• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.955-959
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• 2004

The effects of conduction band offset on 2 dimensional electron gas (2DEG) in N-InAlAs(AlAsSb)/InGaAs/InAlAs (AlAsSb) metamorphic heterostructures (MMHS) are studied. A combination of the Shubnikov-deHaas oscillations and the Hall measurements is used to investigate the electron transport properties of these structures. The mobility in the second subband is higher than that in the first subband in all heterostructures. This is attributed to the fact that electrons in the first subband we, on average, closer to the interface and are therefore scattered more strongly by ionized impurities. The results suggest that intersubband scattering rate is more dominant in structures with higher conduction band offset whereas alloy scattering is found to be more dominant in the higher band offset system.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.165-165
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• 2010

$1.55\;{\mu}m$ 대역의 레이저 다이오드를 제작하기 위해, InP(001) 기판에 InAlGaAs 물질을 장벽층으로 하는 InAs 양자점 구조를 분자선증착기 (MBE)를 이용하여 성장하고 구조 및 광학적 특성을 Double Crystal X-ray Diffraction (DCXRD), Atomic Force Microscopy (AFM), Photoluminescence (PL)을 이용하여 평가하였다. 일반적으로 InAlGaAs 물질은 고유한 상분리 현상 (Phase Separation)이 나타나는 특성이 있으며, 이는 양자점 성장에 중요한 요인으로 작용할 수 있다. 이러한 InAlGaAs 물질의 상분리 현상을 기판온도 ($540^{\circ}C$, $555^{\circ}C$, $570^{\circ}C$)를 비롯한 성장변수를 변화시켜 제어하고 InAs 양자점 형성에 어떠한 영향을 미치는지를 분석하였다. 540의 성장온도에서 InP(001) 기판에 격자정합한 InAlGaAs 장벽층이 성장온도를 $570^{\circ}C$로 증가시킬 경우 기판에 대하여 인장 응력 (Tensile Strain)을 받는 구조로 변화되었다. 인장응력을 받는 InAlGaAs 장벽층을 Ga Flux 양을 조절하여 격자정합한 InAlGaAs 층을 형성할 수 있었다. AFM을 통한 표면 형상 분석 결과, 서로 다른 기판온도에서 성장한 InAlGaAs 물질이 InP(001) 기판에 격자정합 조건일지라도 표면의 거칠기 (Surface Roughness)는 매우 다른 양상을 보였고 InAs 양자점 형성에 직접적으로 영향을 주었다. $570^{\circ}C$에서 성장한 InAlGaAs 위에 형성한 InAs 양자점의 가로방향 크기를 세로방향 크기로 나눈 비율이 1.03으로서, 555와 $540^{\circ}C$의 1.375 와 1.636와 비교할 때 모양 대칭성이 현저히 개선된 것을 알 수 있다. 상분리 현상이 줄어 표면 거칠기가 좋은 InAlGaAs 위에 양자점을 형성할 때 원자들의 이동도가 상대적으로 높아 InAs 양자점의 크기가 증가하고, 밀도가 감소하는 현상이 나타났다. 또한 InAlGaAs 장벽층이 InP(001) 기판을 기준으로 응력 (Compressive 또는 Tensile)이 존재하는 경우, InAs 양자점 모양이 격자정합 조건 보다 비대칭적으로 변하는 특성을 보여 주었다. 이로부터, 대칭성이 개선된 InAs 양자점 형성에 InAlGaAs 장벽층의 표면 거칠기와 응력이 중요한 변수로 작용함을 확인 할 수 있었다. PL 측정 결과, 발광파장은 $1.61\;{\mu}m$로 InAs 양자구조 형상에 따라 광강도 (Intensity), 반치폭 (Line-width broadening) 등이 변화 되었다.

• Proceedings of the Optical Society of Korea Conference
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• 1998.08a
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• pp.200-201
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• 1998

• Journal of the Korean institute of surface engineering
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• v.39 no.1
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• pp.25-34
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• 2006

Al-Mg alloy, an open rack vaporizer(ORV) material was reported to be corroded in seawater environments though the ORV material was coupled to thermally sprayed Al-Zn alloy functioning a sacrificial anode. In addition, the corrosion behavior based on the calculated corrosion potential did not match the observed corrosion behavior. Hence, the goal of this study is to get better understanding on Al or Al-Mg alloy coupled to Al-Zn alloy and to provide the calculated corrosion potential representing the corrosion behavior of the ORV material by immersion test, electrochemical tests, and calculation of corrosion and galvanic potential. The corrosion potentials of Al and Al alloys also depended on alloying element as well as surface defects. The corrosion potentials of Al and Al-Mg alloy were changed with time. In the meantime, the corrosion potentials of Al-Zn alloys were not. The corrosion rates of Al-Zn alloys were exponentially increased with zinc contents. The phenomena were explained with the stability of passive film proved by passive current density depending on pH and confirmed by the model proposed by McCafferty. Dissimilar material crevice corrosion (DMCC) test shows that higher content of zinc caused Al-Mg alloy corroded more rapidly, which was due to the fact that higher corrosion rate of Al-Zn makes [$H^+$] and [$Cl^-$] more concentrated within pit solution to corrode Al-Mg alloy. Considering electrochemical reactions within pit as well as bulk in the calculation gives better prediction on the corrosion behavior of Al and Al-Mg alloy as well as the capability of Al-Zn alloy for corrosion protection.

