• JSTS:Journal of Semiconductor Technology and Science
• /
• 제11권1호
• /
• pp.1-5
• /
• 2011

To enter next process control, numerous approaches, including run-to-run (R2R) process control and fault detection and classification (FDC) have been suggested in semiconductor manufacturing industry as a facilitation of advanced process control. This paper introduces a novel type of optical plasma process monitoring system, called plasma eyes chromatic system (PECSTM) and presents its potential for the purpose of fault detection. Qualitatively comparison of optically acquired signal levels vs. process parameter modifications are successfully demonstrated, and we expect that PECSTM signal can be a useful indication of onset of process change in real-time for advanced process control (APC).

• Journal of information and communication convergence engineering
• /
• 제9권4호
• /
• pp.379-384
• /
• 2011

The scope of the problems that could be solved by monitoring and the improvement of the recognition time is directly correlated to the performance of the management function of the business process. However, the current monitoring process of business activities decides whether to apply warnings or not by assuming a fixed environment and showing expressions based on the design rules. Also, warnings are applied by carrying out the measuring process when the event attribute values are inserted at every point. Therefore, there is a limit for distinguishing the range of occurrence and the level of severity in regard to the new external problems occurring in a complicated environment. Such problems cannot be ed. Also, since it is difficult to expand the range of problems which can be possibly evaluated, it is impossible to evaluate any unexpected situation which could occur in the execution period. In this paper, a process-evaluating model based on the goal scenario is suggested to provide constant services through the current monitoring process in regard to the service demands of the new scenario which occurs outside. The new demands based on the outside situation are analyzed according to the goal scenario for the process activities. Also, by using the meta-heuristic algorithm, a similar process model is found and identified by combining similarity and interrelationship. The process can be stopped in advance or adjusted to the wanted direction.

• 반도체디스플레이기술학회지
• /
• 제19권2호
• /
• pp.16-21
• /
• 2020

How accurately reproducible energy is delivered to the wafer in the process of making thin films using PE-CVD (Plasma enhanced chemical vapor deposition) during the semiconductor process. This is the most important technique, and most of the reaction on the wafer surface is made by thermal energy. In this study, we studied the method of monitoring the change of thermal energy transferred to the wafer surface by monitoring the temperature change according to the change of the thin film formed on the showerhead facing the wafer. Through this research, we could confirm the monitoring of wafer thin-film which is changed due to abnormal operation and accumulation of equipment, and we can expect improvement of semiconductor quality and yield through process reproducibility and equipment status by real-time monitoring of problem of deposition process equipment performance.

• Korean Chemical Engineering Research
• /
• 제46권2호
• /
• pp.233-247
• /
• 2008

공정 모니터링 기술은 공정 내에서 일어나는 예상치 못한 조업변화 및 이상을 조기에 감지하고 조업 이상에 영향을 끼친 근본 원인을 밝혀내어 제거해 줌으로써 공정의 안정적인 조업과 양질의 제품생산의 기반을 제공하여 준다. 데이터에 기반한 통계적 공정 모니터링 방법은 양질의 공정 데이터만 주어진다면 통계적 처리를 접목하여 비교적 쉽게 모니터링을 할 수 있고 공정의 데이터 분석에 이용할 수 있는 도구를 얻을 수 있다는 장점이 있다. 그러나 실제 공정에서는 비선형성, non-Gaussianity, 다중 운전모드, 공정상태변화로 인해 기존의 다변량 통계적 방법을 이용한 공정 모니터링 기법은 비효율적이거나, 공정 감시 성능의 저하, 종종 신뢰할 수 없는 결과를 야기한다. 이러한 경우 기존의 방법으로는 더이상 공정을 정확히 감시할 수 없기 때문에 최근에 많은 새로운 방법들이 개발 되었다. 본 총설에서는 이러한 단점을 보안하기 위해 최근 주목할 만한 연구결과인 공정 비선형성을 고려한 커널주성분분석(kernel principle component analysis) 모니터링 기법, 주성분분석 모델 조합을 이용한 다중모델(mixture model) 모니터링 기법, 공정 변화를 고려한 적응모델(adaptive model) 모니터링 기법, 그리고 센서 이상진단과 보정의 이론과 응용결과에 대하여 소개한다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1996년도 추계학술대회 논문집
• /
• pp.474-478
• /
• 1996

