• 제목/요약/키워드: Inner defects

검색결과 176건 처리시간 0.026초

Testicular Characteristics and the Block to Spermatogenesis in Mature Hinny

  • Han, Hongmei;Wang, Aihong;Liu, Liming;Zhao, Gaoping;Su, Jie;Wang, Biao;Li, Yunxia;Zhang, Jindun;Wu, Baojiang;Sun, Wei;Hu, Shuxiang;Li, Shuyu;Zhao, Lixia;Li, Xihe
    • Asian-Australasian Journal of Animal Sciences
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    • 제29권6호
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    • pp.793-800
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    • 2016
  • Most hinnies (female donkey${\times}$male horse) and mules (female horse${\times}$male donkey) are sterile with few reports of equine fertile hybrids. The main cause of this sterility is thought to be a meiotic block to spermatogenesis and oogenesis. This study compared the developmental features of the testes and a histological analyses of spermatogenesis in a male hinny with those of a normal, fertile stallion and Jack donkey. Hinny testes showed a thicker tunica albuginea, fewer blood vessels and more connective tissue in the testis parenchyma than those of the stallion and Jack donkey. Although the mean number of seminiferous tubules was significantly higher in stallion and hinny than Jack donkey (p<0.01), the mean proportion of seminiferous tubules was lower in the hinny (p<0.01) which resulted in a smaller diameter of seminiferous tubules. The mean number of spermatogonia and spermatocytes per unit area were significantly lower in hinny testis (p<0.01) and no spermatids or mature spermatozoa cells were found during immunofluorescent analyses. These results indicated that defects in seminiferous tubule development and structure occur in the testis of hinnies. Furthermore, most spermatogonia and spermatocytes cease development in synapsis during mid-meiosis of spermatocytes, which results in a block to spermatogenesis that prevents the formation of spermatids and matured spermatozoa during meiosis in male hinnies.

신호대 잡음비에 무관한 허브 베어링 결함 검출 방법 (Faults Detection Method Unrelated to Signal to Noise Ratio in a Hub Bearing)

  • 최영철;김양한;고을석;박춘수
    • 한국소음진동공학회논문집
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    • 제14권12호
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    • pp.1287-1294
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    • 2004
  • Hub bearings not only sustain the body of a cat, but permit wheels to rotate freely. Excessive radial or axial load and many other reasons can cause defects to be created and grown in each component. Therefore, nitration and noise from unwanted defects in outer-race, inner-race or ball elements of a Hub bearing are what we want to detect as early as possible. How early we can detect the faults has to do with how the detection algorithm finds the fault information from measured signal. Fortunately, the bearing signal has Periodic impulse train. This information allows us to find the faults regardless how much noise contaminates the signal. This paper shows the basic signal processing idea and experimental results that demonstrate how good the method is.

최소 분산 켑스트럼을 이용한 자동차 허브 베어링 결함 검출 (Faults Detection in Hub Bearing with Minimum Variance Cepstrum)

  • 박춘수;최영철;김양한;고을석
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2004년도 춘계학술대회논문집
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    • pp.593-596
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    • 2004
  • Hub bearings not only sustain the body of a car, but permit wheels to rotate freely. Excessive radial or axial load and many other reasons can cause defects to be created and grown in each component. Therefore, vibration and noise from unwanted defects in outer-race, inner-race or ball elements of a Hub bearing are what we want to detect as early as possible. How early we can detect the faults has to do with how the detection algorithm finds the fault information from measured signal. Fortunately, the bearing signal has periodic impulse train. This information allows us to find the faults regardless how much noise contaminates the signal. This paper shows the basic signal processing idea and experimental results that demonstrate how good the method is.

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유한요소법을 활용한 궤도륜의 프레스 성형공정 설계(II) (Process Analysis and Design in Forming of Bearing Rings by the FEM(II))

  • 변상규;김태호;강범수;김완두
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1995년도 춘계학술대회논문집
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    • pp.19-30
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    • 1995
  • The analysis had been already completed to detect forming defects for the forming processes of C/R bearing rings. But some unpredicted problems were found through the experiments. So expert redesigned new forming processes to prevent the problems and new analysis was began according to the new processes to find faults for the processes. The forming processes consist of 1 for the outer ring. 6 inner ring. The thickness of metal sheet used is changed to 1.5mm from 1.6mm. Elasto-plastric finite element method is applied to involve the effect of spring back . The most representative alteration is forming of two predents to assist later forming . Thining and distribution of high residual stress are derived from the results of simulations. It is confirmed that the industry expert agree the possiblilty of defects dervied from the new FEM results.

