• Korea-Australia Rheology Journal
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• v.14 no.3
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• pp.121-128
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• 2002

A series of thermoplastic polymers and their blends were melt-processed with high intensity ultrasonic wave in an intensive mixer. For the effective transfer of ultrasonic energy, an experimental apparatus was specially designed so that polymer melt can directly contact with ultrasonic horn. It was observed that significant variations in the rheological properties of polymers occur due to the unique action of ultrasonic wave without any aid of chemical additives. It was also found that the direct sonication on immiscible polymer blends in melt state reduces the domain sizes considerably and stabilizes the phase morphology of the blends. The degree of compatibilization was strongly affected by viscosity ratio of the components and the morphology was stable after annealing in properly compatibilized blends. It is suggested that ultrasound assisted melt mixing can lead to in-situ copolymer formation between the components and consequently provide an effective route to compatibilize immiscible polymer blends.

• Bulletin of the Korean Chemical Society
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• v.29 no.12
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• pp.2325-2326
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• 2008

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.6
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• pp.459-466
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• 2000

For the applications in the ultra-large-scale-integration (ULSI) metallization processing copper thin films have been prepared by metal organic chemical vapor deposition (MOCVD) technology on TiN/Si substrates. The films have been deposited with varying the experimental conditions of substrate temperatures and copper source vapor pressures. The films were then annealed in a vacuum condition after the deposition and the annealing effect to the electrical conductivity of the films was measured. The grain size and the crystallinity of the films were observed to be increased by the post annealing and the electrical conductivity was also increased. The best electrical property of the copper film was obtained by in-situ annealing treatment at above 40$0^{\circ}C$ for the sample prepared at 18$0^{\circ}C$ of the substrate temperature.

• Nuclear Engineering and Technology
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• v.56 no.2
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• pp.402-409
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• 2024

High energy neutron irradiations impact on structural and electrical properties of alumina are studied with particular emphasis on real time in-situ radiation induced conductivity measurement in low flux region. Polycrystalline Al₂O₃ samples are subjected to high energy neutrons produced from D-T neutron generator and Am-Be neutron source. 14 MeV neutrons from D-T generator are chosen to study the role of fast neutron irradiation in the structural modification of samples. Real time in-situ electrical measurement is performed to investigate the change in insulation resistance of Al₂O₃ due to radiation induced conductivity at low flux regime. During neutron irradiation, a significant transient decrease in insulation resistance is observed which recovers relative higher value just after neutron exposure is switched off. XRD results of 14 MeV neutron irradiated samples suggest annealing effect. Impact of relatively low energy neutrons on the structural properties is also studied using Am-Be neutrons. In this case, clustering is observed on the sample surface after prolonged neutron exposure. The structural characterizations of pristine and irradiated Al₂O₃ samples are performed using XRD, SEM, and EDX. The results from these characterizations are analysed and interpreted in the manuscript.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.41-43
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• 2004

Dielectric thin films of $(Pb_{0.72}La_{0.28})Ti_{0.93}O_3$ were deposited on $Pt(111)/Ti/SiO_2/Si$ substrates in situ by pulsed laser deposition(PLD) and annealed with different gases which are forming gas and oxygen gas, respectively. The diffusion of hydrogen into the ferroelectric film was caused by annealing process and resulted in the destruction of polarization. The dielectric properties of forming gas annealed PLT thin films, which are dielectric constant, ferroelectric characteristic, and leakage current characteristics, were degraded

• Proceedings of the Korean Vacuum Society Conference
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• 2004.08a
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• pp.96-96
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• 2004

• Proceedings of the Korean Vacuum Society Conference
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• 2001.07a
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• pp.63-63
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• 2001

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.45-51
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• 2013

Thermal annealing tests were performed in an in-situ scanning electron microscope chamber at $130^{\circ}C$, $150^{\circ}C$, and $170^{\circ}C$ in order to investigate the effects of solder structure on the growth kinetics of intermetallic compound (IMC) in Cu/Sn-3.5Ag microbump. Cu/Sn-3.5Ag($6{\mu}m$) microbump with spreading solder structure showed $Cu_6Sn_5$ and $Cu_3Sn$ phase growths and then IMC phase transition stages with increasing annealing time. By the way, Cu/Sn-3.5Ag($4{\mu}m$) microbump without solder spreading, remaining solder was transformed to $Cu_6Sn_5$ right after bonding and had only a phase transition of $Cu_6Sn_5$ to $Cu_3Sn$ during annealing. Measured activation energies for the growth of the $Cu_3Sn$ phase during the annealing were 0.80 and 0.71eV for Cu/Sn-3.5Ag($6{\mu}m$) and Cu/Sn-3.5Ag($4{\mu}m$), respectively.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.4 no.4
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• pp.809-815
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• 2000

The box capacitor structure with HSG-Si described here reliably achieves a cell capacitance of 28fF with a cell area of a $0.4820\mum^2$ for 128Mbit DRAM. An HSG-Si formation technology with seeding method, which employs Si2H6 molecule irradiation and annealing, was applied for realizing 64Mbit and larger DRAMS. By using this technique, grain size controlled HSG-Si can be fabricated on in-situ phosphorous doped amorphous silicon electrodes. The HSG-Si fabrication technology achieves twice the storage capacitance with high reliability for the stacked capacitors.The box capacitor structure with HSG-Si described here reliably achieves a cell capacitance of 28fF with a cell area of a $0.4820\mum^2$ for 128Mbit DRAM. An HSG-Si formation technology with seeding method, which employs Si2H6 molecule irradiation and annealing, was applied for realizing 64Mbit and larger DRAMS. By using this technique, grain size controlled HSG-Si can be fabricated on in-situ phosphorous doped amorphous silicon electrodes. The HSG-Si fabrication technology achieves twice the storage capacitance with high reliability for the stacked capacitors.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1277_1278
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• 2009

Amorphous oxide semiconductor $InGaZnO_4$(IGZO) is a very promising candidate of channel layer in transparent thin film trasisitor(TTFT) because of its high mobility and high transparency in visible light region. Amorphous IGZO films were deposited at room temperature on a fused silica substrate using pulsed laser deposition method. In-situ post annealing was carried out at 150-450C right after film deposition. The $O_2$ partial pressures during the deposition and the post annealing was fixed to 10mTorr. The electron transport properties of the amorphous IGZO films were improved by thermal annealing. The temperature range in which the improvement of the electrical properties, was 150C~300C.