• 한국재료학회지
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• 제3권3호
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• pp.282-291
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• 1993

첨가원소를 달리한 두 종류의 삽입금속 Cu-10tw% Ti합금과 Cu-7.5wt% Zr 합금을 사용하여 알루미나와 304 스테인레스강을 활성브레이징법으로 접합하였을 때 두 접합체 계면의 반응층생성구조를 비교조사하여 다으모가 같은 결과를 얻었다. Cu-10tw% Ti삽입금속을 사용한 접합체의 알루미나쪽 반응층은 단층구조를 이루고 있었으나 Cu-7.5wt% Zr삽입금속을 사용한 경우 반응층은 이중구조를 이루고 있었다. 이는 두 종류의 서로 다른 삽입금속이 용융상태에서 알루미나 표면에 갖는 젖음성(wettability)차이에 기인하는 것으로 사료되며 이러한 반응층의 생성구조는 접합강도에 지대한 영향을 미치는 것으로 확인되었다. Cu-10wt% Ti 삽입금속을 사용한 경우 모든 접합조건에서 열응력에 의한 모서리 균열(dege crack)이 관찰되었으나 Cu-7.5wt% Zr 삽입금속을 사용한 경우 적정 접합조건을 선정하면 반응층의 이중구조를 통애 열응력을 완화시킴으로써 균열발생을 억제하여 1323K $\times$ 0.6Ks의 접합조건에서 비교적 높은 약 86MPa의 전단강도값을 얻을 수 있었다.

• Journal of Welding and Joining
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• 제10권3호
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• pp.13-25
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• 1992

1.삽입금속(Insert metal or Filler metal) 1)삽입금속의 성질 2)삽입금속의 종류 2.플락스 1)플락스의 작용 2)플락스의 구비조건 3)플락스의 종류

• 한국정밀공학회지
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• 제28권3호
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• pp.301-307
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• 2011

In this paper, effects of major design parameters of cold forging dies on die mechanics are quantitatively investigated with emphasis on shrink fit using a thermoelastic finite element method. A ball-stud cold forging process found in a cold forging company is selected as a test process and the effects of die insert material, magnitude of shrink fit, dimension of shrink ring, number of shrink rings, partition of die insert and clamping force on effective stress and circumferential stress are analyzed. It has shown that the number of shrink rings, magnitude of shrink fit, and Young's modulus of die insert material have strong influence on compressive circumferential stress in die insert but that the influence of the other design parameters is relatively weak.

• 한국분말재료학회지
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• 제2권1호
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• pp.53-62
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• 1995

TLP(Transient-Liquid-Phase) bonding of Fe-base MA956 ODS alloy was performed. As insert metal a commercially available Ni-base alloy(MBF50) and an MA956 alloy with additive elements of 7wt% Si and 1wt% B were used. To confirm the idea that a concurrent use of MA956 powder with Insert metals can enhance the homogenization of constituent elements and thereby reduce the thickness of joint interface, MA956 powder was also inserted In a form of sheet. SEM observation and EDS analysis revealed that Cr-rich phase was formed in the bonded interface in initial stage of isothermal solidification during the bonding process, irrespective of kind of insert metals. Measurement of hardeness in the region of bonded interface and EDS analysis showed that a complete homogenization of composition could not be obtained especially in case of MBF50. Joints using either BSi insert metals only or BSi insert together with MA956 powder interlayer showed, however, a remarkable improvement in a compositional homogenization, even though a rapid grain growth in the bonded interface could not be hindered.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1645-1647
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• 1999

Epoxy compound has been used as insulation material in electrical equipment because of its properties 1) Nowadays, becoming higher voltage system, the properties of interface between epoxy and its metal insert become more important. In this paper, we suggest two types semiconducting paste. One is epoxy type and the other is olephine type. After sprayed the semiconducting paste on metal insert sanded, we procedure the test one is the adhesion strength test, the other is electrical breakdown strength test. So we knew that the epoxy type paste became more higher adhesion strength than olephine type paste because of its homogeneity at the interfaces. And at the breakdown strength test, olephine type paste became less higher than epoxy type paste because of its volatility. So in this study, we suggest the optimum interface condition by adjusting the semiconducting paste and surface roughness.

• 한국전자파학회논문지
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• 제9권1호
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• pp.108-114
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• 1998

본 논문에서는 도파관 E 면 금속삽입 방볍에 의한 밀리미터파 대역통과 여파기의 설계를 위해 모드매칭법에 의해 산란행렬올 계산하여 설계한 여파기의 전달특성을 분석하고, 설계 방법의 타당성 여부 검증을 위해 WR-34 구형 도파관을 사용하여 30.085-30.885 GHz 대역의 대역통과 여파기를 설계, 제작하였다. 설계, 제작된 대역통과 여파기의 전달특성은 모드매칭법에 의한 해석파 거의 일치하게 측정되었으며, 통과대역내 삽입손실은 최대 0 0.8 dB, 반사손실 -15 dB의 우수한 여파특성을 나타냉으로써 도파관 E-면 금속삽입 형태에 의한 밀리미터파용 대역통과 여파기로서의 적합성을 입증하였다.

