Browse > Article
http://dx.doi.org/10.3795/KSME-A.2002.26.3.537

Development of an AFM-Based System for Nano In-Process Measurement of Defects on Machined Surfaces  

Gwon, Hyeon-Gyu (Dept.of Machanical Engineering, Kumoh National Institute of Technology)
Choe, Seong-Dae (Dept.of Machanical Engineering, Kumoh National Institute of Technology)
Park, Mu-Hun (Dept.of Electronics Engineering, Changwon National University)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.26, no.3, 2002 , pp. 537-543 More about this Journal
Abstract
This paper examines a new in-process measurement system for the measurement of micro-defects on the surfaces of brittle materials by using the AFM (Atomic Force Microscopy). A new AFM scanning stage that can also perform nano-scale bending of the sample was developed by adding a bending unit to a commercially available AFM scanner. The bending unit consists of a PZT actuator and sample holder, and can perform static and cyclic three-point bending. The true bending displacement of the bending unit is approximately 1.8mm when 80 volts are applied to the PZT actuator. The frequency response of the bending unit and the stress on the sample were also analyzed, both theoretically and experimentally. Potential surface defects of the sample were successfully detected by this measurement system. It was confirmed that the number of micro-defects on a scratched surface increases when the surface is subjected to a cyclic bending load.
Keywords
Atomic Force Microscopy; Deflect; Bending; In-Process Measurement; Profile Measurement;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Joe, A. and Ikeda, I. 'Aprecise Measurement of Deflection Occurred by Repeat Loading for Brittle Materials,' J. Japan Soc. Prec. Eng.,Vol. 59, No. 7, pp. 1085-1090
2 Groot, P.D. and Deck, L., 1995, 'Surface Profiling by Analysis of White-light Interferograms in the Spatial Frequency Domain,' J. Modern Optics, Vol. 42, No.2, pp. 389-401   DOI   ScienceOn
3 Satoru Takahasi, 1996, 'Study on Nano-Inprocess Measurement of Silicon Wafer Surface Defects by Laser Scattered Pattern,' Proc, of ISMI'2, JAPAN, pp. 243-250
4 Matsuoka, S., 1996, 'On the Current State of Observation and Evaluation of Metal and Ceramics Samples by STM/AFM,' Optical and Electro-Optical Engineering Contact, (in Japaness), Vol. 35, No.5, p. 227
5 米永一郞, 1998, 'シリコソの强度,' Materia Japan, Vol. 37, No. 12, pp. 1018-1025   DOI
6 Page, Trevor F., 1992, 'The Deformation Behavior of Ceramic Crystals Subjected to Very Low (nano)Indentation,' J. Mater. Res., Vol. 7, No.2, pp. 450-471   DOI
7 高野, 增田, 1991, 鐵と鋼, (in Japanese), 77-2, p. 298
8 Hasegawa, T., Hosaka, S. and Hosoki, S., 1992, 'In Situ Observation of Gold Adsorption onto SI(111) Surface by Scanning Tunneling Microscopy,' Jpn. J. Appl. Phys, Vol. 31, pp. L1492-1494   DOI
9 Kalnas, C.E., Mansfield, J.F., Was, G.S. and Jones, J.W., 1994, 'In Situ Bend Fixture for Deformation and Fracture Studies in the Environmental Scanning Electron Microscope,' J. Vac. Sci. Technol. A, Vol. 12, No.3, pp. 883-885   DOI   ScienceOn
10 Rozlosnik, N., Bohus, L.S., Birattari, C. and Gadioli, E., 1994, 'Direct Observation of Latent Nuclear Tracks in Organic Material by Atomic Force Microscopy,' Nanotechnology, Vol. 8, pp. 32-34   DOI   ScienceOn
11 Kweon, H.K., Kuriyagawa, T. and Kiyono, S., 'Basic Study of Micromechanical Processing,' Proc. of ICPE'96, CHINA, pp. 211-214
12 Timoshenko, Stephen P. and Young, D.H., 'Element of strength of materials,' Maruzen Asian Edition, p. 197