• 제목/요약/키워드: Industrial clean room

검색결과 45건 처리시간 0.027초

반도체 클린룸용 배기 열회수식 외기공조시스템의 에너지절감에 관한 실험적 연구 (An Experimental Study on Energy Reduction of an Exhaust Air Heat Recovery Type Outdoor Air Conditioning System for Semiconductor Manufacturing Clean Rooms)

  • 송근수;유경훈;강신영;손승우
    • 설비공학논문집
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    • 제21권5호
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    • pp.273-281
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    • 2009
  • In recent semiconductor manufacturing clean rooms, the energy consumption of outdoor air conditioning systems represents about 45% of the total air conditioning load required to maintain a clean room environment. Meanwhile, there is a large amount of exhaust air from a clean room. From an energy conservation point of view, heat recovery from the exhaust air is therefore useful for reducing the outdoor air conditioning load for a clean room. In the present work, an energy-efficient outdoor air conditioning system was proposed to reduce the outdoor air conditioning load by utilizing an air washer to recover heat from the exhaust air. The proposed outdoor air conditioning system consisted mainly of a preheating coil, an air washer, two stage cooling coils, a reheating coil, a humidifier and two heat recovery cooling coils inserted into the air washer and connected to a wet scrubber. It was shown from the lab-scale experiment with outdoor air flow of $1,000\;m^3/h$ that the proposed system was more energy-efficient for the summer and winter operations than an outdoor air conditioning system with a simple air washer.

난류형 클린룸내의 Layout 변화에 따른 분진제거 특성에 관한 연구 (A Study on the Phenomena of Dust Removal by the Layout Changes in the Turbulent Type Clean Room)

  • 김연희;김홍
    • 한국안전학회지
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    • 제21권5호
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    • pp.46-52
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    • 2006
  • The purpose of this paper is to investigate the removal efficiency of fine dusts as the configuration condition of machinery and equipments in Clean Room and to analyze the flowing behaviors of fine dusts as the layout of Clean Room. The layout of the Clean Room was classified into side layout type, 2 center line type and center concentration type layout, and the flow rates used in this research were 0.22m/s, 0.44m/s and 0.80m/s. Dust removal efficiency as layout change was decreased 37% for side layout type, 31% for 2 center line type and 20% for center concentration type layout at the flow rate of 0.22m/s, compared with the state without machinery and equipments in Clean Room. The efficiency was decreased 42% for side layout type, 22% for 2 center line type and 8% for center concentration type layout at the flow rate of 0.44m/s, and decreased 20% for side layout type, 18% for 2 center line type and 10% for center concentration type layout at the flow rate of 0.80m/s. According to the result of dust removal behavior, $0.3{\mu}m,\;1{\mu}m\;and\;3{\mu}m$ dust except for $5{\mu}m$ showed the higher change of the behavior in side layout type than in center concentration type layout due to the change of air flow. It was confirmed that removal behavior depends on the layout of machinery and equipments as the dust size decreases.

반도체 클린룸용 증기가습 및 수분무가습 외기공조시스템의 에너지소비량 평가 (An Assessment of Energy Consumption in Steam-Humidification- and Water-Spray-Humidification-Type Outdoor Air Conditioning Systems for Semiconductor Manufacturing Clean Rooms)

  • 김기철;송근수;김형태;유경훈;신대건;박덕준
    • 설비공학논문집
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    • 제25권2호
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    • pp.55-63
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    • 2013
  • For a large-scale semiconductor manufacturing clean room, the energy consumed in an outdoor air conditioning system to heat, humidify, cool and dehumidify incoming outdoor air is very large. In particular, the energy requirement to humidify outdoor air in the winter season is generally known to be high. Recently, in order to overcome the high energy consumption nature of a steam generator in a conventional steam humidification type outdoor air conditioning system, an air washer is often introduced instead of the steam generator in the outdoor air conditioning system, which can be called a water spray humidification type outdoor air conditioning system. Therefore, the assessment and comparison of the annual energy consumed in the steam humidification type and the water spray humidification type outdoor air conditioning systems deserves to be examined in order to reduce the outdoor air conditioning load of a clean room. In the present study, a numerical analysis was conducted to obtain the annual electric power consumption of the two outdoor air conditioning systems. It was shown from the comparison of the numerical results that the water spray humidification type outdoor air conditioning system can reduce about 30% of annual electric power consumption of the steam humidification type outdoor air conditioning system.

장비 구동부품 기인 Particle 평가를 위한 마모측정기의 개발에 관한 연구 (A Study of Developing Wear Tester to Measure and Minimize Particle Levels in Cleanroom)

  • 박광희;노권학;장성호;이종환;차영철;전해등
    • 산업경영시스템학회지
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    • 제36권2호
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    • pp.1-7
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    • 2013
  • Cleanroom could be largely classified into industrial cleanroom that can be contaminated by particles and bio-cleanroom that can be contaminated by biological particles. Electrical manufacturing companies producing precision machines and electrical parts essentially have industrial cloom facilities and clean technologies to produce defects free products due to particles. Industrial cleanroom should be controlled in respect of 4M1E to prevent from foreign materials of sub-micro unit and to keep out contamination sources from outside. In this paper, a concept for a quantitative methodology to measure the particles from running components was suggested by combining both newly making clean booth such as wear tester and laser particle counter.

