• Journal of the Korean Graphic Arts Communication Society
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• v.20 no.1
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• pp.79-90
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• 2002

Recently, the research about color matching for the input/output devices of printing process is progressing rapidly by the digitization. The calibration method of flatbed scanner widely used as an input device for prepress process is especially important for color proofing of high quality color prints. In this paper, scanner calibration method using 3-dimensional look-up table and tetrahedral interpolation was examined and analysed comparatively on the three kinds of original copies, such as photograph, dye sublimation proof and ink jet print for IT8.T/2 target.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1050-1055
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• 2005

We report the development frontiers that are dictating the speed of adoption of polymer organic light emitting diode (P-OLED) technology in market applications. Our presentation includes both the developments taking place in materials and the rapid advances in the manufacturing processes used for solution processable P OLEDs. On the manufacturing side, the latest progress in ink jet printing process is discussed. On the materials side, we look at both fluorescent and phosphorescent material performance including the CDT development roadmap.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1355-1360
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• 2005

We report the development frontiers that are dictating the speed of adoption of polymer organic light emitting diode (P-OLED) technology in market applications. Our presentation includes both the developments taking place in materials and the rapid advances in the manufacturing processes used for solution processable P-OLEDs. On the manufacturing side, the latest progress in ink jet printing process is discussed. On the materials side, we look at both fluorescent and phosphorescent material performance including the CDT development roadmap.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.1
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• pp.83-90
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• 2014

EHD (electro-hydro-dynamics) patterning was performed under atmospheric pressure at room temperature in a single step. The drop diameter smaller than nozzle diameter and applied high viscosity conductive ink in EHD patterning method provide a clear advantage over the piezo and thermal inkjet printing techniques. The micro electrode pattern was printed by continuous EHD patterning method using 3-type control parameters (input voltage, patterning speed, nozzle pressure). High viscosity (1000cps) conductive ink with 75wt% of silver nanoparticles was used. EHD cone type nozzle having an internal diameter of $50{\mu}m$ was used for experimentation. EHD jetting mode by input voltage and applied 1st order linear regression in stable jet mode was analyzed. The stable jet was achieved at the amplitude of 1.4~1.8 kV. $10{\mu}m$ micro electrode pattern was created at optimized parameters (input voltage 1.6kV, patterning speed 25mm/sec and nozzle pressure -2.3kPa).

• Journal of Sensor Science and Technology
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• v.26 no.1
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• pp.56-59
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• 2017

This paper presents the Inkjet-printed strain gauge using PEDOT:PSS. The strain gauge (width 0.6 mm, length 20 mm, thickness $0.3{\mu}m$) was printed on the PET film using PEDOT:PSS ink. The resistance variation of the fabricated strain gauge was measured by the digital multi-meter with the displacement range of -4 to 10 mm. As the measured result, resistance variation (${\Delta}R/R_0$) has approximately 0.75%, linearity of 99.87%. The fabricated strain gauge is expected to the various applications such as tape type pressure sensor, PMS(pressure mapping sensor), wearable devices.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1568-1570
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• 2008

In this paper, fabrication of a $60{\times}48$ polymer TFT array with a top-gate structure on plastic substrates using a low temperature printing process will be presented and the device structure and manufacturing processes will be discussed. The polymer TFT array showed excellent air stability and uniform electrical characteristics over a large area. Finally, a 1.5 inch EPD display with 50 dpi resolution using the polymer TFT array will be demonstrated for e-film device applications.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.18.1-18.1
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• 2010

Here, we introduce our R&D status and strategies for printed electronics containing the two types of aspects such as materials and process/architectures. Specially, in this talk, we focus on the high-performance polymer thin film transistors (PTFTs) backplanes fabricated by ink-jet printing using new polymer semiconductors for the applications of flexible display.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.168-176
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• 2006

Nowadays, Three dimensional printing (3DP) technique that is one of solid freeform fabrication (SFF) technology has been notable issue, and has been applied by various fields. The SFF system can fabricate three dimensional objects of solid freeform with high speed and low cost using ink jet printing technology. In this research, a SFF system to analyze 3DP process technology is developed. We applied sliding mode control with sliding perturbation observer (SMCSPO) algorithm and minimized position error to the developed SFF system. We analyzed and optimized process variables such as jetted volume, layer thickness, powder bed and so on experimentally. Also. the dimensional error of a developed SFF system is evaluated. Finally, the feasibility of application to bio manufacturing is presented through successful fabrication of teeth and cranium model.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.372-373
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• 2006

Modern business trends call for miniaturization of electronic systems. One of the major impedances in this miniaturization is the conductive and inductive components in chips and circuit boards. Direct Write Technology can write these soft magnetic materials, thus allowing for further miniaturization of inductor devices. Another obstacle in electronics fabrication is the size limitations of thick screen-printing and the material limitations in ink jet printing. Direct Write Technologies address both of these limitations by providing feature sizes less than 20 microns with a wide range of materials possibilities. A discussion of the application of these nano-particulate materials by Direct Write Technologies will be presented.