• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.29.1-29.1
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• 2009

Fabrication of good quality P-type GaN remained as a challenge for many years which hindered the III-V nitrides from yielding visible light emitting devices. Firstly Amano et al succeeded in obtaining P-type GaN films using Mg doping and post Low Energy Electron Beam Irradiation (LEEBI) treatment. However only few region of the P-GaN was activated by LEEBI treatment. Later Nakamura et al succeeded in producing good quality P-GaN by thermal annealing method in which the as deposited P-GaN samples were annealed in N2 ambient at temperatures above $600^{\circ}C$. The carrier concentration of N type and P-type GaN differs by one order which have a major effect in AlGaN based deep UV-LED fabrication. So increasing the P-type GaN concentration becomes necessary. In this study we have proposed a novel method of activating P-type GaN by electrochemical potentiostatic method. Hydrogen bond in the Mg-H complexes of the P-type GaN is removed by electrochemical reaction using KOH solution as an electrolyte solution. Full structure LED sample grown by MOCVD serves as anode and platinum electrode serves as cathode. Experiments are performed by varying KOH concentration, process time and applied voltage. Secondary Ion Mass Spectroscopy (SIMS) analysis is performed to determine the hydrogen concentration in the P-GaN sample activated by annealing and electrochemical method. Results suggest that the hydrogen concentration is lesser in P-GaN sample activated by electrochemical method than conventional annealing method. The output power of the LED is also enhanced for full structure samples with electrochemical activated P-GaN. Thus we propose an efficient method for P-GaN activation by electrochemical reaction. 30% improvement in light output is obtained by electrochemical activation method.

• Korean Journal of Materials Research
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• v.18 no.10
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• pp.535-541
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• 2008

Growth behavior of InGaN/GaN self-assembled quantum dots (QDs) was investigated with respect to different growth parameters in low pressure metalorganic chemical vapor deposition. Locally formed examples of three dimensional InGaN islands were confirmed from the surface observation image with increasing indium source ratio and growth time. The InGaN/GaN QDs were formed in Stranski-Krastanow (SK) growth mode by the continuous supply of metalorganic (MO) sources, whereas they were formed in the Volmer-Weber (V-W) growth mode by the periodic interruption of the MO sources. High density InGaN QDs with $1{\sim}2nm$ height and $40{\sim}50nm$ diameter were formed by the S-K growth mode. Dome shape InGaN dots with $200{\sim}400nm$ diameter were formed by the V-W growth mode. InN content in InGaN QDs was estimated to be reduced with the increase of growth temperature. A strong peak between 420-460 nm (2.96-2.70 eV) was observed for the InGaN QDs grown by S-K growth mode in photoluminescence spectrum together with the GaN buffer layer peak at 362.2 nm (3.41 eV).

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.05a
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• pp.21.2-21.2
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• 2007

• Applied Science and Convergence Technology
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• v.26 no.3
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• pp.52-54
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• 2017

An InGaN/GaN multiple quantum well (MQW) structure is grown on a GaN/sapphire template using a plasma-assisted molecular beam epitaxy (PA-MBE). The fluctuation of the quantum well thickness formed from roughly-grown InGaN layer results in a disordered photoluminescence (PL) spectrum. The surface morphologies of the InGaN layers with various In compositions are investigated by reflection high energy electron diffraction (RHEED) and atomic force microscopy (AFM). A blurred InGaN/GaN hetero-interface and the non-uniform QW size is confirmed by high resolution transmission electron microscopy (HR-TEM). Inhomogeneity of the quantum confinement results in a degradation of the quantum efficiency even though the InGaN layer has a uniform In composition.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.308.2-308.2
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• 2014

최근 III-N계 물질 기반의 광 반도체 중 m-면 사파이어 기판을 사용하여 반극성 (11-22) GaN박막을 성장하는 광반도체의 발광효율을 높이려는 연구가 많이 진행되고 있다. 하지만, 반극성 (11-22) GaN와 m-면 사파이어 기판과의 큰 격자상수 차이와 결정학적 이방성의 차이에 의해 많은 결정 결함이 발생하게 된다. 이러한 결정결함들은 반극성 LED소자내에서 누설전류 및 비발광 재결합, 순방향전압 등의 소자특성을 저하시키는 큰 요인이 되기 때문에 고효율 발광소자를 제작함에 있어 어려움을 야기시킨다. 이러한, 반극성 LED 소자의 효율 향상을 위해 결함 분석에 대한 연구를 주를 이루고 있는 상황으로, n-GaN층에 Si도핑에 관한 연구가 진행되고 있다. 이미 극성과 비극성에서는 n-GaN층에 Si이 도핑이 증가될수록 결정질이 향상되고, 양자우물의 계면의 질도 향상 되었다는 보고가 있다. 본 연구에서는 반극성 (11-22) GaN 기반의 발광소자를 제작함에 있어 n-GaN 층의 도핑 농도 변화를 통한 반극성 GaN 박막의 결정성 및 전기적 특성 변화에 따른 LED소자의 전계 발광 특성에 대한 연구를 진행하였다. 금속유기화학증착법을 이용하여 m-면 사파이어 기판에 $2.0{\mu}m$두께의 반극성 (11-22) GaN 박막을 저온 GaN완충층이 존재하지 않는 고온 1단계 성장법을 기반으로 성장하였다.[3] 이후, $2.0{\mu}m$ 반극성 (11-22) GaN 박막 위에 $3.5{\mu}m$ 두께의 n-GaN 층을 성장시켰다. 이때, n-형 도펀트로 SiH4 가스를 4.9, 9.8, 19.6, 39.2 sccm으로 변화하여 성장하였다. 이 4가지 반극성 (11-22) n-GaN 템플릿을 이용하여 동일 구조의 InGaN/GaN 다중양자우물구조와 p-GaN을 성장하여 LED 구조를 제작하였다. X-선 ${\omega}$-rocking curve를 분석한 결과, 이러한 특성은 반극성 (11-22) n-GaN층의 Si 도핑농도 증가에 따라서 각 (0002), (11-20), (10-10) 면에서 결정 결함이 감소하고, 반극성 (11-22) n형 GaN템플릿을 이용하여 성장된 반극성 GaN계 LED소자는 20mA인가 시 도핑 농도 증가에 따라 9.2 V에서 5.8 V로 전압이 감소하였으며 역방향 전류에서도 누설전류가 감소함이 확인되었다. 또한, 전계 발광세기도 증가하였는데, 이는 반극성 n형 GaN박막의 실리콘 도핑농도 증가에 따라 하부 GaN층의 결정성이 향상과 더불어 광학적 특성이 향상되고, n형 GaN층의 전자 농도 및 이동도의 동시 증가에 따라 전기적 특성이 향상 됨에 따라 LED소자의 전계 발광 특성이 향상된 것으로 판단된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.11
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• pp.702-706
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• 2016