• 한국재료학회지
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• 제9권10호
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• pp.962-969
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• 1999

Ag-Cu-Ti 삽입금속을 이용하여 제조된 AlN/Cu와 AlN/W 활성금속브레이징 접합체의 잔류응력을 유한요소법으로 탄성 및 탄소성 해석을 행하여 그 결과를 접합강도 측정 결과와 파단 거동 관찰 결과와 비교, 분석하였다. 최대 잔류 주응력의 크기는 AlN/W 접합체보다 모재간 열팽창계수 차이가 큰 AlN/Cu 접합체에서 더 크게 나타났으며, 접합계면에 인접한 AlN 세라믹스 자유표면에 인장 성분의 응력집중이 확인되었다. 모재와 삽입금속의 탄소성 변형을 모두 고려할 경우, AlN/Cu 접합체의 경우 연질의 삽입금속에 의해 최대 잔류 주응력이 감소하여 소성변형에 의한 응력완화 효과가 있음을 확인하였으나, 100$\mu\textrm{m}$ 이상으로 삽입금속 두께를 증가시키더라도 잔류 주응력의 크기는 더 이상 크게 감소하지 않았다. 측정된 최대 접합강도는 AlN/Cu와 AlN/W 접합체에서 각각 52 MPa와 108 MPa이었으며, 파단 형태는 AlN/Cu 접합체는 AlN 자유표면으로부터 AlN 내부로 큰 각도를 이루면 진행되는 돔형의 파단이, AlN/W 접합체에서는 접합계면의 삽입금속층을 따라 AlN 측에서 파단이 일어나는 형태를 보였다.

• Journal of Welding and Joining
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• 제25권5호
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• pp.45-50
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• 2007

The Ni-base superalloy GTD111 DS is used in the first stage blade of high power land-based gas turbines. Advanced repair technologies of the blade have been introduced to the gas turbine industry over recent years. The effect of the filler metal powder on Transient Liquid Phase bonding phenomenon and tensile mechanical properties was investigated on the GTD111 DS superalloy. At the filler metal powder N series, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid filler metal powder was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solids in the bonded interlayer grew from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The bond strength of N series filler metal powder was over 1000 MPa. and ${\gamma}'$ phase size of N series TLP bonded region was similar with base metal by influence of Ti, Al elements. At the insert metal powder M series, the Si element fluidity of the filler metal was good but microstructure irregularity on bonded region because of excessive Si element. Nuclear of solids formed not only from the base metal near the bonded interlayer but also from the remained filler metal powder in the bonded interlayer. When the isothermal solidification was finished, the content of the elements in the boned interlayer was approximately equal to that of the base metal. But boride and silicide formed in the base metal near the bonded interlayer. And these boride decreased with the increasing of holding time. The bond strength of M series filler metal powder was about 400 MPa.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 춘계 학술발표대회 개요집
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• pp.45-47
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• 2004

We have investigated the microstructures and the mechanical properties of TiA1/Cerameti1721 (Ag-Cu-Ti insert metal)/AISI4140 joints at 800$^{\circ}C$ for 60 to 300s using induction brazing method. Two continuous reaction layers of AICuTi and AICu$_2$Ti were formed at the interface between the braze and TiAl, whose thickness increased with the brazing time. The braze consisted of Ag-rich, Ti-rich, CuTi and CuTi$_2$ phases. The maximum tensile strength achieved 296MPa, which was 71% of that of TiAl base metal, for the specimen bonded at 800$^{\circ}C$. Further increase of the brazing temperature and time resulted in constant deterioration of its bonding strength due to large amount of brittle IMC.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 춘계학술대회 논문집
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• pp.94-97
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• 2002

Micromolding methods are most suitable for mass production of plastic microlens and lens array with low cost. Among the procedures related with micromolding of microlens array, fabrication of mold insect which contains micro cavity of lens shape is the most important stage. In this study, nickel mold inserts for 45 $\mu\textrm{m}$ and 95 $\mu\textrm{m}$ diameters lens way were fabricated using electroforming process. The mother for metal mold inset was made using reflow method. A micro compression molding with polymer powders was used to test the qualities of the metal mold insets. Micro lens profile and surface roughness was measured by interferometric technique and AFM, respectively. The final molded lens replicated the mother well, and had good surface quality.