching components of a flexible monolithic microwave integrated circuit (MMIC). According to the results, an open stub employing coplanar waveguide (OSCPW) on PES exhibited much lower loss than that on silicon substrate. The OSCPW with a length of $500{\mu}m$ on PES showed capacitance values of 0.031 ~ 0.044 pF from 0.5 to 50 GHz. For application to a relatively high-value capacitive matching, an open stub employing a fishbone-type transmission line (OSFTTL) was fabricated on PES, and its characteristics were investigated. The OSFTTL showed much higher capacitance values than the OSCPW due to the high effective permittivity value. Specifically, the OSFTTL on PES showed capacitance values of 0.066 ~ 0.24 pF from 0.5 to 50 GHz, which are higher than those for the open stub on silicon substrate. The above results indicate that the OSCPW and OSFTTL on PES can be effectively used for application to low/high-value capacitive matching components on microwave and millimeter wave flexible MMIC. To the best of the authors' knowledge, this work is the first report of the investigation of RF capacitive matching components on PES substrate.

A Study on the Q-Factor Characteristics of Integrated Inductors Array (박막 인덕터 어레이의 Q-Factor 특성에 관한 연구)

  • Kim, In-Sung;Min, Bok-Ki;Song, Jae-Sung
    • Proceedings of the KIEE Conference
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    • 2004.07c
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    • pp.2105-2107
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    • 2004
  • In this study, Spiral inductors on the $SiO_2$/Si(100) substrate were fabricated by the magnetron sputtering method. Cu thin film with the thickness of 2 ${\mu}m$ was deposited on the substrate. Also we fabricated square inductors through the wet chemical etching technique. The inductors are completely specified by the turn width and the spacing between spirals. Both the width and spacing between spirals were varied from 10 to 60 ${\mu}m$ and from 20 to 70 ${\mu}m$, respectively. Inductance and Q factor dependent on the RF frequency were investigated to analyze performance of inductor arrays. Also, We recommend that the reasonable Q-factors, spec's turns and thickness of the coil for inductors cab be set to be ideal condition.

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Design of a Wideband Substrate-Integrated Waveguide (SIW) Frequency Selective Surface (광대역 특성을 가지는 SIW 주파수 선택 표면 설계)

  • Oh, Semyoung;Lee, Hanjun;Lee, Gil-Young
    • Journal of Institute of Control, Robotics and Systems
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    • v.20 no.2
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    • pp.107-111
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    • 2014
  • An SIW cavity is a useful tool to design an FSS which shows a rapid roll-off rate and insensitivity to polarizations and incident angles of electromagnetic waves. However, due to its high Q-factor, the FSS also shows narrow bandwidth which is undesirable for high-capacity communication. To address this drawback, we propose a novel technique to enhance the bandwidth while maintaining similar frequency response characteristics and minimizing the increase of the overall thickness of the SIW cavity FSS. In order to verify the performance of the technique, simulated frequency responses will be provided. Also, a parameter which affects the bandwidth will be studied. Finally the stability to polarizations and incident angles will be observed through the simulated results.

Fabrication of Substrate Integrated Waveguide (SIW)-based Shielded Stripline using Silicon Anisotropic Wet-Etch and BCB-based Polymer Bonding (실리콘 이방성 습식 식각과 BCB 폴리머 접합을 이용한 기판 집적형 도파관(SIW) 기반의 차폐된 스트립선로의 제작)

  • Bang, Yong-Seung;Kim, Nam-Gon;Kim, Jung-Mu;Cheon, Chan-Gyul;Kwon, Young-Woo;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1513_1514
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    • 2009
  • This paper reports on a fabrication of novel substrate integrated waveguide (SIW)-based shielded stripline applicable to the broadband transverse electromagnetic (TEM) single-mode propagation. We suggested a structure for half-SIW and half-shielded stripline, which combined through the benzocyclobutene (BCB) bonding layer. The electrical interconnection between the sidewall of anisotropic wet-etched silicon and patterned BCB layers is measured subsequent to the metalization on the side wall. The proposed SIW-based shielded stripline has great potential in terms of simple fabrication, integration with planar circuits and monolithic system fabricated on a SIW structure.

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A Method for Calculating the Characteristic Impedance of Substrate Integrated Artificial Dielectric Transmission Lines (기판적층형 가유전체 전송선로의 특성 임피던스 계산 방법)

  • Lim, Jong-Sik;Koo, Ja-Kyung;Han, Sang-Min;Jeong, Yong-Chae;Ahn, Dal
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.58 no.8
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    • pp.1585-1591
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    • 2009
  • This paper describes a new method for extracting characteristic impedance of transmission line using Substrate Integrated Artificial Dielectric (SIAD). The new procedure to calculate the characteristic impedance of SIAD transmission line is described with the proper equations and basic transmission line theory. The characteristic impedance is determined as an almost fixed value in the proposed method, while it fluctuates according to frequency in the previous method. As the result, the effective dielectric constant of SIAD transmission line is calculated as a fixed value rather than fluctuating one. In order to show the validity of the proposed method, SIAD microstrip lines are simulated and measured, and characteristic impedances and effective dielectric constant are calculated and compared to the previous method.

