• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.983-984
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• 2006

The correct computer simulation of the powder compaction stage requires the determination of the elastoplastic parameters which characterize its mechanical behavour. Instrumented dies are frequently used to monitor the longitudinal and radial stress occurring during powder compaction. When strain gages are employed a previous calibration is needed. Many sources of error exist that can lead to the incorrect calibration of the instrumented die. By means of a FEM simulation some of these problems are analysed. The effect of die wall thickness, compression length, and strain location are studied.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.299-302
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• 2003

The interface heat transfer coefficient was measured for non-isothermal bulk forming of Ti-6Al-4V. FE analysis and experiments were conducted. Equipment consisting of AISI H13 die was instrumented with thermocouples located at sub-surface of the bottom die. Die temperature changes were investigated in related to the process variables such as reduction, lubricant and initial die temperature. The calibration approach based on heat conduction and FE analysis using an inverse algorithm were used to evaluate the interface heat transfer between graphite-lubricated die and glass-coated workpiece. The coefficients determined determined were affected mainly by the contact pressure. The validation of the coefficients was made by the comparison between experimental data and FE analysis results.

• Transactions of Materials Processing
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• v.12 no.4
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• pp.370-375
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• 2003

Determination of the interface heat transfer coefficient was investigated in non-isothermal bulk forming of glass-coated Ti-6Al-4V. FE analysis and experiments were conducted. Equipment consisting of AISI Hl3 die was instrumented with thermocouples located at sub-surface of the bottom die. Die temperature changes were investigated in related to the process variables such as reduction, lubricant and initial die temperature. The calibration approach based on heat conduction and FE analysis using an inverse algorithm were used to evaluate the interface heat transfer between graphite-lubricated die and glass-coated workpiece. The coefficients determined were affected mainly by the contact pressure. The validation of the coefficients was made by the comparison between experimental data and FE analysis results.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.740-741
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• 2006

The achievement of high density at reasonable cost is one of the major challenges of the P/M industry. One of the key factors contributing to the compressibility of a mix is the lubricant. New experimental lubricants enabling higher green density by conventional compaction or temperature-controlled die compaction were identified. The compaction and ejection characteristics of these new lubricants as measured with a fully instrumented lab press are presented and compared to that of conventional lubricants.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.