We demonstrated that self-separation FS-GaN (freestanding-GaN) was grown on MELO (maskless epitaxially lateral overgrowth) GaN template by horizontal HVPE (hydride vapor phase epitaxy). Before thick GaN grwoth, MELO GaN template was grown on patterned GaN template by MOCVD (metal organic chemical vapor deposition). The laterally overgrown GaN would consist of a continuous well coalesced layer. The mixed TDD (threading dislocation density) of seed and wing region were $8{\times}10^8cm^{-2}$ and $7{\times}10^7cm^{-2}$, respectively. After thick GaN grown by HVPE, the self-separation between thick GaN and sapphire substrate was generated at seed region. The regions of self-separation for FS-GaN and sapphire were observed by FE-SEM. Moreover, Raman results indicated that the compressive strain of seed and wing regions at FS-GaN substrate were slightly released compared to that of thick GaN grown on conventional GaN template. The optical properties of the FS-GaN substrate were examined by using PL (photoluminescence). The PL exhibited that donor bound exciton and donor acceptor pair were observed at low temperature. The effects on optical and structural properties of FS-GaN substrate have been discussed in detail.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.4
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• pp.10-14
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• 2009

We propose a trapezoidal gate AlGaN/GaN high electron mobility transistor(HEMT) to improve the breakdown voltage characteristics and its feasibility is investigated by two-dimensional device simulations. The use of a trapezoidal gate structure appears to be quite effective in dispersing the electric fields concentrated near the gate edge on the drain side from the simulation result. We find that a peak value of the electric field along the 2-DEG channel is reduced by 30%, from 4.8 to 3.5 MV/cm and thereby, the breakdown voltage(Vbr) of the proposed AlGaN/GaN HEMT is increased by about 40%, from 49 to 69 V, compared to those of the standard AlGaN/GaN HEMT.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.6
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• pp.553-557
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• 1999

In order to investigate the optical properties of the $Al_XGa_{1-X}N/GaN$ thin film grown by metalorganic chemical vapor deposition (MOCVD) method, the photoluminescene (PL), photocurrent (PC) and persistent photoconductivity (PPC) measurements were carried out at room temperature. The band gap of the $A1_x$$Ga_{1-x}$N/GaN was determined to 3.70 eV by the PL and PC measurements. The PC measurement on the light illumination from the top of the $A1_x$$Ga_{1-x}$N/GaN thin film provides peaks at 3.70, 3.43, and around 2.2 eV. The PC spectrum by the illumination passing through from the substrate of the sample can be shown at 3.43 eV together with a broad tail band from the GaN band edge to around 2.23 eV. The photocurrent quenching and anomalous PPC decay observed in PPC measurements indicate that metastable electron states are fomed in the band gap of GaN layer to trap electrons which can be tunneled the potential barrier for long recovery time.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.10
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• pp.23-28
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• 2010

In this paper, we investigated the polarization effects on the electrical and structural characteristics of AlGaN/GaN HEMT. Both the Al mole-fraction and the barrier thickness of AlGaN, which determine the profiles of a two-dimensional electron gas, were simulated to obtain the optimum HEMT structure affecting the polarization effect. As a results, we found that the amount of bound sheet charges was increased by 16% and the maximum drain current density ($I_D$,max) was increased by more than 37%, while AI mole fractions are changed from 0.3 to 0.4. We also observed a 37% improvement in maximum drain current density ($I_D$,max) by increasing AIGaN layer thickness from 17 to 38 nm. However when AlGaN layer thickness reached the critical thickness, DC characteristics were dramatically lowered due to 'bulk' relaxation in AlGaN layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.89-90
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• 2009

Three kind of surface-leakage-test-patterns were fabricated and measured in order to investigate the surface leakage current of AlGaN/GaN heterostructures through etched GaN buffer surface and mesa wall. The pattern which contain the mesa wall has the largest surface leakage current among them. The leakage current due to the mesa wall is predominant source of the leakage current of AlGaN/GaN devices.