Process monitoring in laser welding is essential for automation and quality control of products. Various signals from laser welding, such as plasma, sound, optical signals, etc., are utilized for monitoring the process and detecting abnormal weld conditions. In this study, both W light from plasma formed above the weld pool and IR signal from the melting pool are detected with photodiodes and PC-based A/D board, and analyzed to give a guidance about the weld quality. Experimental results show the possibility of using the signals for predicting and evaluating the weld qualify and adapting into the system for on-line process monitoring.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1997년도 춘계학술대회 논문집
• /
• pp.230-235
• /
• 1997

During laser welding, a laser induced matal vapour and plasuma is formed. The plasma shows strong fluctuation combined with acoustic sound emission. On-line monitoring of the process is possible by measuring and analysing the plasma and acoustic sound emission. This paper introduce the method of on line process monitoring in the laser beam welding and analysis being monitoring signal. The results show the complementary information on the process.

• 산업경영시스템학회지
• /
• 제17권32호
• /
• pp.145-154
• /
• 1994

In this paper, monitoring processor in a circuit switched network is considered. Monitoring processor monitors communication links, and offers a grade of service in each link to controller. Such an information is useful for an effective maintenance of system. Two links with nonsymmetric system Parameters are considered. each link is assumed independent M/M/1/1 type. The Markov process is introduced to compute busy and idle portions of monitoring processor and monitored rate of each link. Inter-idle times and inter-monitoring times of monitoring processor between two links are respectively computed. A recursive formula is introduced to make computational procedure rigorous.

• 소성∙가공
• /
• 제31권1호
• /
• pp.5-10
• /
• 2022

In multi-stage cold forging process, to enhance the productivity and product quality, in-site process monitoring technique by implanting sensors such as piezo-sensor and acoustic emission sensor has been continuously studied. For accurate analysis of the process, the selection of appropriate sensors and implantation positions are very important. Until now, in a multi-state forging machine, wedge parts located at the end of punch-set are used but it is difficult to analyze minute changes in die block-set. In this study, we also implanted sensors to the die part (die spacer) and compared signals from both sensors and found that sensing signals from die part showed enhanced process monitoring results.

• 제어로봇시스템학회논문지
• /
• 제9권12호
• /
• pp.1048-1054
• /
• 2003

In laser surface hardening processes, the geometrical parameters such as the depth and the width of a hardened layer can be utilized to assess the hardened layer quality. However, accurate monitoring of the geometrical parameters for on-line process control as well as for on-line quality evaluation is very difficult because the hardened layer is formed beneath a material surface and is not visible. Therefore, temperature monitoring of a point of specimen surface has most frequently been used as a process monitoring method. But, a hardened layer depends on the temperature distribution and the thermal history of a specimen during laser surface hardening processing. So, this paper describes the estimation results of the geometric parameters using multi-point surface temperature monitoring. A series of hardening experiments were performed to find the relationships between the geometric parameters and the measured temperature. Estimation results using a neural network show the enhanced effectiveness of multi-point surface temperature monitoring compared to one-point monitoring.

• Journal of Chest Surgery
• /
• 제51권4호
• /
• pp.231-240
• /
• 2018

Background: Analyses of the efficacy and safety of transcatheter aortic valve replacement (TAVR) in most countries have been based on outcomes obtained in accordance with national practice guidelines and monitoring protocols. The purpose of this study is to share our experience regarding the process for establishing guidelines and monitoring protocols for the use of TAVR in Korea, in the hopes that it may be helpful to others undergoing a similar process in their own country. Methods: The Korean guidelines for TAVR were established on June 1, 2015 in through a tri-party agreement involving the Department of Health and Welfare, the Korean Society of Thoracic and Cardiovascular Surgery and the Korean Society of Cardiology. We agreed to monitor the guidelines transparently and to exchange opinions regarding amendments or continuation of its contents after 3 years of monitoring. Results: The monitoring meetings were not held as regularly as agreed, and monitoring was also made difficult by insufficient and incomplete data. Nevertheless, during the meetings, measures to improve the monitoring process were discussed, and accordingly, an agreement was made to continue the monitoring process, with the aim of completing data collection by 2018. Conclusion: Compliance with guidelines is critical for assessing the efficacy and safety of TAVR. Moreover, the TAVR monitoring process must be properly conducted for an accurate evaluation to be made. Any country planning to introduce TAVR may encounter difficulties with regards to the optimal initiation strategy and subsequent monitoring. Nevertheless, continued efforts should be made to persuade the government and the corresponding medical societies to facilitate the optimal application of TAVR.