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반도체 패키지 내부결함 평가 알고리즘의 성능 향상 (Performance Advancement of Evaluation Algorithm for Inner Defects in Semiconductor Packages)

  • 김창현;홍성훈;김재열
    • 한국공작기계학회논문집
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    • 제15권6호
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    • pp.82-87
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    • 2006
  • Availability of defect test algorithm that recognizes exact and standardized defect information in order to fundamentally resolve generated defects in industrial sites by giving artificial intelligence to SAT(Scanning Acoustic Tomograph), which previously depended on operator's decision, to find various defect information in a semiconductor package, to decide defect pattern, to reduce personal errors and then to standardize the test process was verified. In order to apply the algorithm to the lately emerging Neural Network theory, various weights were used to derive results for performance advancement plans of the defect test algorithm that promises excellent field applicability.

반도체 패키지의 내부 결함 검사용 알고리즘 성능 향상 (The Performance Advancement of Test Algorithm for Inner Defects in Semiconductor Packages)

  • 김재열;윤성운;한재호;김창현;양동조;송경석
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.345-350
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    • 2002
  • In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method fur entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

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EL-CID를 이용한 발전기 고정자 철심의 건전성 평가 (Healthy Assessment of Generator Stator Cores using EL-CID (ELectromagnetic Core Imperfection Detector))

  • 김병래;김희동
    • 전기학회논문지
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    • 제58권2호
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    • pp.356-362
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    • 2009
  • The ELectromagnetic Core Imperfection Detector (EL-CID) test was performed on a small generator in the laboratory and a gas turbine generator in the field to assess the fault condition of generator stator core. Artificial defects with six different sizes were introduced in the small generator. The scan results on six defects show a very large increase in the magnitude of fault current compared to that obtained with a healthy core. After the stator core heats up, a thermal imaging camera was used to detect hot spot on the inner surface of the core for comparison. Several faults were found during inspection of the gas turbine generator with the EL-CID. It has been shown that the existence of a fault can be determined by monitoring the magnitude of fault current.

자기조직화 지도를 이용한 반도체 패키지 내부결함의 패턴분류 알고리즘 개발 (The Development of Pattern Classification for Inner Defects in Semiconductor packages by Self-Organizing map)

  • 김재열;윤성운;김훈조;김창현;송경석;양동조
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 추계학술대회 논문집
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    • pp.80-84
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    • 2002
  • In this study, researchers developed the est algorithm for artificial defects in the semic packages and performed to it by pattern recogn technology. For this purpose, this algorithm was I that researcher made software with matlab. The so consists of some procedures including ultrasonic acquistion, equalization filtering, self-organizing backpropagation neural network. self-organizing ma backpropagation neural network are belong to metho neural networks. And the pattern recognition tech has applied to classify three kinds of detective pa semiconductor packages. that is, crack, delaminat normal. According to the results, it was found estimative algorithm was provided the recognition r 75.7%( for crack) and 83.4%( for delamination) 87.2 % ( for normal).

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Scanning Acoustic Tomograph 방식을 이용한 지능형 반도체 평가 알고리즘 (The Intelligence Algorithm of Semiconductor Package Evaluation by using Scanning Acoustic Tomograph)

  • 김재열;김창현;송경석;양동조;장종훈
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2005년도 춘계학술대회 논문집
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    • pp.91-96
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    • 2005
  • In this study, researchers developed the estimative algorithm for artificial defects in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-Organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages: Crack, Delamination and Normal. According to the results, we were confirmed that estimative algorithm was provided the recognition rates of $75.7\%$ (for Crack) and $83_4\%$ (for Delamination) and $87.2\%$ (for Normal).

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반도체 패키지의 내부 결함 검사용 알고리즘 성능 향상 (The Performance Advancement of Test Algorithm for Inner Defects In Semiconductor Packages)

  • 김재열;김창현;윤성운
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.721-726
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    • 2005
  • In this study, researchers classifying the artificial flaws in semiconductor. packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method for entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

  • PDF