• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.11
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• pp.683-687
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• 2017

We investigated the structure of an ultra-thin insulating board with low thermal conductivity along z-axis, which was based on the idea of void layers created during the glass infiltration process for the zero-shrinkage low-temperature co-fired ceramic (LTCC) technology. An alumina and four glass powders were chosen and prepared as green sheets by the tape casting method. After comparison of the four glass powders, bismuth glass was selected for the experiment. Since there is no notable reactivity between alumina and bismuth glass, alumina was selected as the supporting additive in glass layers. With 2.5 vol% of alumina powder, glass green sheets were prepared and stacked alternately with alumina green sheet to form the 'alumina/glass (including alumina additive)/alumina' structure. The stacked green sheets were sintered into an insulating substrate. Scanning electron microscopy revealed that the additive alumina formed supporting bridges in void layers. The depth and number of the stacking layers were varied to examine the insulating property. The lowest thermal conductivity obtained was 0.23 W/mK with a $500-{\mu}m-thick$ substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.190-193
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• 2002

The processing technology of organic thin-film transistors (Ons) performances have improved fur the last decade. Gate insulator layer has generally used inorganic layer, such as silicon oxide which has properties of a low electrical conductivity and a high breakdown field. However, inorganic insulating layers, which are formed at high temperature, may affect other layers termed on a substrate through preceding processes. On the other hand, organic insulating layers, which are formed at low temperature, dose not affect pre-process. Known wet-processing methods for fabricating organic insulating layers include a spin coating, dipping and Langmuir-Blodgett film processes. In this paper, we propose the new dry-processing method of organic gate dielectric film in field-effect transistors. Vapor deposition polymerization (VDP) that is mainly used to the conducting polymers is introduced to form the gate dielectric. This method is appropriate to mass production in various end-user applications, for example, flat panel displays, because it has the advantages of shadow mask patterning and in-situ dry process with flexible low-cost large area displays. Also we fabricated four by four active pixels with all-organic thin-film transistors and phosphorescent organic light emitting devices.

• Progress in Superconductivity and Cryogenics
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• v.16 no.1
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• pp.14-18
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• 2014

The mechanical, electrical and thermal characteristics of insulating materials may significantly affect the performance and reliability of electrical devices using superconductors. General method to provide insulating layer between coated conductors is wrapping coated conductor with Kapton tape. But uniform and compact wrapping without failure or delamination in whole coverage for long length conductor is not a simple task and need careful control. Coating of insulating layer directly on coated conductor is desirable for providing compact insulating layer rather than wrapping insulating layers around conductor. Ceramic added polymer has been widely used as an insulating material for electric machine because of its good electrical insulating properties as well as excellent heat resistance and fairy good mechanical properties. The insulating layer of coated conductor should have high breakdown voltage and possesses suitable mechanical strength and maintain adhesiveness at the cryogenic temperature where it is used and withstand stress from thermal cycling. The insulating and mechanical properties of polymer can be improved by adding functional filler. In this study, insulating layer has been made by adding ceramic particles such as $SiO_2$ to a polymer resin. The size, amount and morphology of added ceramic powder was controlled and their effect on dielectric property of the final composite was measured and discussed for optimum composite fabrication.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.4
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• pp.97-103
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• 2012

This study investigates thermal insulation properties of multi layer materials depending on thickness of air layers. Numerical analysis on the heat flow of different insulating materials was conducted to identify whether their temperature distributions demonstrate the reduced rate of heat transfer conclusively or not. Analytical model is divided into two categories. One is to distinguish temperature distribution of the air-layer materials from the non-air layer ones. The other is to compare the efficacy between eight-layered insulating materials with no air-layer contained and three-layered insulating materials which include an air-layer definitely. In the latter case, the identical thickness is assigned to each material. The effect of thermal insulation by including an air-layer is verified in the first analytical model. The result of the second model shows that the insulation of the eight-layered materials is coterminous at the three-layered ones with an air-layer and the thermal insulation of the two materials is imperceptible. The benefits of cost and energy saving are anticipated if air-layers are efficiently incorporated in multi layer insulating materials in a greenhouse.