• Korean Journal of Optics and Photonics
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• v.3 no.3
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• pp.183-190
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• 1992

Luminescence properties of asymmetric double quantum well structure composed of $Al_x/Ga_{1-x}$ /As AIAs/GaAs have been studied by steady state and time-resolved photoluminescence and phtoluminescence excitation spectroscopy at low temperature. Two quantum well samples with different barrier thickness (15$\AA$ and 150$\AA$) were prepared to investigate the dependence of tunneling characteristics on barrier thickness. The abscence of excitonic recombination peak from $Al_x/Ga_{1-x}$As well for the 15$\AA$ barrier sample indicates a very fast electron tunneling to GaAs well. Meanwhile, T-X transition between well and barrier is supposed to be a major route for the fast decay of luminescence from $Al_x/Ga_{1-x}$As well in the 150$\AA$ barrier sample. Time-resolved photduminescence from GaAs well of 15$\AA$ sample shows the exsitence of the rise with 100 ps which is attributed to the hole tunneling.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.289-289
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• 2012

Molecular beam epitaxy 방법으로 성장시킨 AlGaAs/GaAs 다중 양자 우물 구조에 대한 라만 산란 연구를 보고한다. InAs 양자점이 성장된 Si 기판 위에 각기 다른 온도에서 두께 약 1 ${\mu}m$의 GaAs 층을 두 단계로 성장시킨 후 그 위에 AlGaAs/GaAs 다중 양자 우물 구조를 성장시켰다. AlGaAs/GaAs 다중 양자 우물 구조의 광학적 특성에 영향을 주는 GaAs 층의 변형력(stress)의 변화를 알기 위해서 시료의 측면으로부터 공간 분해된 라만 산란 실험을 수행하였다. 라만 산란 실험으로부터 AlGaAs/GaAs 다중 양자 우물 구조가 지니는 모든 종류의 광학 포논을 관측하였으며, 두 단계로 성장시킨 GaAs 층에서의 변형력이 Si 기판으로부터 멀어질수록 성장조건의 변화에 따라서 다르게 전개된다는 것을 파악하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.05a
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• pp.5-5
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• 1999

A novel process is proposed to improve oxidation resistance of Ti-Al intermetallic compounds at elevated temperatures by both Cr addition and pre-sulfidation, where TiAl alloys withlor without Cr addition were sulfidized at 1173K for 86.4ks at a 1.3 Pa sulfur partial pressure in a $H_2-H_2S$ gas mixture. The pre-sulfidation treatment formed a thin Cr-Al alloy layer as well as 7~10 micrometer $TiAl_3$ and $TiAl_2$ layer, due to selective sulfidation of Ti. Oxidation resistance of the pre-sulfidation processed TiAl 4Cr alloy was examined under isothermal and heat cycle conditions between room temperature and 1173K in air. Changes in $TiAl_3$ into $TiAl_2$ and then TiAl phases as well as their effect on oxidation behavior were investigated and compared with the oxidation behavior of the TiAl-4Cr alloy as TiAl and pre-sulfidation processed TiAl aHoys. After oxidation for up to 2.7Ms a protective $Al_2O_3$ scale was formed, and the pre-formed $TiAl_3$ changed into $TiAl_2$ and the $Al_2Cr$ phase changed into a CrAlTi phase between the $Al_2O_3$ scale and $TiAl_2$ layer. The pre-sulfidation processed TiAl-4Cr alloy had very good oxidation resistance for longer times, up to 2.7 Ms, in contrast to those observed for the pre-sulfidation processed TiAl alloy where localized oxidation occurred after 81 Oks and both the TiAl and TiAl-4Cr alloys themselves corroded rapidly from the initial stage of oxidation

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2374-2382
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• 2002

Aluminum alloy/aramid fiber reinforced plastic(Al/AFRP) laminates consists of high strength metal(A15052) and laminated aramid fiber with structural adhesive bond. The mixture ratio effect of epoxy resin curing agent accelerator on the tensile strength and T-peel strength characteristic in Al AFRP laminates were investigated in this study. The epoxy. diglycidylether of bisphenol A(DCEBA), It'as cured by methylene dianiline(MDA) with or without an accelerator(K-54). Eight different kinds of resin mixture ratios were selected for the test , five kinds of Al/AFRP laminates were named as Al/AFRP(1) and three others of Al/AFRP laminates were named as Al/AFRP(2). The comparison of tensile strength and T-peel strength with variation of resin mixture ratio were studied. Respectively. Al/AFRP(1) and Al/AFRP(2) indicated approximately 6.0 times and 7.0 times more improved maximum tensile strength in comparison with those of monolithic A15052. Al/AFRP(2) indicated approximately 1.5 times more impoved maximum T-peel strengths in comparison with those of Al/AFRP(1). As results. Al/AFRP(2) turned out to have more effective characteristics on the tensile strength and T-peel strength than those of Al/AFRP(1).

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.138-138
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• 1999

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.6
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• pp.447-452
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• 1998

The selective dry etching of GaAs to Al\ulcornerGa\ulcornerAs using $BCI_3/SF_6$ gas mixture in electron cyclotron resonance(ECR) plasma is investigated. A selectivity of GaAs to AlGaAs of more than 100 and maximum etch rate of GaAs are obtained at a gas ratio $SF_6/BCI_3+SF_6$ of 25%. We verified the formation of $AlF_3$ on $Al_{0.25}Ga_{0.75}As$from the Auger spectra which enhanced the etch selectivity. In order to investigate surface damage of AlGaAs caused by ECR plasma, we performed a low temperature photoluminescence(PL) measurement as a function of RF power. As the RF power. As the RF power increases, the PL intensity decreases monotonically from 50 to 100 Wand then repidly decreases until 250 W. This behavior is due to surface damage by plasma treatment. This dry etching technique using $BCI_3/SF_6$ gas mixture in ECR plasma is suitable for gate recess formation on the GaAs based pseudomorphic high electron mobility transistor(PHEMT)