• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.10-11
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• 2006

The fault location is obtained from the distance relay that detects the fault of the transmission line. In this time, transmission line crews track down the fault location and the reasons. However, because of having error at the fault location of the distance relay, there is a discordance between real and obtained fault location. As this reason, the inspection time for finding fault location can be longer. In this paper, we proposed the statistical (regression) analysis method based on each type of relay's the historical fault location data and the real fault distance data to improve the problems. With finding the regression equation based on the regression analysis, and putting the relay fault location into that equation, the real fault distance is calculated. As a result of the Prediction fault location, the inspection time of transmission line can be reduced.

• 제어로봇시스템학회:학술대회논문집
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• 1991.10a
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• pp.1139-1143
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• 1991

Using industrial robots and sensors, we developed an inline car body inspection system which proposes high flexibility and sufficient accuracy. Car Body Inspection(CBI) cell consists of two industrial robots, two corresponding carriages, camera vision system, a process computer with multi-tasking ability and several LDS's. As industrial robots guarantee sufficient repeatabilities, the CBI cell adopts the concept of relative measurement instead of that of absolute measurement. By comparing the actual measured data with reference data, the dimensional errors of the corresponding points can be calculated. The length of the robot arms changes according to ambient temperature and it affects the measuring accuracy. To compensate this error, a robot arm calibration process was realized. By measuring a reference jig, the differential changes of the robot arms due to temperature fluctuation can be calculated and compensated.

• Journal of the Semiconductor & Display Technology
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• v.5 no.1 s.14
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• pp.1-4
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• 2006

Recently, Ball Grid Arrays(BGAs) are getting used more frequently for a package type. The connectors on a BGA consist of a large number of small solder balls in a grid shape on its bottom side. However, since balls of BGAs mounted on PCBs are not visible, inspection before mounting them is indispensable. High speed non-contact 3D measurement technologies are necessary far real-time measurement of ball height, the most important inspection item. In this paper, an accurate 3D data acquisition system for BGAs is proposed that can acquire 3D profile at high speed using a 3D smart camera and laser slit ray projection. Some clipping and morphological filtering operations are employed to remove spiky error data, which occur due to reflections from some ball area to camera direction.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.10 no.1
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• pp.1-9
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• 2006

Three categories such as the design of a machine, control and software are necessary in the development of the photomask inspection machine with high resolution. Among them, the design of a software detects inferiority through the comparison of CAD data and real data read by camera from photomask. The block matching algorithm is used since the domain is large and the comparison of data by pixel is accomplished. To correct the error arising from the assembly of a machine, calibration algorithm is used and prefocusing algorithm is suggested to correct the surface of the photomask.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.2
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• pp.307-313
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• 2008

In this paper, we propose a novel defects inspection algorithm for TFT-LCD panels. We first compensate the distorted image caused by the camera distortion and the uneven illumination environment using the least squares method and the bezier surface. We find a starting point of each pattern for restricting each pattern. A clean image is compared to each pattern to find defects using modified PCSR-G algorithm. The simulation example shows that our algorithm not only inspects the defects well, but also is robust to the 1-pixel error.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1372-1373
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• 2008

This study investigated the detection of corona discharge on polymer insulators at 13.2kV. Also, It will be analyzed by variety analyzers such as FT-IR, TA, and so on. It carried out an experiment and an actual measurement about corona detection using a UV-camera. This experiment and inspection would need to respect the above criteria. It was required to verify various experimental conditions and on-site inspection afterwards, but it was believed to minimize the measurement error by data-basing research results in a continuous manner and it was necessary to establish diagnosis technologies and standards in various electrical power facilities.

• Journal of the Semiconductor & Display Technology
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• v.3 no.1
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• pp.1-7
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• 2004

In this paper, we have developed the DC parameters test system which inspects the properties of DC parameters for semiconductor products. The developed system is interfaced by IBM-PC. It is consisted of CPLD part, ADC(Analog-to-Digital Converter), DAC(Digital-to-Analog Converter), voltage/current source, variable resistor and measurement part. In the proposed system, we have designed the constant voltage source and the constant current source in a part. In the comparison of results, the results of the simulation are very similar to the ones of the implementation.

• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.149-150
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• 2007

In this paper, we propose a novel defects inspection algorithm for TFT-LCD panels. We first compensate the distorted image caused by the camera distortion and the uneven illumination environment using the least squares method and the bezier surface. We find a starting point of each pattern. The reference frame, made by subtract method using several clean patterns, is compared to each pattern to find defects. The simulation example shows that our algorithm not only inspects the defects well, but also is robust to the 1-pixel error.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.29B no.1
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• pp.76-84
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• 1992

The vision system is essential for SMT(Surface Mounting Technology) automation. The system plays the role of matching the positions betweem SMD and PCB, and inspecting SMD in the final stage of mounting. Real-time processing and high-precision are indispensable for practical purpose. In this paper, a new algorithm for position matching and inspection of SMD is proposed, and which is implemented on the DSP board using DSP board using DSP5600. Experimental results show mean matching error within 0.1 mm in the direction of x,y and execution time within 300msec. Therefore, we could attain high-speed and high-precision of the vision system for SMT automation.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.3
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• pp.443-450
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• 1989

A digital testing method for measurement of radial error motions of a spindle is investigated with special emphasis on developing a computer-aided in-situ inspection for machine tool manufacturing. The method utilizes three non-contact type probes and an optical encoder, based on a special computational algorithm to eliminate undesirable offset and roundness errors of the master spindle. Details of the design of hardware and software required to realize the testing method are described. Finally, advantages and limitations of the method are discussed with several test results.