• Journal of the Korean Ceramic Society
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• v.46 no.3
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• pp.336-343
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• 2009

Nickel oxide thin films exhibit the resistive switching as a function of applied voltages. The switching phenomena involve low and high resistance states after electroforming. The electrical features are believed to be associated with the formation and rupture of filaments. The set and reset behaviors are controlled by the oxidation and reduction of filaments. The indirect evidence of filaments is corroborated by the presence of nanocrystalline nickel oxides found in high-resolution transmission electron microscopy. The insertion of insulating layers seems to control the current-voltage characteristics by preventing the continuous formation of conductive filaments, potentially leading to artificial control of resistive behaviors in NiO-based systems.

• Electrical & Electronic Materials
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• v.7 no.1
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• pp.15-24
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• 1994

For increasing the insulating proper-ties and the reliability of composite materials due to environmental aging, the electrical and mechanical characteristics of moisture absortion specimens and moisture desorption specimens were investigated. After moisture absorption wt% and moisture desorption wt% increased with time, a state of saturation arrived subsequent to a constant time. Moisture absorption constants with the layers of glass fiber showed 0.0117 in 1 layer, 0.0123 in 2 layers and 0.0152 in 3 layers. Electrical and mechanical characteristics dropped significantly with moisture absorbing in composite materials. Although moisture dried completly at 70.deg. C, it is impossible to obtain the electrical and mechanical characteristics before moisture absorption. Many defaults by moisture in composite materials exist at interface between epoxy matrix and filler.

• Proceedings of the Optical Society of Korea Conference
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• 2001.02a
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• pp.206-207
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• 2001

The photorefractive (PR) effect in liquid crystals sandwiched between photoconductive polymer layers was first studied by Ono et al. They reported that the PR effect vanished at steady state If there were not insulating layers because no charge trapping occurred in the photoconductive poly(N-vinylcarbazole) (PVK) layers. However we observed a significant PR effect in the polymer layered liquid crystal (PLLC) system where a liquid crystal layer doped with fullerene is sandwiched between two photoconductive PVK layers. (omitted)

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.128-128
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• 1999

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.347-349
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• 1999

We have fabricated insulating thin films using p-hexadecoxyphenol(p-Hp) that was formed phenol-formaldehyde resin of crosslinked structure from reaction with formaldehyde by LB technique. For fabricated MIM device, the possibility for insulating layers of electronic were investigated by electrical properties of their LB films according to crosslinking of LB films current-voltage (I-V) properties and frequency-capacitance (C-F) characteristics. We have provided evidence for the high insulating performance of phenol-formaldehyde thin films by the LB method. Conductivity of their LB films was as follows: pure water > 1 % aq. Formaldehyde > heat treatment, in the current-voltage (I-V) characteristics. It is demonstrated that insulation properties of crosslinked p-HP LB films were improved. In capacitance-frequency properties, the heat-treated p-HP LB films for crosslinking showed a low relative dielectric constant.

• Transactions on Electrical and Electronic Materials
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• v.14 no.1
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• pp.20-23
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• 2013

When applying superconducting wire to power machines, an investigation needs to be carried out on the characteristics of wire phase changes in connection with the insulating layer. This study examined trends in the increase of the wire's resistance and the characteristics of its recovery from quenching by a current-applied cycle at temperatures of 90 K, 180 K, and 250 K. The procedure was conducted based on the thickness and presence (or absence) of the insulating wire layers. To achieve this, YBCO thin-film wires with the same critical temperatures were prepared with copper and stainless steel stabilizing layers. At levels (-one, three, and five-), with superior performance, polyimide pressure-sensitive adhesive tape was attached to the wires at a very low temperature. The eight prepared test samples were wound around the linear frames. The wire's voltage and current created from the phase change characteristics were measured at the wire's prescribed temperature, using the four-point probe method. The wire's resistance and recovery characteristics were examined for each cycle at temperatures of 90 K, 180 K, and 250 K.