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http://dx.doi.org/10.6117/kmeps.2013.20.3.045

Effect of Solder Structure on the In-situ Intermetallic Compounds growth Characteristics of Cu/Sn-3.5Ag Microbump  

Lee, Byeong-Rok (School of Materials Science and Engineering, Andong National University)
Park, Jong-Myeong (NEPES Corporation)
Ko, Young-Ki (Micro-Joining Center, Korea Institute of Industrial Technology)
Lee, Chang-Woo (Micro-Joining Center, Korea Institute of Industrial Technology)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.20, no.3, 2013 , pp. 45-51 More about this Journal
Abstract
Thermal annealing tests were performed in an in-situ scanning electron microscope chamber at $130^{\circ}C$, $150^{\circ}C$, and $170^{\circ}C$ in order to investigate the effects of solder structure on the growth kinetics of intermetallic compound (IMC) in Cu/Sn-3.5Ag microbump. Cu/Sn-3.5Ag($6{\mu}m$) microbump with spreading solder structure showed $Cu_6Sn_5$ and $Cu_3Sn$ phase growths and then IMC phase transition stages with increasing annealing time. By the way, Cu/Sn-3.5Ag($4{\mu}m$) microbump without solder spreading, remaining solder was transformed to $Cu_6Sn_5$ right after bonding and had only a phase transition of $Cu_6Sn_5$ to $Cu_3Sn$ during annealing. Measured activation energies for the growth of the $Cu_3Sn$ phase during the annealing were 0.80 and 0.71eV for Cu/Sn-3.5Ag($6{\mu}m$) and Cu/Sn-3.5Ag($4{\mu}m$), respectively.
Keywords
microbump; solder structure; intermetallic compound; in-situ; activation energy;
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