• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.40-43
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• 2004

Stamps for microcontact processing are fabricated by casting elastomer such as PDMS on a master with a negative of the desired pattern. After curing, the PDMS stamp is peeled away from the master and exposed to a solution of ink and then dried. Transfer of the ink from the PDMS stamp to the substrate occurs during a brief contact between stamp and substrate. Generally, negative-tone masters, which are used for making positive-tone PDMS stamps, are fabricated by using photolithographic technique. The shortcomings of photolithography are a relative high-cost process and require extensive processing time and heavy capital investment to build and maintain the fabrication facilities. The goal of this study is to fabricate a negative-tone master by using Nano-indenter based patterning technique. Various sizes of V-grooves and U-groove were fabricated by using the combination of nanoscratch and HF isotropic etching technique. An achieved negative-tone structure was used as a master in the PDMS replica molding process to fabricate a positive-tone PDMS stamp.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.12
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• pp.82-90
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• 2019

This analysis demonstrates the effective removal of heat generated from a solar panel's output degradation factor solar cells (the solar panel's output deterioration factor), and solves the problems of oxidation and corrosion in existing metal heat sinks. The heat-dissipating test specimen was prepared using carbon materials; then, its thermal conductivity and its effectiveness in reducing temperatures were studied using heat transfer numerical analysis. As a result, the test specimen of the 30g/㎡ basis weight containing 80% of carbon fiber impregnated with carbon ink showed the highest thermal conductivity 6.96 W/(m K). This is because the surface that directly contacted the solar panel had almost no pores, and the conduction of heat to the panels appeared to be active. In addition, a large surface area was exposed to the atmosphere, which is considered advantageous in heat dissipation. Finally, numerical analysis confirmed the temperature reduction effectiveness of 2.18℃ in a solar panel and 1.08℃ in a solar cell, depending on the application of heat dissipating materials.

• Tribology and Lubricants
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• v.32 no.3
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• pp.75-81
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• 2016

Future electronics such as electronic paper and foldable cellphone are required to be flexible and transparent and should have a high performance. In order to fabricate the flexible electronics using flexibility transfer process, techniques for transferring various devices from rigid substrate onto flexible substrate by elastomeric stamp, have been developed. Adhesion between the elastomeric stamp and various devices is crucial for successful transfer process. The adhesion can be controlled by the thickness of the stamp, separation velocity, contact load, and stamp surface treatment. In this study, we fabricated the bump shape stamp consisting of a UV-curable polymer and investigated the effects of curing condition, separation velocity, and contact load on the adhesion characteristics of bumps. The bumps with hemispherical shape were fabricated using a dispensing process, which is one of the ink-jet printing techniques. Curing conditions of the bumps were controlled by the amount of UV irradiation energy. The adhesion characteristics of bumps are evaluated by adhesion test. The results show that the pull-off forces of bumps were increased and decreased as UV irradiation energy increased. For UV irradiation energies of 300 and 500 mJ/cm², the pull-off forces were increased as the separation velocity increased. The pull-off forces also increased with the increase of contact load. In the case of UV irradiation energy above 600 mJ/cm², however, the pull-off forces were not changed. Therefore, we believe that the bump shape stamp can be applied to roll-based transfer process and selective transfer process as an elastomeric stamp.

• Current Photovoltaic Research
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• v.2 no.4
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• pp.173-176
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• 2014

We have investigated the seed layer formation of front side contact using the inkjet printing process. Conductive silver ink was printed on textured Si wafers with 80 nm thick $SiN_x$ anti reflection coating (ARC) layers and thickened by light induced plating (LIP). The inkjet printable sliver inks were specifically formulated for inkjet printing on these substrates. Also, a novel method to prepare nano-sized glass frits by the sol-gel process with particle sizes around 5 nm is presented. Furthermore, dispersion stability of the formulated ink was measured using a Turbiscan. By implementing these glass frits, it was found that a continuous and uniform seed layer with a line width of $40{\mu}m$ could be formed by a inkjet printing process. We also investigated the contact resistance between the front contact and emitter using the transfer length model (TLM). On an emitter with the sheet resistance of $60{\Omega}/sq$, a specific contact resistance (${\rho}_c$) below $10m{\Omega}{\cdot}cm^2$ could be achieved at a peak firing temperature around $700^{\circ}C$. In addition, the correlation between the contact resistance and interface microstructures were studied using scanning electron microscopy (SEM). We found that the added glass particles act as a very effective fire through agent, and Ag crystallites are formed along the interface glass layer.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.155-158
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• 2007

Printed organic thin-film transistor(OTFT) to use as a switching device for an organic light emitting diode(OLED) were fabricated in the microcontact printing and direct printing processes at room temperature. The gate electrodes($5{\mu}m$, $10{\mu}m$, and $20{\mu}m$) of OTFT was fabricated using microcontact printing process, and source/drain electrodes ($W/L=500{\mu}m/5{\mu}m$, $500{\mu}m/10{\mu}m$, and $500{\mu}m/20{\mu}m$) was fabricated using direct printing process with hard poly(dimethylsiloxane)(h-PDMS) stamp. Printed OTFT with dielectric layer was formed using special coating system and organic semiconductor layer was ink-jet printing process. Microcontact printing and direct printing processes using h-PDMS stamp made it possible to fabricate printed OTFT with channel lengths down to $5{\mu}m$, and reduced the process by 20 steps compared with photolithography. As results of measuring he transfer characteristics and output characteristics of OTFT fabricated with the printing process, the field effect characteristic was verified.