LCD 제조공정 클린룸의 화재시 CFD를 이용한 제연성능 개선대책에 관한 연구 (A Study on Measures to Improve Smoke Control Performance in Case of Fire in a Clean room as an LCD Manufacturing Process)

  • 손봉세;장찬희
    • 한국화재소방학회논문지
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    • 제26권5호
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    • pp.41-47
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    • 2012
  • 첨단산업기술인 반도체, LCD 등 제조의 핵심공정인 클린룸은 생산제품의 성능 및 품질에 절대적인 영향을 미치는 가장 중요한 공정이다. 그러나 국내는 방화공학적인 측면에서 과학적이고 종합안전대책에 대한 체계적인 연구가 제대로 이루어지지 않고 있다. 본 연구는 LCD 제조공정 클린룸에 설치하는 제연시스템의 성능 및 문제점을 파악하여 이에 대한 개선방안을 도출하기 위하여 여러 시나리오를 고려한 화재시뮬레이션과 피난시뮬레이션을 통하여 분석하였다. LCD 제조공정의 클린룸 화재 및 연기확산에 대하여 분석한 결과 화재시 공조기의 연동정지는 반드시 필요하며 연기의 부력을 고려하여 FAB 상부에 배연을 할 수 있도록 하여야 한다. 또한 대규모 클린룸의 경우 화재특성상 스프링클러헤드의 집열 성능이 떨어지므로, 조기반응형 헤드의 설치 및 작동시간을 빠르게 하기 위한 보조장치를 설치하여야 한다. 특히, 대공간 클린룸은 자동화 공정으로 거주밀도가 낮지만, 복잡한 생산장비의 배치와 방진복을 착용하고 근무해야하는 환경특성 때문에 화재시 피난안전성능 확보가 어렵기 때문에 공정 내 위험요소의 철저한 관리 및 주기적인 교육과 훈련이 필요하며, 방재선진국의 기준에 준하는 수준의 국내 관련기술 기준을 정립할 필요가 있다.

반도체 웨이퍼 제조공정 클린룸 구조, 공기조화 및 오염제어시스템 (Clean Room Structure, Air Conditioning and Contamination Control Systems in the Semiconductor Fabrication Process)

  • 최광민;이지은;조귀영;김관식;조수헌
    • 한국산업보건학회지
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    • 제25권2호
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    • pp.202-210
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    • 2015
  • Objectives: The purpose of this study was to examine clean room(C/R) structure, air conditioning and contamination control systems and to provide basic information for identifying a correlation between the semiconductor work environment and workers' disease. Methods: This study was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. The C/R structure and air conditioning method were investigated using basic engineering data from documentation for C/R construction. Furthermore, contamination parameters such as airborne particles, temperature, humidity, acids, ammonia, organic compounds, and vibration in the C/R were based on the International Technology Roadmap for Semiconductors(ITRS). The properties of contamination control systems and the current status of monitoring of various contaminants in the C/R were investigated. Results: 200 mm and 300 mm wafer fabrication facilities were divided into fab(C/R) and sub fab(Plenum), and fab, clean sub fab and facility sub fab, respectively. Fresh air(FA) is supplied in the plenum or clean sub fab by the outdoor air handling unit system which purifies outdoor air. FA supply or contaminated indoor air ventilation rates in the 200 mm and 300 mm wafer fabrication facilities are approximately 10-25%. Furthermore, semiconductor clean rooms strictly controlled airborne particles(${\leq}1,000{\sharp}/ft^3$), temperature($23{\pm}0.5^{\circ}C$), humidity($45{\pm}5%$), air velocity(0.4 m/s), air change(60-80 cycles/hr), vibration(${\leq}1cm/s^2$), and differential pressure(atmospheric pressure$+1.0-2.5mmH_2O$) through air handling and contamination control systems. In addition, acids, alkali and ozone are managed at less than internal criteria by chemical filters. Conclusions: Semiconductor clean rooms can be a pleasant environment for workers as well as semiconductor devices. However, based on the precautionary principle, it may be necessary to continuously improve semiconductor processes and the work environment.

수술중 감염방지를 위한 공조시스템의 개선방안에 대한 연구 (A Study on the Air Ventilation System of Operation Room for the Prevention of Hospital Infection)

  • 김천숙;권순정;주영철
    • 한국산학기술학회논문지
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    • 제5권6호
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    • pp.552-557
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    • 2004
  • 수술중 감염방지를 위해 수술실의 공조시스템의 개선방안에 대한 연구를 수행하였다. 대학병원들의 수술실과 공조 시스템을 조사하였다. 수술실 내부의 여러 부위에서 공기 샘플을 채취하여 세균을 배양함으로써 수술실내 세균의 분포를 측정하였다. 수술실 단면을 2차원 모델화 하여 공기의 유동을 전산유체해석하였다. 준공한지 오래된 병원의 수술실은 공조시스템이 정화된 신선한 공기를 수술이 진행되는 부위에 효과적으로 공급하지 못하는 것으로 판단되어졌다. 시설비의 큰 증가 없이 환자의 수술부위에 효율적으로 신선한 공기를 공급할 수 있는 시스템을 제안하였다.

