• Journal of Digital Contents Society
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• v.17 no.3
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• pp.173-180
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• 2016

In this paper, a design of transceiver module for real-time wire and wireless robust integrated security system to solve the problem of conventional security system and its transceiver module is proposed. The presented robust integrated security system is designed with RF control unit and wireless transceiver module. A RF controller in transceiver module works as a low-power RF transceiver system. It is designed to use specific bandwidth stored in registers and manipulate RF power of transceiver by accessing the random values of registers. Operation algorithm for RF transceiver module is also presented. The designed transceiver module and the operation algorithm are implemented and verified by experiments.

• Journal of the Korea Society of Computer and Information
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• v.11 no.5 s.43
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• pp.267-272
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• 2006

In this paper, an integrated and small Ka-band transceiver module has been developed for measuring distance at the radar systems. Oscillator of cavity type, The MMIC such as VCO, power amplifier, LNA, and mixer, and passive components are integrated on carriers and these are assembled in the transceiver module directly. The test result shows the output power of 21dBm and the noise figure of 5dB using developed transceiver module. Using developed FMCW transceiver module. We can measure the 60m range target by detecting the beat frequency and distinguish both earth and sky using radiometer signal. So we defined that the integrated module using MMIC had a good performance for the radar and radiometer at Ka-band.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.2
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• pp.154-161
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• 2011

This paper presents a compact integrated transceiver module for 2.4 GHz band applications using Low Temperature Co-fired Ceramic(LTCC) technology. The implemented transceiver module is divided into an RF Front-End Module (FEM) part and a transceiver IC chip part. The RF FEM part except an SPDT switch and DC block capacitors is fully embedded in the LTCC substrate. The fabricated RF FEM has 8 pattern layers and it occupies less than $3.3\;mm{\times}5.2\;mm{\times}0.4\;mm$. The measured results of the implemented RF FEM are in good agreement with the simulated results. The transceiver IC chip part consists of signal line, power line and transceiver IC for 2.4 GHz band communication system. The fabricated transceiver module has 9 layers including three inner grounds and it occupies less than $12\;mm{\times}8.0\;mm{\times}1.1\;mm$. The implemented transceiver module provides an output power of 18.1 dBm and a sensitivity of -85 dBm.

• ETRI Journal
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• v.32 no.2
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• pp.195-203
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• 2010

A new vertical transition between a substrate integrated waveguide in a low-temperature co-fired ceramic substrate and an air-filled standard waveguide is proposed in this paper. A rectangular cavity resonator with closely spaced metallic vias is designed to connect the substrate integrated waveguide to the standard air-filled waveguide. Physical characteristics of an air-filled WR-22 to WR-22 transition are compared with those of the proposed transition. Simulation and experiment demonstrate that the proposed transition shows a -1.3 dB insertion loss and 6.2 GHz bandwidth with a 10 dB return loss for the back-to-back module. A 40 GHz low-temperature co-fired ceramic module with the proposed vertical transition is also implemented. The implemented module is very compact, measuring 57 mm ${\times}$ 28 mm ${\times}$ 3.3 mm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.3 s.333
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• pp.25-34
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• 2005

In this paper, we analyzed and measured the electrical crosstalk characteristics of a triplex transceiver module for ethernet Passive optical networks(EPONS). And we improved the electrical crosstalk levels using Dummy ground lines with signal lines. The triplex transceiver module consists of a laser diode as a transmitter, a digital photodetector as a digital data receiver, and a analog photodetector as a community antenna television signal receiver. And there are integrated on silicon substrate. The digital receiver and analog receiver sensitivity have to meet -24 dBm at $BER=10^{-l2}$ and -7.7 dBm at 44 dB SNR. And the electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysis and measurement results, the proposed silicon substrate structure that contains the Dummy ground line with $100\;{\mu}m$ space from signal lines and separates 4 mm among devices respectively, is satisfied the electrical crosstalk level compared to simple structure. This proposed structure can be easily implemented with design convenience and greatly reduced the silicon substrate size about $50\%$.