• Laser Solutions
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• v.13 no.2
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• pp.6-9
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• 2010

In printed electronics, printing rolls are used to transfer electronic ink onto a flexible substrate. Generally printing rolls are being made by the indirect laser method which is based on the etch process, thus not environment-friendly and not suitable for making a large printing roll. For the pursuit of making a large printing roll for mass printing of electronic devices, we have directly engraved micro-patterns into a Zn plated printing roll using a 30W pulse-modulated fiber laser. We have successfully engraved line patterns ranging from about 15-30${\mu}m$ in width.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.5
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• pp.96-102
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• 2008

Manufacturing of printed electronics using printing technology has begun to get into the hot issue in many ways due to the low cost effectiveness to existing semi-conductor process. This technology, with low cost and high productivity, can make it possible to produce printed electronics such as TFT, solar cell, RFID Tag, printed battery, and so on. In this study, apparatus of gravure-offset printing are developed for fine line-width/gap printing and the results obtained from the apparatus shows that it is possible to make around 20 micro-meter line-width/gap printing patterns. The roll-to-roll printing system for fine line-width printing based on primary experiment is presented. The printing results obtained from the system shows around 30 micro-meter line-width/gap printing patterns.

• Journal of the Korean institute of surface engineering
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• v.48 no.4
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• pp.158-162
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• 2015

To substitute indium tin oxide (ITO), many substituents have been studied such as metal nanowires, carbon based materials, 2D materials, and conducting polymers. These materials are not good enough to apply to an electrode because theses exhibit relatively high resistance. So metal grids are required as an additionalelectrode to improve the conductivities of substituents. The metal grids were printed by electrohydrodynamic printing system using Ag nanoparticle based ink. The Ag grids showed high uniformity and the line width was about $10{\mu}m$. The Ag nanoparticles are surrounded by dispersants such as unimolecular and polymer to prevent aggregation between Ag nanoparticles. The dispersants lead to low conductivity of Ag grids. Thus, the sintering process of Ag nanoparticles is strongly recommended to remove dispersants and connect each nanoparticles. For sintering process, the interface and microstructure of the Ag grid were controlled in 1.0 torr Ar atmosphere at aound $400^{\circ}C$ of temperature. From the sintering process, the uniformity of the Ag grid was improved and the defects on the Ag grids were reduced. As a result, the resistivity of Ag grid was greatly reduced up to $5.03({\pm}0.10){\times}10^{-6}{\Omega}{\cdot}cm$. The metal grids embedded substrates containing low pressure Ar sintered Ag grids showed 90.4% of transmittance in visible range with $0.43{\Omega}/{\square}$ of sheet resistance.

• Laser Solutions
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• v.17 no.4
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• pp.20-23
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• 2014

In printed electronics, printing rolls are used to transfer electronic ink onto a flexible substrate. Generally printing rolls are patterned in microscale by the indirect laser method. Since based on the wet etch process, the indirect method is neither environment-friendly nor suitable for making a printing roll with patterns narrower than $20{\mu}m$. In this paper, we have directly engraved micro-patterns into a Zn-coated metal specimens using a picosecond laser in order both to engrave $10{\mu}m$-wide patterns and to improve the pattern profile. Experiments showed that it is possible to engrave $10{\mu}m$-wide patterns with an a rectangular-shaped profile which is necessary for the dimensionally accurate printing.

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.3
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• pp.45-56
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• 2012

Printing technology is accepted by appropriate technology that smart phones, tablet PC, display(LCD, OLED, etc.) precision recently in the electronics industry, the market grows, this process in the ongoing efforts to improve competitiveness through the development of innovative technologies. So printed electronics appeared by new concept. This technology development is applied on electronic components and circuits for the simplification of the production process and reduce processing costs. Low-temperature process making possible for widening, slimmer, lighter, and more flexible, plastic substrates, such as(flexible) easily by forming a thin film on a substrate has been studied. In the past, the formation of the electrode used a screen printing method. But the screen printing method is formation of fine patterns, high-speed printing, mass production is difficult. The roll-to-roll printing method as an alternative to screen printing to produce electronic devices by printing techniques that were used traditionally in the latest technology and processing techniques applied to precision control are very economical to implement fine-line printing equipment has been evaluated as. In order to function as electronic devices, especially the dozens of existing micro-level of non-dot print fine line printing is required, the line should not break at all, because according to the specifications required to fit the ink transfer conditions should be established. In this study of roll-to-roll printing conductive paste suitable for gravure offset printing by developing Ag paste for forming fine patterns to study the basic physical properties with the aim of this study were to.