• Title/Summary/Keyword: Integrated RF module

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Demonstration of Adaptive Analogue Beam Forming in the E-Band

  • Dyadyuk, Val;Stokes, Leigh;Nikolic, Nasiha;Weily, Andrew R.
    • Journal of electromagnetic engineering and science
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    • v.10 no.3
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    • pp.138-145
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    • 2010
  • In this paper, we report the test results of a small-scale prototype that implements an analogue-beam-formed phased antenna array in the E-band. A four-channel dual-conversion receive RF module for 71~76 GHz frequency band has been developed and integrated with a linear end-fire antenna array. Measured performance is very close to the simulated results. An ad-hoc wireless communication system has also been demonstrated. Low BER was measured for an 8PSK data stream at 1.5 Gbps with the receive array beam formed in the direction of arrival of the transmitted signal. To our knowledge this is the first steerable antenna array reported to date in the E-band.

Dual-Polarized Small Base Station Antenna Integrated RF Module Applicable to Various Cell Environments for Next-Generation Mobile Communication Service

  • Lee, Jung-Nam;Lee, Yuro;Park, Bong-Hyuk;Kim, Tae-Joong
    • ETRI Journal
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    • v.39 no.3
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    • pp.383-389
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    • 2017
  • A small dual-polarized base station antenna with a simple isolation patch is presented. A high isolation is achieved when using a shorted metallic isolation patch. The experimental results indicate that the measured impedance bandwidth of the proposed antenna is 1.72 GHz to 1.89 GHz for small cell systems and that the isolation is more than 30 dB. The proposed antenna exhibits good radiation patterns with a peak gain of 8 dBi.

Fabrication of Infrared Filters for Three-Dimensional CMOS Image Sensor Applications

  • Lee, Myung Bok
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.6
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    • pp.341-344
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    • 2017
  • Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.

Embedded Inductors in MCM-D for RF Appliction (RF용 MCM-D 기판 내장형 인덕터)

  • 주철원;박성수;백규하;이희태;김성진;송민규
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.3
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    • pp.31-36
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    • 2000
  • We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

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A study on the short-range underwater communication using visible LEDs (근거리 수중통신을 위한 가시광 LED 적용에 관한 연구)

  • Sohn, Kyung-Rak
    • Journal of Advanced Marine Engineering and Technology
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    • v.37 no.4
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    • pp.425-430
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    • 2013
  • Robust and high speed underwater communication is severely limited when compared to communications in terrestial. In free space, RF communication operates over long distances at high data rates. However, the obstacle in seawater is the severe attenuation due to the conducting nature. Acoustic modems are capable of long range communication up to several tens of kilometers, but it has low data-rate, high power consumption and low propagation speed. An alternative means of underwater communication is based on optics, wherein high data rates are possible. In this paper, the characteristics of underwater channel in the range of visible wavelength is investigated. And the possibility of optical wireless communication in underwater is also described. The LED-based transceiver and CMOS sensor module are integrated in the system, and the performance of image transmission was demonstrated.

Design and Implementation on Frequency Synthesizer Qualification Model Level for SAR payload (위성 레이다용 QM급 주파수합성기 설계 및 제작)

  • Kim, Dongsik;Kim, Hyunchul;Heo, John;Kim, Wansik
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.20 no.3
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    • pp.9-14
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    • 2020
  • In this paper, Qualification Model of frequency synthesizer is designed for X-band SAR system and performed electrical and environment test. Designed frequency synthesizer generate 13.65 GHz with very low phase noise performance. The integrated phase noise from 10Hz to 1MHz is -37.91 dBc. IRF performances are analyzed according to phase noise and jitter. Also, thermal and structure analysis are achieved for stable operation in space environment. Designed frequency synthesizer is consist of 2 modules of 6U size and generate L-band, C-band, Ku-band. The result of this study would enhance the design ability of RF module and help the frequency synthesizer design for SAR payload system.

Development of an Ultra-Slim System in Package (SiP)

  • Gao, Shan;Hong, Ju-Pyo;Kim, Jin-Su;Yoo, Do-Jae;Jeong, Tae-Sung;Choi, Seog-Moon;Yi, Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.7-18
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    • 2008
  • This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

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Implementation of π/4-DQPSK Modem for Maritime Digital Communication in VHF Band (VHF 대역 해상 디지털 통신용 π/4-DQPSK 모뎀 구현)

  • Kwak, Jaemin
    • Journal of Advanced Navigation Technology
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    • v.18 no.6
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    • pp.541-545
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    • 2014
  • Rec. ITU-R M.1842-1 is international recommendation for VHF band communication guideline in maritime mobile service RR Appendix 18 channels. In this paper, we simulate 28.8 kbps VHF ${\pi}$/4-DQPSK digital baseband modem compatible with the recommendation, then it is designed and implemented with FPGA. Cazac sequence is used as a preamble since packet format is not defined untill now in the recommendation. Baseband modem is designed by VHDL language and implemented on NEXYS4 development platform having Atrix7 FPGA chip from Xilinx. For wireless communication test of total prototype system, ADC/DAC board is implemented and EV9730 RF module is utilized. From the experimental results, implemented FPGA modem shows spectral bandwidth of 25 kHz and successful data exchanges between tx and rx communication platform.

Development of Common PCS Base Station System (PCS 공용 기지국 시스템 개발)

  • 황선호;박준현;김훈석
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2001.05a
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    • pp.214-217
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    • 2001
  • This paper presents an implementation methodology of common Rf- integrated PCS base station system which, is capable of providing PCS services for 3 PCS carriers concurrently and wireless system performance evaluation data is shown. We have built up a common PCS base station system using a commonization module, which is consisted of a multi-channel combiner, duplexer, LNA, power divider, feeder line, and a common set of antennas. It was shown that the performance of the system within the total 30MHz PCS frequency range is uniformly acceptable and measured signal quality and coverage are equivalent to that of the individual PCS base station. It is expected that PCS carriers are able to save a huge amount of installation and maintenance expenses by installing and sharing this base station system. This paper forms a groundwork for deploying efficient and economical IMT-2000 network.

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Linear interpolation and Machine Learning Methods for Gas Leakage Prediction Base on Multi-source Data Integration (다중소스 데이터 융합 기반의 가스 누출 예측을 위한 선형 보간 및 머신러닝 기법)

  • Dashdondov, Khongorzul;Jo, Kyuri;Kim, Mi-Hye
    • Journal of the Korea Convergence Society
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    • v.13 no.3
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    • pp.33-41
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    • 2022
  • In this article, we proposed to predict natural gas (NG) leakage levels through feature selection based on a factor analysis (FA) of the integrating the Korean Meteorological Agency data and natural gas leakage data for considering complex factors. The paper has been divided into three modules. First, we filled missing data based on the linear interpolation method on the integrated data set, and selected essential features using FA with OrdinalEncoder (OE)-based normalization. The dataset is labeled by K-means clustering. The final module uses four algorithms, K-nearest neighbors (KNN), decision tree (DT), random forest (RF), Naive Bayes (NB), to predict gas leakage levels. The proposed method is evaluated by the accuracy, area under the ROC curve (AUC), and mean standard error (MSE). The test results indicate that the OrdinalEncoder-Factor analysis (OE-F)-based classification method has improved successfully. Moreover, OE-F-based KNN (OE-F-KNN) showed the best performance by giving 95.20% accuracy, an AUC of 96.13%, and an MSE of 0.031.