• 제목/요약/키워드: In-process Electrolytic

검색결과 295건 처리시간 0.031초

염색폐수의 전해처리 방법에 관한 연구 (Study on the electrochemical treatment of dye wastewater)

  • 전종남;김형수;윤용수;정일현
    • 환경위생공학
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    • 제11권2호
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    • pp.53-58
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    • 1996
  • This study was performed to measure and evaluate the characteristics of removal efficiency and kinetics in the electrolytic decolorizing process of dye wastewater containing acid dye Red 114 by using Fe anode. The synthetic wastewater samples of 500, 1000, $2000mg/{\ell}$ concentration were tested and as an attempt to assess the feasibility of the present system for the industrial application, a sample of wastewater collected by J textile factory in Eujungbu city was also treated. It was found that the optimum conditions were pH 7, 8Volt and removal efficiency in synthetic wastewater containing $2000mg/{\ell}$ of dye and 0.2% of electrolyte (NaCl) was 99.68% after 20minutes of reaction time. In this condition, overall rate constant was $4.77{\times}10^{-5}mmol/cm^{3}hr$. The Decolorizing efficiency and COD removal efficiency of J textile factory wastewater were 99% and 86% respectively at pH 7, 8Volt for 40minutes of reaction time.

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알루미늄 양극산화피막의 반사율 특성연구 (Study of reflection rate character of anodized aluminum thin film)

  • 김승겸;김동현;주인중;남인탁;김훈
    • 한국조명전기설비학회:학술대회논문집
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    • 한국조명전기설비학회 2003년도 학술대회논문집
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    • pp.227-232
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    • 2003
  • Anodizing film was prepared by anodic oxidation of pure aluminum(purity > 99.50) using DC power supply for constant current mode in an electrolytic solution of surface of sulfuric acid. Effects of pre-treatment process such as chemical polishing, acid cleaning, alkali etching before anodic oxidation, were studied to microstructures and surface morphologies. A roughness on surface of anodizing film had to be decreased for amorphous phase by anodic oxidation. A roughness on surface of anodizing film decrease as annealing temperature increased in chemical polishing.

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전기분해 이온수를 이용한 세정기술 개발 (Development of new cleaning technology using ionized water by electrolysis)

  • 변문기;백희원;조봉희;김영호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 추계학술대회 논문집
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    • pp.617-620
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    • 1999
  • To reduce the consumption of chemicals and ultra pure water(UPW) in cleaning process used in device manufacturing, we proposed wet processes that use electrolytic ionized water(EIW), which is generated by electrolysis of a diluted electrolyte solution or UPW and systemically investicate the EIW\`s characteristics. EIW\`s pH values are increased in cathode chamber and decreased in anode chamber according to the electrolysis time and its varied ratio is reduced with time increasement. The variation of pH and ORP is increased accordin to the applied voltage until critical voltage. But more than that voltage, the variation is decreased because of ion\`s scattering effect. When electrolyte is added, the effects of electrolysis is increased because electrolyte acts as catalyst. But when the density of electrolyte is increased more than critical value, ion\`s flowage is obstructed and the effects of electrolysis is decreased.

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Electrochemical Behavior of Tm ion and Bi ion in LiCl-KCl Molten Salt

  • Kim, Beom-Kyu;Han, Hwa Jeong;Park, Ji Hye;Kim, Won Ki;Park, Byung Gi
    • 한국방사성폐기물학회:학술대회논문집
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    • 한국방사성폐기물학회 2017년도 추계학술논문요약집
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    • pp.83-84
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    • 2017
  • This study, electrolytic behavior of Thulium and Tm-Bi ion system was studied. The electrochemical behavior of Tm was studied in $LiCl-KCl-TmCl_3$ molten salts using electrochemical techniques Cyclic Voltammetry on tungsten electrodes at 773K. During the process of CV and SWV, intermetallic compound were observed Bi-Tm. Further study, in order to determine clarity of diffusion coefficient in this experiment, we will compare result of electrochemistry method and we also need to quantitative research.