GaAs 기반 IPD(Integrated Passive Device)를 이용한 Power Divider

  • Yu, Chan-Se;Song, Saeng-Seop;Jeong, Seong-Hun;Lee, U-Seong;Kim, Jun-Cheol;Gang, Nam-Gi;Seo, Gwang-Seok
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.543-544
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    • 2008
  • Nowadays, the research on the system integration using various technologies, like MCM-C, MCM-L and MCM-D. Especially, MCM-D technology is suitable for mmwave application due to its high resolution of patterning and thermal property similar to that of semiconductor devices. In this work, integrated passive devices like inductor, capacitor and resistor are evaluated on the GaAs substrate and their characteristics are examined. And finally, the Wilkinson power divider using lumped IPD are evaluated on GaAs substrate and it shows low insertion loss below 0.5 dB and the isolation over 15 dB.

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Package-Platformed Linear/Circular Polarization Reconfigurable Antenna Using an Integrated Silicon RF MEMS Switch

  • Hyeon, Ik-Jae;Jung, Tony J.;Lim, Sung-Joon;Baek, Chang-Wook
    • ETRI Journal
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    • v.33 no.5
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    • pp.802-805
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    • 2011
  • This letter presents a K-band polarization reconfigurable antenna integrated with a silicon radio frequency MEMS switch into the form of a compact package. The proposed antenna can change its state from linear polarization (LP) to circular polarization (CP) by actuating the MEMS switch, which controls the configuration of the coupling ring slot. Low-loss quartz is used for a radiating patch substrate and at the same time for a packaging lid by stacking it onto the MEMS substrate, which can increase the system integrity. The fabricated antenna shows broadband impedance matching and exhibits high axial ratios better than 15 dB in the LP and small axial ratios in the CP, with a minimum value of 0.002 dB at 20.8 GHz in the K-band.

High Performance Wilkinson Power Divider Using Integrated Passive Technology on SI-GaAs Substrate

  • Wang, Cong;Qian, Cheng;Li, De-Zhong;Huang, Wen-Cheng;Kim, Nam-Young
    • Journal of electromagnetic engineering and science
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    • v.8 no.3
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    • pp.129-133
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    • 2008
  • An integrated passive device(IPD) technology by semi-insulating(SI)-GaAs-based fabrication has been developed to meet the ever increasing needs of size and cost reduction in wireless applications. This technology includes reliable NiCr thin film resistor, thick plated Cu/Au metal process to reduce resistive loss, high breakdown voltage metal-insulator-metal(MIM) capacitor due to a thinner dielectric thickness, lowest parasitic effect by multi air-bridged metal layers, air-bridges for inductor underpass and capacitor pick-up, and low chip cost by only 6 process layers. This paper presents the Wilkinson power divider with excellent performance for digital cellular system(DCS). The insertion loss of this power divider is - 0.43 dB and the port isolation greater than - 22 dB over the entire band. Return loss in input and output ports are - 23.4 dB and - 25.4 dB, respectively. The Wilkinson power divider based on SI-GaAs substrates is designed within die size of $1.42\;mm^2$.

Miniaturization of SIW-Based Linearly Polarized Slot Antennas for Software-Defined Radar

  • Han, Jun Yong;Yoon, Seong Sik;Lee, Jae Wook
    • Journal of electromagnetic engineering and science
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    • v.16 no.4
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    • pp.248-253
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    • 2016
  • Two substrate integrated waveguide (SIW)-based antennas for the application of software-defined radar are proposed and investigated herein. It is usually well known that SIWs are easily integrated, lightweight, have low insertion loss, and low interference levels compared to conventional microstrip structures. The primary function of the proposed antennas is to transmit continuous waves for indoor motion detection, with the lowest amount of loss and an appropriate amount of gain. Moreover, the results of this study show that the size of the antenna can be reduced significantly (i.e., by about 40%) by applying a meander line structure. The operating frequencies of the proposed antennas are both within the industrial, scientific, and medical band (i.e., 2.4-2.4835 GHz). Measured results of return loss are -16 dB and -20 dB at 2.435 GHz and 2.43 GHz, respectively, and the measured gain is 8.2 dBi and 5.5 dBi, respectively. Antenna design and verification are undertaken through commercially available full electromagnetic software.

The New Smart Power Modules for up to 1kW Motor Drive Application

  • Kwon, Tae-Sung;Yong, Sung-Il
    • Journal of Power Electronics
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    • v.9 no.3
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    • pp.464-471
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    • 2009
  • This paper introduces a new Motion-$SPM^{TM}$ (Smart Power Modules) module in Single In-line Package (SIP), which is a fully optimized intelligent integrated IGBT inverter module for up to 1kW low power motor drive applications. This module offers a sophisticated, integrated solution and tremendous design flexibility. It also takes advantage of pliability for the arrangement of heat-sink due to two types of lead forms. It comes to be realized by employing non-punch-through (NPT) IGBT with a fast recovery diode and highly integrated building block, which features built-in HVICs and a gate driver that offers more simplicity and compactness leading to reduced costs and high reliability of the entire system. This module also provides technical advantages such as the optimized cost effective thermal performances through IMS (Insulated Metal Substrate), the high latch immunity. This paper provides an overall description of the Motion-$SPM^{TM}$ in SIP as well as actual application issues such as electrical characteristics, thermal performance, circuit configurations and power ratings.