Effect of Solder Structure on the In-situ Intermetallic Compounds growth Characteristics of Cu/Sn-3.5Ag Microbump |
Lee, Byeong-Rok
(School of Materials Science and Engineering, Andong National University)
Park, Jong-Myeong (NEPES Corporation) Ko, Young-Ki (Micro-Joining Center, Korea Institute of Industrial Technology) Lee, Chang-Woo (Micro-Joining Center, Korea Institute of Industrial Technology) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) |
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