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반도체 클린룸용 증기가습 및 수분무가습 외기공조시스템의 에너지소비량 비교연구 (Comparative Study on Energy Consumption in Steam-Humidification- and Water-Spray-Humidification-Type Outdoor Air-Conditioning Systems for Semiconductor Manufacturing Clean Rooms)

  • 김형태;송근수;김기철;유경훈;손승우;신대건;박덕준;권오명
    • 대한기계학회논문집B
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    • 제35권12호
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    • pp.1249-1255
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    • 2011
  • 최근의 반도체 제조용 대규모 클린룸에서는 도입 외기를 가열가습 및 냉각감습하는 외기공조시스템의 에너지소비량이 클린룸 환경을 유지하기 위해 필요한 전체 공조에너지의 약 45 %를 차지하고 있다. 특히 동기(겨울철)의 경우 외기를 가습하기 위한 에너지소비량은 매우 높다. 따라서 에너지절감을 통한 제조비용 절감 및 온실가스 감축을 위해 외기부하와 관계되는 공조에너지의 사용효율 증대 및 철저한 사용합리화가 요구되고 있다. 따라서 반도체 클린룸용 외기공조시스템의 핵심 가습방식인 증기가습과 수분무가습 방식에 대한 소비전력량을 분석하는 것은 에너지절약적 측면에서 상당히 가치가 있다고 판단된다. 본 연구에서는 전극봉식 가습기에 의한 증기가습방식 및 에어와셔에 의한 수분무가습방식 외기공조시스템들의 공조프로세스 및 소비전력량을 외기량 1000 $m^3$/h의 경우 기흥지역의 동기 및 하기의 피크부하에 대해 비교하는 실험을 수행하였다. 실험결과들로부터 에어와셔 수분무가습 외기공조시스템이 전극봉식 증기가습 외기공조시스템보다 연간 소비전력량이 적어서 에너지절약적임을 보여주었다.

반도체 Intra-Bay 물류시스템에서의 차량 배차 (A New Vehicle Dispatching in Semiconductor Intra-Bay Material Handling System)

  • 구평회;서정대;장재진
    • 산업공학
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    • 제16권spc호
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    • pp.93-98
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    • 2003
  • This paper addresses an AGV dispatching problem in semiconductor clean-room bays where AGVs move cassettes of wafers between machines or machines and a central buffer. Since each machine in a bay has a local buffer of limited capacity, material flow should be controlled in a careful way to maintain high system performance. It is regarded that two most important performance measures in a semiconductor bay are throughput rate and lead-time. The throughput rate is determined by a bottleneck resource and the lead-time depends on smooth material flow in the system. This paper presents an AGV dispatching procedure based on the concept of theory of constraints (TOC), by which dispatching decisions are made to utilize the bottleneck resource at the maximum level and to smooth the flow of material. The new dispatching procedure is compared with existing dispatching rules through simulation experiments.

반도체 클린룸용 세라믹 Rotor 흡착제 개발 (The Development of Absorption Elements of Ceramic Rotors for the Semiconductor Clean Room System)

  • 서동남;하종필;정미정;문인호;조상준;김익진
    • 한국산학기술학회논문지
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    • 제1권2호
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    • pp.33-40
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    • 2000
  • 본 연구는 반도체 크린룸에서 VOC(volatile organic compound)과 수분을 제거하기 위한 흡착로타에 관한 것이다. 흡착로타는 세라믹 페이퍼 허니컴 기질에 NaX 제올라이트와 TS-1 제올라이트로 만들어졌다. NaX 제올라이트는 수열합성법으로 합성되어졌으며, NaX 제올라이트 결정(2∼3 ㎛)을 seed로 합성 조성에 3∼5 wt%까지 첨가하여 5 ㎛의 균일한 NaX 제올라이트를 성장시켰다. Seed의 첨가는 seed를 첨가하지 않은 합성용액과 비교하여 결정의 크기가 크며, 균일한 NaX 제올라이트 결정을 성공적으로 합성하였다. TS-1 제올라이트는 초기 반응액의 pH를 변화시켜 합성하였다. 반응물의 pH는 10.0에서 11.5 까지의 범위를 가지며, PH 10.4에서 큰 기공(8∼10 (equation omitted))을 가진 TS-1 제올라이트(ETS-10)가 합성되는 반면 pH가 11.5에서는 작은 기공 (3∼5 (equation omitted))을 갖는 TS-1 제올라이트(ETS-4)가 합성되었다.

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