• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.711-714
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• 2002

Thermal infrared camera have poor image qualities compared to commercial CCD cameras, as in contrast, brightness, and. resolution. To compensate the poor Image quality problems associated with the thermal infrared camera, the technique of superimposing thermal infrared image into real ccd image is proposed. The mobile robot KAEROT/m2, loaded with sensor head system at the mast, is entered to monitor leakage of heavy water and thermal abnormality of the calandria reactor area in overhaul period. The sensor head system is composed of thermal infrared camera and cod camera In parallel. When thermal abnormality on observation points and areas of calandria reactor area is occurred, unusual hot image taken from thermal infrared camera is superimposed on real CCD image. In this inspection experiment, more accurate positions of thermal abnormalities on calandria reactor area can be estimated by using technique of mapping thermal infrared image into CCD image, which include characters arranged in MPOQ order.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.7
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• pp.1503-1508
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• 2009

This study applied image processing techniques, constructed to real-time, to thermal infrared camera image. Thermal infrared image data was utilized for hot mapping, cool mapping, and rainbow mapping according to changing temperature. It was histogram image processing techniques so that detected shade contrast function of the thermal infrared image, and the thermal infrared image's edge was extracted to classification of object. Moreover, extraction of temperature from image was measured by using the image information program.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Journal of Sensor Science and Technology
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• v.9 no.1
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• pp.44-50
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• 2000

Every object emits some energy from its surface. The emission energy forms surface heat distribution which we can capture by using an infrared thermal imager. The infrared thermal image may include valuable information regarding to the subsurface anomaly of the object. Since a thermal image reflects surface clutter and subsurface anomaly, we have difficulty in extracting the information on the subsurface anomaly only with thermal images taken under a wavelength. Thus, we use visible wavelength images of the object surface to remove exterior clutter. We, therefore in this paper, visualize the infrared image for overlaying it with a visible wavelength image. First, we make an interpolated image from two ordinary images taken from both sides of an infrared sensor. Next, we overlay the intermediate image with an infrared image taken from the infrared camera. The technique suggested in this paper can be utilized for analyzing the infrared images on non-destructive inspection against disaster and for safety.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.4
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• pp.34-38
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• 2005

This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.

• Journal of Broadcast Engineering
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• v.18 no.4
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• pp.550-558
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• 2013

The infrared and visible images are represented by different information due to the different wavelength of the light. The infrared image has thermal information and the visible image has texture information. Desirable results are obtained by fusing infrared and visible information. To enhance a visible image, we extract a weight map from a visible image using saturation, brightness. After that, the weight map is adjusted using thermal information in the infrared image. Finally, an enhanced image is resulted from combining an infrared image and a visible image. Our experiment results show that our proposed algorithm is working well to enhance the smoke in the original image.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.5
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• pp.396-403
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• 2000

A thermal imaging system is implemented for the measurement and the analysis of the thermal distribution of the target objects. The main part of the system is a thermal camera in which a focal plane array typed sensor is introduced. The sensor detects the mid-range infrared spectrum of target objects and then it outputs a generic video signal which should be processed to form a frame thermal image. Here, a digital signal processor(DSP) is applied for the high speed processing of the sensor signals. The DSP controls analog-to-digital converter, performs correction algorithms and outputs the frame thermal data to frame buffers. With the frame buffers can be generated a NTSC signal and transferred the frame data to personal computer(PC) for the analysis and a monitoring of the thermal scenes. By performing the signal processing functions in the DSP the overall system achieves a simple configuration. Several experimental results indicate the performance of the overall system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.1 no.2
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• pp.27-31
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• 2000

Thermal imaging system is implemented for the measurement and the analysis of the thermal distribution of the target objects. The main Part of the system is thermal camera in which a focal plane array typed sensor is introduced The sensor detects mid-range infrared spectrum or target objects and then it output generic video signal which should be processed to form a thermal image frame. A digital signal processor(DSP) in the system inputs analog to digital converted data. performs algorithms to improve the thermal images and then outputs the corrected frame data to frame buffers for NTSC encoding and for digital outputs.. To enhance the quality of the thermal images, two point correction method is applied. Figures indicate that the corrected thermal images are much improved.

• Journal of the Korean Solar Energy Society
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• v.33 no.5
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• pp.51-59
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• 2013

It is usual to evaluate the performance of the cool roof by measuring in-site rooftop temperature using thermal infra-red camera. The principal advantage of rooftop thermal infrared image acquired in oblique vantage point of super high-rise building as a remote sensor is to provide, in a cost-effective manner, area-wide information required for a scattered rooftop target with different colors, utilizing wide view angle and multi-temporal data coverage. This research idea was formulated by incorporating the concept of traditional remote sensing into rooftop temperature monitoring. Correlations between infrared image of super high-rise building and in-situ data were investigated to compare rooftop surface temperature for a total of four different rooftop locations. The results of the correlations analyses indicate that the rooftop surface temperature by the infrared images of super high-rise building alone could be explained yielding $R^2$ values of 0.951. The visible permanent record of the oblique thermal infra-red image was quite useful in better understanding the nature and extent of rooftop color that occurs in sampling points. This thermal infrared image acquired in oblique vantage point of super high-rise made it possible to identify area wide patterns of rooftop temperature change subject to many different colors, which cannot be acquired by traditional in-site field sampling. The infrared image of super high-rise building breaks down the usual concept of field sampling established as a conventional cool roof performance evaluation technique.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.5
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• pp.533-538
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• 2015

Thermal characterization of individual pixels in microbolometer infrared image sensors is needed for optimal design and improved performance. In this work, we used thermoreflectance microscopy on uncooled microbolometer image sensors to investigate the thermal characteristics of individual pixels. Two types of microbolometer image sensors with a shared-anchor structure were fabricated and thermally characterized at various biases and vacuum levels by measuring the temperature distribution on the surface of the microbolometers. The results show that thermoreflectance microscopy can be a useful thermal characterization tool for microbolometer image sensors.