• Proceedings of the KIEE Conference
• /
• 1998.11c
• /
• pp.1007-1009
• /
• 1998

In this paper, the effects of the drive-in process parameters on the residual stress profile of the p+ silicon film has been investigated. All the residual stress profile has been estimated by the second-order polynomial. All the coefficients of the polynomial have been determined from the measurement of the deflections of cantilevers and a rotating beam by using a surface profiler meter and by means of focusing a calibrated microscope. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual stress decreases. If the boron concentration decreases the tensile residual stress decreases except near the surface where the magnitude of compressive residual stress increases.

• International Journal of Railway
• /
• v.8 no.1
• /
• pp.1-4
• /
• 2015

An accurate measurement of the train-track interaction forces is important for track performance evaluation. In the field calibration test as a wheel load measurement process, the calibration system creates a different boundary condition in comparison with that in the train wheel passage. This study aims to evaluate a reliability of the field calibration test in the process of wheel load measurement. Finite element models were developed to compare the deformed shapes, bending moment and shear force profiles on the rail section. The analysis results revealed that the deformed shapes and their associated bending moment profiles on the rail are significantly different in two numerical simulations of the calibration test and the train wheel load passage. However, the shear stress profile on the rail section of the strain gauge installation in the field was almost identical, which may imply that the current calibration test is sufficiently reliable.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.7 no.3
• /
• pp.41-46
• /
• 2008

Generally optical components are fabricated by grinding, lapping and polishing processes. Those processes take long time to obtain optical high surface quality. In the case of large optical components, the on-machine measurement is strongly recommended because the workpiece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm mechanism which can be used for on-machine measurement of a surface profile with a sensing probe end-effect, and also for grinding or lapping the surface with a corresponding tool. The measuring accuracy and uncertainty using a swing arm type profilometer have been studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $5{\mu}m$. Those inspection data are provided for correcting the residual figuring error in next processes.

• Proceedings of the KIEE Conference
• /
• 2002.11a
• /
• pp.245-247
• /
• 2002

The paper represents the effects of the drive-in process parameters on the residual stress profile of the p+ silicon film. For the quantitative determination of the residual stress profiles, the test samples are doped via the fixed boron diffusion process and four types of the thermal oxidation processes and consecutively etched by the improved process. The residual stress measurement structures with the different thickness are simultaneously fabricated on the same silicon wafer. Since the residual stress profile is not uniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All of the coefficients of the polynomial are determined from the deflections of cantilevers and the displacement of a rotating beam structure. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Also, near the surface of the p+ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.26 no.3
• /
• pp.537-543
• /
• 2002

This paper examines a new in-process measurement system for the measurement of micro-defects on the surfaces of brittle materials by using the AFM (Atomic Force Microscopy). A new AFM scanning stage that can also perform nano-scale bending of the sample was developed by adding a bending unit to a commercially available AFM scanner. The bending unit consists of a PZT actuator and sample holder, and can perform static and cyclic three-point bending. The true bending displacement of the bending unit is approximately 1.8mm when 80 volts are applied to the PZT actuator. The frequency response of the bending unit and the stress on the sample were also analyzed, both theoretically and experimentally. Potential surface defects of the sample were successfully detected by this measurement system. It was confirmed that the number of micro-defects on a scratched surface increases when the surface is subjected to a cyclic bending load.

• 제어로봇시스템학회:학술대회논문집
• /
• 2002.10a
• /
• pp.46.5-46
• /
• 2002

As device dimension shrinks down to sub 100nm, it is increasingly important to monitor plasma states. Plasma etching is a key means to fine patterning of thin films. Many parameters are involved in etching and each parameter has different impact on process performances, including etch rate and profile. The uniformity of etch responses should be maintained high to improve device yield and throughput. The uniformity can be measured on any etch response. The most difficulty arises when attempting to characterize etched profile. Conventionally, the profile has been estimated by measuring the slope or angle of etched pattern. One critical drawback in this measurement is that this is unable to cap...

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.16 no.2
• /
• pp.267-280
• /
• 1992

This paper describes a numerical analysis of the light scattering patterns of roughness profiles. This analysis was based upon the light scattering theory developed by Beckmann. In the analysis, the roughness profile was regarded as a profile whose irregularities depend on the production process and the shape of cutting tool. Generally, waviness of an actual surface seriously distorts the scattered pattern of roughness profile. In order to avoid the effects of waviness of actual surfaces, several theoretically calculated scattering patterns, instead of actual scattering patterns, were used to analyze the scattering patterns of typical engineering roughness profiles. The characteristics of the light scattering patterns for five model surfaces were studied.

• Korean Journal of Materials Research
• /
• v.22 no.9
• /
• pp.482-488
• /
• 2012

To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.40 no.2
• /
• pp.145-149
• /
• 2017

One of the challenges facing precision manufacturers is the increasing feature complexity of tight tolerance parts. All engineering drawings must account for the size, form, orientation, and location of all features to ensure manufacturability, measurability, and design intent. Geometric controls per ASME Y14.5 are typically applied to specify dimensional tolerances on engineering drawings and define size, form, orientation, and location of features. Many engineering drawings lack the necessary geometric dimensioning and tolerancing to allow for timely and accurate inspection and verification. Plus-minus tolerancing is typically ambiguous and requires extra time by engineering, programming, machining, and inspection functions to debate and agree on a single conclusion. Complex geometry can result in long inspection and verification times and put even the most sophisticated measurement equipment and processes to the test. In addition, design, manufacturing and quality engineers are often frustrated by communication errors over these features. However, an approach called profile tolerancing offers optimal definition of design intent by explicitly defining uniform boundaries around the physical geometry. It is an efficient and effective method for measurement and quality control. There are several advantages for product designers who use position and profile tolerancing instead of linear dimensioning. When design intent is conveyed unambiguously, manufacturers don't have to field multiple question from suppliers as they design and build a process for manufacturing and inspection. Profile tolerancing, when it is applied correctly, provides manufacturing and inspection functions with unambiguously defined tolerancing. Those data are manufacturable and measurable. Customers can see cost and lead time reductions with parts that consistently meet the design intent. Components can function properly-eliminating costly rework, redesign, and missed market opportunities. However a supplier that is poised to embrace profile tolerancing will no doubt run into resistance from those who would prefer the way things have always been done. It is not just internal naysayers, but also suppliers that might fight the change. In addition, the investment for suppliers can be steep in terms of training, equipment, and software.

• Journal of the Korean Society for Precision Engineering
• /
• v.12 no.6
• /
• pp.72-79
• /
• 1995

The purpose of this paper is to develop an automatic measuring system based on the digital image processing which can be applied to the in-process measurment of the characteristics of the thin thickness. The derivative operators is used for edge detection in gray level image. This concept can be easily illustrated with the aid of object shows an image of a simple light object on a dark background, the gray level profile along a horizontal scan line of the image, and the first and second derivatives of the profile. The first derivative of an edge modeled in this manner is 0 in all regions of constant gray level, and assumes a constant value during a gray level transition. The experimental results indicate that the developed automatic inspection system can be applied in real situation.