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분말 광촉매를 이용한 광전기화학 공정에서 Rhodamine B의 색 제거 (Color Removal of Rhodamine B by Photoelectrochemical Process using Powder TiO$_2$)

  • 김동석;박영식
    • 대한환경공학회지
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    • 제30권8호
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    • pp.823-830
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    • 2008
  • Rhodamine B(RhB) 탈색에 대한 광전기촉매 공정의 적용가능성을 분말 TiO$_2$를 충전한 슬러리 광전기촉매 반응기에서 연구하였다. 광전기촉매 공정의 반응기 시스템은 분말 TiO$_2$, Pt 전극 및 3개의 8 W UV-C 등으로 구성되어 있다. 전류, 전해질, 공기 유량 및 전극 재질과 같은 운전 인자의 영향을 고찰하였다. 광전기촉매 공정의 최적 광촉매 량과 전류는 각각 0.4 g/L과 0.02A이었다. 광촉매 공정과 전기분해 단독 공정에 의해 분해되는 RhB의 합보다 광전기촉매 공정에 의해 더 빨리 분해되었는데, 광촉매 공정과 전기분해 공정의 결합에 의한 시너지 효과를 나타내는 것으로 사료되었다. 광전기촉매 공정은 공기 유량에 의해 영향을 받는 것으로 나타났고 최적 공기 유량은 2 L/min이었다. RhB 탈색에 대한 전극 재질과 NaCl 효과는 본 실험범위에서는 크지 않은 것으로 나타났다.

전기방전가공 기술을 이용한 유리의 미세 가공 (Micromachining of a Pyrex Glass Using EDM Technique)

  • 정옥찬;양의혁;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 하계학술대회 논문집 C
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    • pp.1422-1424
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    • 1995
  • In this paper, a pyrex glass is machined using Electric Discharge Machining. In order to fabricate the desired shape, the process conditions are optimized appropriatley. This paper shows that the applied voltage and the concentration of electrolytic solution significantly affect the size and shape of the hole in the pyrex glass. As the applied voltage grows, the size of the hole increases but the shape is little affected.

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전해복합에 의한 미세절삭가공 특성연구 (A Study on the Characteristics of Compounding Electrolytic Machining in micro-cutting)

  • 손민기;손성민;안중환
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집C
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    • pp.502-506
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    • 2001
  • This paper presents a new method for cutting steel with a diamond tool using electrolysis. The electrolysis is adopted in the diamond cutting to prevent the high chemical activity between a diamond tool and an iron-based workpiece. The basic principle of the method is to oxdize a thin substrate of the workpiece by electrolysis ahead of the diamond tool which cuts the oxidized layer. A desired shape can be obtained by repeating this process. The cutting force is reduced because the diamond tool removes only the weakened material by electroysis. The reduction of the cutting force suppresses the excessive wear of the diamond tool. The oxidization penetrates several micrometers in depth along the previously formed shape. The corrosion rates depend on current density and make suggestions on the optimum cutting conditions.

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마이크로 공구를 이용한 미세 구멍 가공기술 (Micro-hole Machining Technology for using Micro-tool)

  • 허남환;이석우;최헌종
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1897-1901
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    • 2003
  • Recently, with the development of semiconductor technology the miniaturization of products as well as parts and the products with high precision are being required. In addition as a national competitive power is increasingly effected by micro part development through micro machining and the secure of micro machining technology, the study of micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tool under the size of 30$\mu\textrm{m}$ and machine micro holes through micro tool fabrication by grinding, the application of ELID to grinding wheel and the measurement of surface roughness for micro tool.

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마이크로 공구를 이용한 미세구멍가공기술 (Micro-hole Machining Technology for using Micro-tool)

  • 허남환;이석우;최헌종
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 추계학술대회
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    • pp.1787-1792
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    • 2003
  • Recently with the development of semiconductor technology, the miniaturization of parts and products as well as their high precision is required. In addition, as the national competitiveness is increasingly affected by the development of the micro parts through micro machining technology, the study of the micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tools under the size of $20{\mu}m$ and to machine micro holes using them. The fabrication is done by grinding and the application of ELID to the grinding wheel. The surface roughness of the micro tools is measured to evaluate the study.

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전해 Cu Via-Filling 도금에서 염소이온이 가속제와 억제제에 미치는 영향 (Effects of Chloride Ion on Accelerator and Inhibitor during the Electrolytic Cu Via-Filling Plating)

  • 유현철;조진기
    • 한국표면공학회지
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    • 제46권4호
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    • pp.158-161
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    • 2013
  • Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.