• Journal of electromagnetic engineering and science
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• v.5 no.3
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• pp.140-145
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• 2005

In this paper, an experimental investigation for return loss and a software-based prediction for interference level of single-packaged filtering antenna composed of dielectric waveguide filter and PCB(Printed Circuit Board) slot antenna in transceiver module have been carried out with several different feeding structures in millimeter-wave regime. The implementation and embedding method of the existing air-filled waveguide filters working at millimeter-wave frequency on general PCB substrate have been described. In a view of the implementation of each components, the dielectric waveguide embedded in PCB and LTCC(Low Temparature Co-fired Ceramic) substrates has employed the via fences as a replacement with side walls and common ground plane to prevent energy leakage. The characteristics of several prototypes of filtering antenna embedded in PCB substrate are considered by comparing the wideband and transmission characteristics as a function of bent angle of transmission line connecting two components. In addition, as an essential to the packaging of transceiver module working at millimeter-wave, miniaturization technology maintaining the performances of independent components and the important problems caused by integrating and connecting the different components in different layers are described in this paper.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.24 no.5
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• pp.646-654
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• 2020

This paper is to develop an electromagnetic wave-based sensor that can measure the spatial distribution of precipitation, and to a electromagnetic wave rain gauge (hereinafter, "EWRG") capable of simultaneously measuring rainfall, snowfall, and wind field, which are the core of heavy rain observation. Through this study, the LFM transmission and reception signals were theoretically analyzed. In addition, In order to develop a radar transceiver, LFM transceiver design and simulation were conducted. In this paper, we developed a K-BAND pulse-driven 6W SSPA(Solid State Power Amplifiers) transceiver using a small HMIC(Hybrid Microwave Integrated Circuit). It has more than 6W of output power and less than 5dB of receiving NF(Noise Figure) with short duty of 1% in high temperature environment of 65 degrees. The manufactured module emits LFM and Square Pulse waveform with the built-in waveform generator, and the receiver has more than 40dB of gain. The transceiver developed in this paper can be applied to the other small weather radar.

• Korean Journal of Optics and Photonics
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• v.15 no.4
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• pp.349-354
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• 2004

As a transmitter sub-assembly in the XFP(10 Gb/s Small Form Factor Pluggable) transceiver module, a transmitter optical sub-assembly(TOSA) is designed, fabricated and characterized in view of electrical and thermal performances. For a low-cost and compact packaging TOSA, the bias-tee and the matching resistor are monolithically integrated on the AlN sub-mount and a newly designed coplanar waveguide is drawn in the TO-stem. All optoelectronic components packaged in the TOSA are modeled by the equivalent circuit, which helps to improve and characterize the TOSA performance. The fabricated TOSA shows the -3㏈ bandwidth as high as 11 GHz at an elevated temperature of 85$^{\circ}C$.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.1B
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• pp.175-182
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• 2000

(A hybrid-type wireless infrared data communication module was fabricated by using the light emitting andabsorption diodes with the one-chip of integrated digital circuits. The light emitting diode with the peak spectrum of 850 nm was made from compound semiconductor material of AIGaAs and shows high speed signal transmission with the delay time of 60 nsec for the light direction angle of 30". The Si PIN photodiode showsthe good absorption rate for the range of wavelength of 450-1050 nm and convex-type epoxy lens was utilized for the spectrum filtering on the visible-range spectrum below 750 nm, The data transmission speed is 115.2 kbps and the fabricated module satisfies on the IrDA 1.0 SIR standard requirements.)ments.)

• Korean Journal of Optics and Photonics
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• v.10 no.6
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• pp.500-506
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• 1999

We designed and fabricated a bidirectional optical transceiver module for low cost access network. An integrated chip forming a pin-PD on an 1.3 urn FP-LD was assembled by flip-chip bonding on a Si optical bench, a single mode fiber with an angled end facet was aligned passively with the integrated chip on V-groove of Si-optical bench. Gaussian beam theory was applied to evaluate the coupling coefficients as a function of some parameters such as alignment distance, angle of fiber end facet, vertical alignment error. The theory is also used to search the bottle-neck between transmittance and receiving coupling efficiency in the bi-directional optical system. Tn this paper, we confirmed that reduction of coupling efficiency by the vertical alignment error between laser beam and fiber core axis can be compensated by controlling the fiber facet angle. In the fabrication of sub-module, a'||'&'||' we made such that the fiber facet have a corn shape with an angled facet only core part, the reflection of transmitted laser beam from the fiber facet could be minimized below -35 dE in alignment distance of 2: 30 /J.m. In the same condition, transmitted output power of -12.1 dEm and responsivity of 0.2. AIW were obtained.